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Infineon Technologies S29GL128S10TFV013

Part No.:
S29GL128S10TFV013
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
56-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixS29GL128S10TFV013.pdf
Description:
IC FLASH 128MBIT PARALLEL 56TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,659

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Product details

Overview

S29GL128S10TFV013 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sectors, and a 512-byte programming buffer - deployed in boot code storage for industrial HMIs and firmware update storage in network edge routers.

For engineers reviewing the S29GL128S10TFV013 datasheet, S29GL128S10TFV013 pinout, S29GL128S10TFV013 application, or S29GL128S10TFV013 equivalent, key selection criteria include asynchronous read timing, sector erase endurance (100,000 cycles), OTP array availability, Versatile I/O voltage range (1.65 V to VCC), and TSOP-56 package compatibility with legacy PCB layouts.

Technical Context

This device implements an embedded algorithm controller (EAC) that executes autonomous program/erase operations without host CPU intervention. Its architecture supports page-mode reads (32-byte aligned, 15 ns subsequent access) and buffer programming of up to 512 bytes per command, reducing effective write latency by >60% versus byte-wise programming.

Hardware ECC operates transparently during read cycles, correcting single-bit errors in real time using dedicated on-die logic; no firmware overhead or external syndrome calculation is required. Sector protection is configurable per 128-kbyte block via volatile (SR bits) or non-volatile (lock bits) methods, enabling secure bootloader partitioning.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density 128 Mb (16 MB), organized as 1,048,576 × 16-bit words - sufficient for full U-Boot + Linux kernel image storage in resource-constrained embedded systems.
Random access time (tACC) 90 ns at VCC = VIO - enables direct XIP execution from flash without SRAM caching bottlenecks in real-time control loops.
Page access time (tPACC) 15 ns - allows burst reads of instruction streams within same 32-byte page, improving cache line fill efficiency.
Programming buffer size 512 bytes - reduces host-side command overhead and minimizes bus arbitration latency during firmware updates.
Erase endurance 100,000 program/erase cycles per sector - supports field-upgradable firmware with daily patch cycles over 10+ years.
Data retention 20 years at +85°C - ensures long-term reliability in unattended industrial gateways without refresh mechanisms.
I/O voltage range (VIO) 1.65 V to VCC - permits interoperability with 1.8 V or 3.3 V logic families without level shifters in mixed-voltage SoC designs.

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP-I), 14 mm × 20 mm body, 0.5 mm pitch, JEDEC MO-141AC compliant.

Pin/Terminal Circuit Role Design Meaning
A0–A22 Address inputs 23-bit word address bus (A22 = MSB); supports full 128 Mb addressing with 16-bit word alignment only.
DQ0–DQ15 Data I/O bus 16-bit bidirectional data path; supports high-speed page reads and buffer writes without byte-lane splitting.
CE# Chip enable Active-low chip select; tCE = 90 ns max - defines minimum assertion window before valid read data appears.
OE# Output enable Active-low output control; tOE = 25 ns max - determines earliest point host can sample DQ bus after OE# assertion.
WE# Write enable Active-low write strobe; controls latching of command sequences and data into internal registers.
RY/BY# Ready/Busy indicator Open-drain status signal; low during embedded program/erase - eliminates need for polling loops in interrupt-driven drivers.
RESET# Hardware reset Asynchronous active-low reset; restores device to read mode and clears internal state machines after power-up or fault recovery.

Key Features

Feature Design Value
Hardware ECC engine On-die single-bit error correction with zero software intervention - maintains data integrity across 20-year retention without host-side scrubbing.
512-byte programming buffer Enables one-command write of full cache-line-sized blocks - cuts firmware update time by 4× vs. standard word programming in OTA scenarios.
Versatile I/O (VIO) Independent 1.65 V–VCC I/O supply - eliminates level translators when interfacing with 1.8 V FPGAs or 3.3 V microcontrollers.
Uniform 128-kbyte sectors 128 identically sized erase blocks - simplifies BOM management and enables deterministic wear leveling in custom flash translation layers.
OTP array (1024 bytes) Two lockable regions for immutable keys or calibration data - prevents accidental overwrite while allowing field-programmable security tokens.

Applications

Industrial HMI Boot Storage Network Edge Router Firmware

Use Scenario: Storing boot loader and kernel image for ARM Cortex-A7-based human-machine interface panels operating in factory environments.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 90 ns read latency and hardware ECC for fail-safe startup.

Use Value: Eliminates external SRAM dependency for instruction fetch; 20-year data retention ensures zero field failures due to bit rot in unattended deployments.

Use Scenario: Holding upgradable firmware images and configuration tables in IEEE 1588-compliant industrial Ethernet switches.

IC Role / Device Role / Timing Role: Field-updateable storage with suspend/resume support during live traffic - avoids service interruption during firmware patching.

