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Infineon Technologies S29GL128S10TFIV13
- Part No.:
- S29GL128S10TFIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL128S10TFIV13.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,081
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Product details
Overview
S29GL128S10TFIV13 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte programming buffer-enabling fast embedded code storage and firmware updates in microcontroller boot loaders.
For engineers reviewing the S29GL128S10TFIV13 datasheet, S29GL128S10TFIV13 pinout, S29GL128S10TFIV13 application, or S29GL128S10TFIV13 equivalent, key selection criteria include its asynchronous 16-bit parallel interface, Versatile I/O support (1.65 V to VCC), OTP array with dual lockable regions, CFI compliance, and AEC-Q100 Grade 3 qualification for automotive control modules.
Technical Context
This device implements an asynchronous parallel flash architecture with dedicated X/Y decoders, on-die erase/program voltage generators, and state-controlled command execution. Its embedded algorithm controller (EAC) manages sector erase, buffer programming, suspend/resume, and automatic ECC generation during write operations.
The memory array is organized into uniform 128-kbyte sectors with independent protection via Advanced Sector Protection (ASP), supporting both volatile and non-volatile locking. The 1024-byte OTP array includes two separately lockable regions for secure boot code or calibration data storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB); supports full firmware image storage for mid-tier microcontrollers |
| Interface type | Asynchronous parallel ×16; enables direct connection to ARM Cortex-M7/M4 or RISC-V SoC address/data buses |
| Random access time | 90 ns at VCC = VIO; meets real-time boot latency requirements for industrial PLCs |
| Page access time | 15 ns; allows rapid sequential reads within 32-byte aligned pages for instruction fetch acceleration |
| Programming buffer | 512 bytes; reduces effective programming time by up to 4× vs. single-word writes |
| ECC capability | On-die hardware single-bit error correction; eliminates need for external ECC logic in safety-critical systems |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention at 85°C - validated for automotive ECU lifetime use |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 20.0 mm × 10.16 mm, standard JEDEC MO-142AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit word address bus; A22 is MSB for 128 Mb (2²³ × 16-bit words) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports Versatile I/O (VIO = 1.65 V to VCC) |
| CE# | Chip enable | Active-low device select; controls power-down entry when deasserted |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state |
| WE# | Write enable | Active-low write strobe; initiates command latching or data programming |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; low during embedded erase/program operations |
| RESET# | Hardware reset | Active-low asynchronous reset; clears command register and aborts ongoing operations |
| WP# | Write protect | Active-low hardware sector protection override; disables program/erase when asserted |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse process | Enables higher density and lower active current (60 mA @ 5 MHz) vs. legacy 90 nm flash |
| Uniform 128-kbyte sectors | Allows precise firmware partitioning (e.g., bootloader + app + config) without partial-sector constraints |
| Suspend/resume for program & erase | Permits high-priority interrupt service during long-duration flash operations without data corruption |
| Common Flash Interface (CFI) | Enables runtime detection of geometry, timing, and command set - critical for OS-level flash drivers |
| Separate 1024-byte OTP array | Provides tamper-resistant storage for cryptographic keys or factory calibration data with dual-lock security |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps and diagnostic firmware in AEC-Q100 Grade 3 qualified ECUs. IC Role / Device Role / Timing Role: Non-volatile boot memory executing XIP code with ≤90 ns access latency. Use Value: Meets ASIL-B functional safety requirements via on-die ECC and 100K-cycle endurance over 15-year vehicle life. |
Use Scenario: Holding ladder logic programs and configuration data in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Parallel firmware storage interfaced directly to Cortex-M7 MCU's external memory bus. Use Value: 512-byte buffer programming cuts firmware update time by 75% vs. legacy parallel flash devices. |
| Medical Imaging Boot Loader | Telecom Base Station Configuration |
