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Infineon Technologies S29GL128S10TFIV23
- Part No.:
- S29GL128S10TFIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL128S10TFIV23.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,390
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Product details
Overview
S29GL128S10TFIV23 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte write buffer-enabling fast embedded code storage and firmware updates in microcontroller boot loaders.
For engineers reviewing the S29GL128S10TFIV23 datasheet, S29GL128S10TFIV23 pinout, S29GL128S10TFIV23 application, or S29GL128S10TFIV23 equivalent, key selection criteria include asynchronous parallel interface timing compliance, Versatile I/O voltage support (1.65 V to VCC), OTP array availability, AEC-Q100 grade compatibility, and sector protection configuration via ASP.
Technical Context
This device implements an asynchronous parallel flash architecture with dedicated X/Y decoders, on-die erase/program voltage generators, and state-controlled command execution. It supports CFI-compliant identification, status register polling, RY/BY# signaling, and suspend/resume for program/erase operations.
The embedded algorithm controller (EAC) manages all internal programming and erase sequences-including automatic ECC generation and verification-and enforces command-set locking to prevent accidental writes. Sector protection uses both volatile (SR bits) and non-volatile (lock bits) methods per 128-kbyte sector.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mb (16 MB); supports full firmware image storage for mid-tier MCUs |
| Interface Type | Asynchronous parallel ×16 bus; enables direct XIP execution without external controller |
| Random Access Time | 90 ns at VCC = VIO; meets real-time boot latency requirements for industrial controllers |
| Page Access Time | 15 ns; accelerates sequential instruction fetch within 32-byte aligned pages |
| Erase Cycle Endurance | 100,000 cycles per sector; supports field firmware update over 10+ years of operation |
| Data Retention | 20 years at +85°C; ensures long-term reliability in unpowered storage scenarios |
| Operating Voltage | VCC = 2.7 V to 3.6 V; compatible with modern low-voltage power rails and brown-out detection |
| I/O Voltage Range | VIO = 1.65 V to VCC; allows interfacing with mixed-voltage SoCs and FPGAs |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), JEDEC standard footprint with 0.5 mm pitch and exposed pad for thermal management.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit word address bus; A22 is MSB for 128 Mb (2²³ × 16-bit = 16 MB) |
| DQ0–DQ15 | Data I/O lines | Bi-directional ×16 data bus; supports byte/word writes and CFI query responses |
| CE# | Chip enable | Active-low chip select; controls device activation during memory-mapped read/write cycles |
| OE# | Output enable | Active-low output gate; enables data drivers only during valid read windows |
| WE# | Write enable | Active-low write strobe; initiates command latching or data programming sequence |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; asserts low during erase/program to block host access |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known state and aborts ongoing operations |
| WP# | Write protect | Hardware sector lock override; disables program/erase when asserted low |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | Single-bit error correction with automatic detection and transparent recovery during read |
| 512-byte write buffer | Reduces effective programming time by up to 4× vs. single-word writes; supports burst firmware patching |
| Uniform 128-kbyte sectors | Enables deterministic erase scheduling and wear leveling across 128 independent blocks |
| Separate 1024-byte OTP array | Provides secure storage for keys, calibration data, or device-specific identifiers with dual lock regions |
| Advanced sector protection (ASP) | Combines volatile (SR-based) and non-volatile (lock-bit) protection for flexible field reconfiguration |
| CFI parameter table | Standardized JEDEC-compliant interface for automatic driver initialization and vendor-agnostic firmware support |
Applications
| Industrial PLC Firmware Storage | Automotive ECU Boot Memory |
|---|---|
Use Scenario: Storing boot code and safety-critical firmware in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory mapped directly to MCU address space with <90 ns access. Use Value: Enables deterministic cold-start execution and supports field firmware updates via sector erase without system downtime. | Use Scenario: Holding bootloader and ASW images in automotive ECUs requiring AEC-Q100 Grade 3 qualification. IC Role / Device Role / Timing Role: Primary flash memory with hardware ECC and OTP for secure key storage in CAN/LIN gateway modules. Use Value: Meets ISO 26262 ASIL-B data integrity requirements through built-in ECC and sector-level write protection. |
| Medical Diagnostic Imaging Boot Loader | Telecom Base Station Configuration Storage |