Use Value: 512-byte buffer programming reduces update window from 2.1 s to 520 ms per 128-kbyte sector, minimizing network downtime risk.

Automotive ADAS Camera Module Medical Imaging Device Boot ROM

Use Scenario: Storing camera ISP firmware and calibration parameters in AEC-Q100 Grade 2 (–40°C to +105°C) automotive vision modules.

IC Role / Device Role / Timing Role: Temperature-hardened flash with sector protection to isolate safety-critical boot code from user-updatable application partitions.

Use Value: ASP lock bits prevent runtime corruption of boot sector; 100,000-cycle endurance supports lifetime OTA updates under thermal cycling stress.

Use Scenario: Hosting certified boot firmware and DICOM stack initialization code in FDA-cleared portable ultrasound units.

IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with OTP region for cryptographic keys and regulatory compliance metadata.

Use Value: Two independent OTP lock regions allow separate provisioning of manufacturer keys and hospital-specific certificates without cross-contamination risk.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL128S10TFI013 Same die, but TSOP-56 with industrial grade (–40°C to +85°C) and no AEC-Q100 qualification. Lacks automotive temperature range and qualification - unsuitable for ADAS or powertrain ECUs. Select when cost-sensitive industrial control applications do not require extended temperature operation.
MX29GL128FPTI-90G Macronix 128 Mb parallel NOR; 90 ns tACC, but no integrated ECC and only 10,000 erase cycles. No hardware ECC requires external error handling; lower endurance limits field update frequency. Choose only if legacy design reuse mandates identical pinout and timing, and ECC is implemented in software.

Compared with S29GL128S10TFV013, the TI013 variant omits automotive qualification while retaining identical electrical specs, whereas the Macronix MX29GL128F lacks on-die ECC and endurance - making the Infineon part uniquely suited for safety-critical, high-reliability firmware storage where bit integrity and long-term field updates are mandatory.

Availability

S29GL128S10TFV013 is available at Aetrix Electronics and suitable for industrial HMI boot storage, network edge router firmware, automotive ADAS camera modules, and medical imaging device boot ROM requiring stable component supply across multi-year production cycles.

Supply support for S29GL128S10TFV013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The GL-S family targets high-reliability embedded systems requiring XIP-capable flash with industrial and automotive temperature grades, hardware ECC, and robust sector protection - designed specifically for mission-critical firmware storage where data integrity and long-term field upgradability are non-negotiable.

FAQ

Does S29GL128S10TFV013 support execute-in-place (XIP) operation?

Yes, it supports true XIP operation with 90 ns random access time and page-mode reads (15 ns subsequent access), enabling direct CPU instruction fetch from flash without copying to RAM. The 32-byte page alignment and asynchronous interface eliminate wait states in Cortex-M and ARM9-based designs, confirmed in Section 4.1 and Figure 1 of the datasheet.

What is the function of the Versatile I/O (VIO) feature?

VIO allows independent I/O voltage supply (1.65 V to VCC) decoupled from core VCC, enabling direct interface with 1.8 V FPGAs or 3.3 V microcontrollers without external level shifters. This is implemented via separate VIO pin and verified in DC characteristics Table 10.5 and Signal Descriptions Section 8.3.

How does the 512-byte programming buffer improve firmware update performance?

The buffer accepts up to 512 bytes in one command and programs them internally in burst mode, achieving 1.5 MBps effective write speed - 4× faster than sequential word programming. This reduces OTA update time per 128-kbyte sector from ~2.1 seconds to ~520 ms, as measured in Embedded Algorithm Performance Table 5.7.

Is the OTP array truly one-time programmable, and how is it secured?

Yes, the 1024-byte OTP array has two independently lockable regions; once locked via specific command sequences (see Section 3.3), further writes are permanently disabled. Lock status is retained through power cycles and verified by reading status register bits SR[6] and SR[7], ensuring cryptographic keys remain immutable in production units.

S29GL128S10TFV013 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
56-TFSOP (0.724", 18.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
8M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
100 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSOP

S29GL128S10TFV013 FAQ

1.How can I place an order for S29GL128S10TFV013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S10TFV013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S10TFV013 reliable?

The price and inventory of S29GL128S10TFV013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10TFV013 is usually 5 days.

3.What payment methods are accepted for S29GL128S10TFV013?

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Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S10TFV013?

S29GL128S10TFV013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S10TFV013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S10TFV013?

For technical support, including S29GL128S10TFV013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10TFV013 requirements.

6.How does Aetrix verify that S29GL128S10TFV013 is sourced from the original manufacturer or authorized distributors?

All S29GL128S10TFV013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10TFV013 meets industry standards.

7.What is the process for return or replacement of S29GL128S10TFV013?

All S29GL128S10TFV013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10TFV013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S10TFV013 part is unused and in its original packaging.

Return procedure for S29GL128S10TFV013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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