Use Scenario: Secure boot loader storage for FDA-cleared ultrasound and MRI subsystems requiring data integrity certification. IC Role / Device Role / Timing Role: OTP-protected primary boot image with hardware write-protection and ECC validation. Use Value: Dual-lock OTP regions prevent unauthorized modification of boot code while enabling field-upgradable calibration tables. |
Use Scenario: Storing FPGA bitstreams and radio parameter sets in LTE/5G remote radio units operating at –40°C to +85°C. IC Role / Device Role / Timing Role: High-reliability configuration memory with sector-level protection against RF-induced corruption. Use Value: Advanced Sector Protection (ASP) allows independent locking of FPGA config vs. calibration sectors during live network operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S10TFIV20 | Same die, 20 ns page access time (vs. 15 ns); identical pinout and command set | Lower performance tier suitable for cost-sensitive industrial HMI where sub-20 ns page speed is acceptable | Select when 15 ns page access is not required and BOM cost reduction is prioritized |
| MX29GL128FPTI-90G | Macronix 128 Mb parallel NOR; 90 ns random access but no on-die ECC or OTP array | Lacks hardware ECC and secure OTP - requires external error handling and separate key storage | Choose only if system already implements software ECC and external secure element for key management |
Compared with S29GL128S10TFIV13, the IV20 variant trades 5 ns page speed for lower test cost, while the MX29GL128F lacks integrated ECC and OTP-increasing design complexity and security risk in safety-critical deployments.
Availability
S29GL128S10TFIV13 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, medical imaging boot loaders, and telecom base station configuration requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL128S10TFIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.
The GL-S family targets high-reliability embedded systems needing XIP-capable flash with automotive-grade robustness, combining fast random access, integrated ECC, and flexible I/O voltage for mixed-signal SoC integration.
FAQ
Does S29GL128S10TFIV13 support execute-in-place (XIP) operation?
Yes. The device supports true XIP operation with ≤90 ns random access time and page-mode reads, allowing CPU instruction fetch directly from flash without copying to RAM. Its asynchronous parallel interface and fast initial access meet real-time deterministic timing requirements for Cortex-M and RISC-V cores.
What is the function of the STB pin on S29GL128S10TFIV13?
The STB (Strobe) pin is not present on S29GL128S10TFIV13. This pin appears only on earlier S29GL-S series variants (e.g., S29GL01GS) and was removed in the GL-S generation. Pin count and signal mapping follow the 56-pin TSOP layout defined in datasheet section 12.1, with no STB terminal.
Can the OTP array be reprogrammed after locking?
No. Once either of the two OTP lock bits is set via the CFI command sequence, that 512-byte region becomes permanently read-only. The lock is irreversible and enforced by on-die fuses. Unlocking is not supported - design must verify OTP content before final lock issuance.
Is S29GL128S10TFIV13 compatible with 1.8 V I/O interfaces?
Yes, under Versatile I/O mode. With VIO supplied at 1.65 V to 3.6 V (independent of VCC), the device accepts 1.8 V logic levels on DQ0–DQ15, CE#, OE#, WE#, and RY/BY#. VCC must remain within 2.7–3.6 V, but I/O signaling is fully compatible with 1.8 V SoCs.
S29GL128S10TFIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL128S10TFIV13 FAQ
1.How can I place an order for S29GL128S10TFIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10TFIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10TFIV13 reliable?
The price and inventory of S29GL128S10TFIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10TFIV13 is usually 5 days.
3.What payment methods are accepted for S29GL128S10TFIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10TFIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10TFIV13?
S29GL128S10TFIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10TFIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10TFIV13?
For technical support, including S29GL128S10TFIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10TFIV13 requirements.
6.How does Aetrix verify that S29GL128S10TFIV13 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10TFIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10TFIV13 meets industry standards.
7.What is the process for return or replacement of S29GL128S10TFIV13?
All S29GL128S10TFIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10TFIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10TFIV13 part is unused and in its original packaging.
Return procedure for S29GL128S10TFIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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