Use Scenario: Hosting boot firmware and calibration tables in portable ultrasound and MRI subsystems with strict thermal and retention specs. IC Role / Device Role / Timing Role: High-reliability parallel flash with 20-year data retention at +85°C and 100k erase cycles. Use Value: Eliminates need for external ECC logic and extends service life beyond 10 years without firmware refresh. | Use Scenario: Storing FPGA configuration bitstreams and runtime parameters in 5G remote radio units deployed outdoors. IC Role / Device Role / Timing Role: Industrial-grade flash with Versatile I/O (1.65 V to 3.6 V) interfacing to multi-rail FPGA I/O banks. Use Value: Simplifies power domain design by eliminating level shifters between 1.8 V FPGA I/O and 3.0 V flash core. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P10TFIV20 | Same density and package but lacks hardware ECC and OTP array; uses older 90 nm process | No built-in error correction; requires external ECC or software mitigation for safety-critical use | Select only for cost-sensitive, non-safety applications where firmware integrity is managed externally |
| MX29GL128FDTI-90G | Micron part with identical 128 Mb ×16, 90 ns access, and TSOP-56; no Versatile I/O or ASP | Limited sector protection flexibility; no VIO range scaling below 2.7 V | Prefer when legacy board layout reuse is required and I/O voltage flexibility is not needed |
Compared with S29GL128P10TFIV20 and MX29GL128FDTI-90G, the S29GL128S10TFIV23 delivers superior data integrity via integrated ECC, broader voltage interoperability via Versatile I/O, and enhanced security through OTP and ASP-making it optimal for next-generation industrial and automotive designs demanding long-term reliability and functional safety.
Availability
S29GL128S10TFIV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, medical diagnostic imaging boot loaders, and telecom base station configuration storage requiring stable component supply across extended product lifecycles.
Supply support for S29GL128S10TFIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-reliability memory solutions with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.
The GL-S family targets embedded systems requiring robust, high-density parallel NOR flash with XIP capability, hardware ECC, and automotive-grade qualification-designed specifically for mission-critical boot and firmware storage in harsh environments.
FAQ
Does S29GL128S10TFIV23 support execute-in-place (XIP) operation?
Yes. The device supports true XIP operation due to its asynchronous parallel interface, 90 ns random access time, and page-mode read capability. Code can be fetched directly from flash without copying to RAM, reducing boot latency and SRAM usage in resource-constrained MCUs.
What is the function of the Versatile I/O (VIO) feature?
Versatile I/O allows independent voltage control of the I/O pins (1.65 V to VCC) while maintaining a fixed 3.0 V core supply. This enables direct interfacing with low-voltage FPGAs or SoCs without external level shifters, simplifying PCB design and improving signal integrity.
How does the 512-byte write buffer improve programming efficiency?
The write buffer accepts up to 512 bytes in a single command sequence and programs them internally in one operation. This reduces effective programming time by ~4× compared to single-word writes, enabling faster firmware updates and minimizing host CPU wait states during flash writes.
Is the OTP array truly one-time programmable?
Yes. The 1024-byte OTP region contains two independently lockable sectors. Once locked (via dedicated commands), those sectors become permanently read-only. This provides tamper-resistant storage for cryptographic keys, serial numbers, or calibration data that must survive field reprogramming.
S29GL128S10TFIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL128S10TFIV23 FAQ
1.How can I place an order for S29GL128S10TFIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10TFIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10TFIV23 reliable?
The price and inventory of S29GL128S10TFIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10TFIV23 is usually 5 days.
3.What payment methods are accepted for S29GL128S10TFIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10TFIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10TFIV23?
S29GL128S10TFIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10TFIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10TFIV23?
For technical support, including S29GL128S10TFIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10TFIV23 requirements.
6.How does Aetrix verify that S29GL128S10TFIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10TFIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10TFIV23 meets industry standards.
7.What is the process for return or replacement of S29GL128S10TFIV23?
All S29GL128S10TFIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10TFIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10TFIV23 part is unused and in its original packaging.
Return procedure for S29GL128S10TFIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S10TFIV23 Tags
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M24C02-WMN6TP
STMicroelectronics
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Microchip Technology
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Microchip Technology
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Microchip Technology
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STMicroelectronics
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Microchip Technology
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