Infineon Technologies S29GL128S10TFIV20
- Part No.:
- S29GL128S10TFIV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL128S10TFIV20.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:810
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL128S10TFIV20 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sectors, and a 512-byte programming buffer-used in boot code storage and firmware update in embedded microcontroller systems.
For engineers reviewing the S29GL128S10TFIV20 datasheet, S29GL128S10TFIV20 pinout, S29GL128S10TFIV20 application, or S29GL128S10TFIV20 equivalent, key selection criteria include asynchronous parallel interface timing, Versatile I/O voltage range (1.65 V to VCC), sector erase granularity, OTP array availability, and AEC-Q100 compatibility options.
Technical Context
This device implements an asynchronous parallel flash architecture with XIP-capable read performance: initial random access reads a full 32-byte aligned page, followed by 15 ns sub-page accesses within the same page using low-order address bits. The embedded algorithm controller (EAC) manages program/erase operations with suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
It supports dual-voltage operation: 2.7–3.6 V core supply (VCC) and independent I/O supply (VIO) from 1.65 V to VCC, enabling interoperability with mixed-voltage SoCs. Sector protection includes volatile (lock bits) and non-volatile (ASP) methods, plus a dedicated 1024-byte OTP array with two lockable regions for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words |
| Random access time | 90 ns at VCC = VIO; enables fast instruction fetch in XIP boot scenarios |
| Page access time | 15 ns; allows rapid sequential reads within 32-byte aligned pages |
| Programming buffer | 512 bytes; reduces effective programming time vs. byte-by-byte writes |
| ECC support | On-die hardware single-bit error correction; no external ECC logic required |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention at 85°C |
| Operating temperature | Industrial grade: –40°C to +85°C; supports extended ambient environments |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 400 mil width, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit word address bus; A22 is MSB for 128 Mb (2^23 = 8,388,608 words) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports ×16 mode only (no ×8 fallback) |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low control for data bus output drivers during read operations |
| WE# | Write enable | Active-low strobe for write cycles; used with CE# and OE# to define bus transaction type |
| RY/BY# | Ready/Busy indicator | Open-drain output; low during embedded program/erase, high when ready |
| VCC | Core supply | 2.7–3.6 V supply for logic and memory array; powers internal charge pumps |
| VIO | I/O supply | 1.65–VCC supply for interface buffers; decouples I/O voltage from core |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors |
| Hardware ECC engine | Single-bit error correction performed on-chip during read; eliminates need for external ECC handling |
| 512-byte programming buffer | Allows up to 256 words per buffer write, improving effective programming throughput to 1.5 MBps |
| Uniform 128-kbyte sectors | 128 identical sectors simplify firmware partitioning and field update management |
| Dedicated 1024-byte OTP array | Two independently lockable regions store immutable keys, calibration data, or security credentials |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader, real-time OS kernel, and GUI assets in digital dashboard systems. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability and AEC-Q100 Grade 3 qualification. Use Value: 90 ns random access ensures deterministic boot timing; hardware ECC maintains integrity over 15+ year vehicle life. | Use Scenario: Holding firmware images and configuration tables in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: High-reliability parallel flash for field-upgradable firmware with sector-level erase isolation. Use Value: 100,000 erase cycles and 20-year retention meet industrial lifecycle requirements; OTP stores calibration constants. |
| Medical Diagnostic Imaging Boot | Avionics Data Recorder |
Use Scenario: Secure boot image storage in MRI or CT scanner mainboards where firmware corruption is unacceptable. IC Role / Device Role / Timing Role: Primary boot memory with hardware ECC and sector protection for safety-critical startup sequence. Use Value: On-die ECC prevents silent data corruption; ASP enables selective locking of boot sector against accidental overwrite. | Use Scenario: Logging flight parameters and system health data in black box recorders requiring long-term data integrity. IC Role / Device Role / Timing Role: High-endurance non-volatile storage with 128-kbyte sector granularity for cyclic overwrite buffers. Use Value: 100,000 program/erase cycles support >10,000 flight-hour logging; industrial temperature range ensures operation at altitude. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S10TFI020 | Same die, but TSOP package with different marking; lacks automotive qualification (no AEC-Q100) | Not suitable for automotive safety-critical use; identical timing and feature set otherwise | Select for cost-sensitive industrial designs without automotive compliance needs |
| MX29GL128FPTI-90G | Macronix part; 90 ns access, but no integrated hardware ECC or OTP array | Requires external ECC logic; lacks secure OTP region for key storage | Choose when lower unit cost outweighs ECC and security features |
Compared with S29GL128S10TFIV20, the S29GL128S10TFI020 omits AEC-Q100 validation but matches all electrical specs, while MX29GL128FPTI-90G trades on-die ECC and OTP for lower price-requiring external error handling and reduced security capability.
Availability
S29GL128S10TFIV20 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical diagnostic imaging boot, and avionics data recorders requiring stable component supply across extended product lifecycles.
Supply support for S29GL128S10TFIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.
The GL-S family targets high-reliability embedded systems needing XIP-capable parallel flash with enhanced endurance, ECC, and security features-designed specifically for automotive, industrial, and medical applications demanding long-term data integrity.
FAQ
Does S29GL128S10TFIV20 support both 3.3 V and 1.8 V I/O interfaces?
Yes. Its Versatile I/O feature allows VIO to operate from 1.65 V to VCC, so it supports 1.8 V I/O when VCC = 3.3 V and VIO = 1.8 V. This enables direct connection to 1.8 V FPGAs or microcontrollers without level shifters, while maintaining full 90 ns random access timing under those conditions.
Can the OTP array be reprogrammed after locking?
No. Once either of the two OTP lock bits is set, that 512-byte region becomes permanently read-only. The lock bits themselves are one-time programmable fuses; they cannot be reset or cleared. This ensures cryptographic keys or calibration data remain tamper-proof throughout the device's lifetime.
What is the minimum sector erase size, and can partial sectors be erased?
The device has uniform 128-kbyte sectors-there are no smaller erasable units. Partial sector erasure is not supported; erase commands always target entire 128-kbyte blocks. This simplifies firmware update logic but requires careful partitioning of code and data to avoid unnecessary erases during field updates.
How does hardware ECC interact with the status register during read operations?
Hardware ECC operates transparently during read: if a single-bit error is detected, it is corrected before data appears on DQ[15:0], and the ECC Status bit (bit 6) in the status register is set. No software intervention is needed for correction, but reading the status register after critical reads confirms whether correction occurred-enabling diagnostics without interrupting execution.
S29GL128S10TFIV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL128S10TFIV20 FAQ
1.How can I place an order for S29GL128S10TFIV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10TFIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10TFIV20 reliable?
The price and inventory of S29GL128S10TFIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10TFIV20 is usually 5 days.
3.What payment methods are accepted for S29GL128S10TFIV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10TFIV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10TFIV20?
S29GL128S10TFIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10TFIV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10TFIV20?
For technical support, including S29GL128S10TFIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10TFIV20 requirements.
6.How does Aetrix verify that S29GL128S10TFIV20 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10TFIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10TFIV20 meets industry standards.
7.What is the process for return or replacement of S29GL128S10TFIV20?
All S29GL128S10TFIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10TFIV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10TFIV20 part is unused and in its original packaging.
Return procedure for S29GL128S10TFIV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S10TFIV20 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

