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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL128S10TFV023

Name: S29GL128S10TFV023
Brand: Infineon Technologies
SKU: S29GL128S10TFV023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL128S10TFV023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL128S10TFV023.pdf

Description:: IC FLASH 128MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Inventory:2,422

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Product details

Overview

S29GL128S10TFV023 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 3.0 V core supply, ×16 data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial controllers requiring reliable non-volatile program execution.

For engineers reviewing the S29GL128S10TFV023 datasheet, S29GL128S10TFV023 pinout, S29GL128S10TFV023 application, or S29GL128S10TFV023 equivalent, this device supports asynchronous XIP-capable read operations, sector-based erase (128 kB uniform sectors), and Versatile I/O (1.65 V to VCC) for flexible host interface voltage matching.

Technical Context

The S29GL128S10TFV023 implements an asynchronous parallel interface with dedicated CE#, OE#, and WE# control lines, supporting word-aligned 16-bit transfers only. Its embedded algorithm controller (EAC) manages all program/erase operations-including 512-byte buffer programming and suspend/resume-without external firmware intervention.

It features dual protection architecture: Advanced Sector Protection (ASP) with volatile/non-volatile lock bits per sector, plus a separate 1024-byte OTP array with two lockable regions. Internal hardware ECC operates transparently during read cycles, correcting single-bit errors and flagging uncorrectable multi-bit errors via status register.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	128 Mb (16 MB), organized as 1,048,576 × 16-bit words
Random access time	90 ns at VCC = VIO = 3.0 V - determines minimum instruction fetch latency in XIP systems
Page access time	15 ns - enables fast sequential reads within 32-byte aligned pages
Programming buffer	512 bytes - reduces effective programming time by batching up to 256 words per command
Erase block size	128 kB uniform sectors - simplifies firmware partitioning and wear leveling logic
Data retention	20 years - ensures long-term reliability in unpowered industrial deployments
Endurance	100,000 program/erase cycles - supports field-upgradable firmware with robust update scheduling

Pinout & Package

Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address inputs	23-bit word address bus (AMAX = A22 for 128 Mb); supports full memory addressing without byte lanes
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; operates at VIO (1.65 V to VCC) for mixed-voltage system interfacing
CE#	Chip enable	Active-low chip select; controls device power state and enables address/data latching
OE#	Output enable	Active-low read strobe; gates output drivers without affecting internal timing or state machine
WE#	Write enable	Active-low write strobe; initiates internal program/erase algorithms when combined with valid command sequences
RY/BY#	Ready/Busy indicator	Open-drain status output; low during active program/erase, high when operation complete or ready for next command
RESET#	Hardware reset	Active-low asynchronous reset; forces device into known initial state and aborts ongoing operations
VCC	Core supply	3.0 V ±0.3 V supply for logic and memory array; powers internal voltage generators for programming/erasing
VIO	I/O supply	Independent 1.65 V to VCC supply for DQ and control pins - decouples interface voltage from core logic

Key Features

Feature	Design Value
Asynchronous page-mode read	15 ns intra-page access enables burst instruction fetches without external clock synchronization
Hardware ECC engine	Single-bit correction with automatic detection and status reporting - eliminates need for software ECC overhead in boot ROM
Versatile I/O voltage range	VIO from 1.65 V to VCC allows direct connection to 1.8 V, 2.5 V, or 3.3 V host processors without level shifters
OTP array with lockable regions	1024-byte one-time-programmable space split into two independently lockable blocks - ideal for secure key storage or calibration data
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands - enables OS/driver auto-detection and configuration

Applications

Industrial PLC Firmware Storage

Automotive Instrument Cluster Boot Memory

Use Scenario: Storing boot firmware and real-time control code in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory enabling eXecute-In-Place (XIP) execution directly from flash without RAM copy.

Use Value: 90 ns random access and 15 ns page mode support deterministic interrupt response times critical for motion control loops.

Use Scenario: Holding calibrated display graphics, safety-critical boot code, and firmware updates in automotive digital instrument clusters.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 (–40°C to +105°C) certified boot memory with hardware ECC for ASIL-B compliance.

Use Value: 20-year data retention and 100,000 erase cycles ensure firmware integrity over vehicle lifetime without field recalls.

Medical Imaging System Configuration

Network Router Boot Image Storage

Use Scenario: Storing FPGA configuration bitstreams, calibration tables, and regulatory-compliant diagnostic routines in portable ultrasound devices.

IC Role / Device Role / Timing Role: Secure silicon region (OTP) stores cryptographic keys and device-specific calibration offsets with hardware locking.

Use Value: Dual-lock OTP regions prevent unauthorized reprogramming of calibration data while allowing field updates to application firmware.

Use Scenario: Hosting bootloader, kernel image, and fail-safe recovery firmware in enterprise-grade Layer 3 routers with hot-swap capability.

IC Role / Device Role / Timing Role: Parallel NOR flash interfaced to MIPS or ARM SoC via static memory controller with CE#/OE# timing control.

Use Value: Sector erase suspend/resume allows background firmware updates without interrupting packet forwarding or management traffic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL128P10TFV020	Same density and package but older GL-P generation; lacks Versatile I/O and hardware ECC	No built-in ECC requires external error handling; VIO fixed at VCC only	Select only if legacy design compatibility or cost sensitivity outweighs ECC and voltage flexibility needs
MX29GL128FDTI-90G	Macronix 128 Mb parallel NOR; 90 ns access, no hardware ECC, CFI compliant, 1.8 V/3.3 V dual I/O support	Requires external ECC implementation; wider I/O voltage range but no OTP array	Prefer when migrating from legacy Macronix platforms or where OTP functionality is not required

Compared with S29GL128P10TFV020 and MX29GL128FDTI-90G, the S29GL128S10TFV023 uniquely integrates hardware ECC, Versatile I/O, and dual-lock OTP - making it optimal for new designs demanding functional safety, mixed-voltage interfacing, and secure configuration storage.

Availability

S29GL128S10TFV023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical imaging system configuration requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL128S10TFV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and mission-critical applications.

The GL-S family targets high-reliability embedded systems needing XIP-capable flash with enhanced data integrity, extended temperature operation, and secure configuration storage - particularly in automotive, industrial automation, and medical equipment.

FAQ

Does S29GL128S10TFV023 support byte-level writes?

No. The device operates exclusively on 16-bit word boundaries due to its ×16 data bus architecture and internal word-aligned memory organization. All write operations - including buffer programming - require even-addressed 16-bit data transfers. Byte-level access is not supported in hardware or command set.

What is the function of the STB pin listed in the block diagram?

The STB (Strobe) signal shown in Figure 1 is an internal node within the device's Y-decoder and data latch circuitry - not a user-accessible pin. It does not appear in the physical pinout or signal descriptions; it is part of the internal timing control path for page-mode read operations and has no external connection or user control.

Can RY/BY# be used as a general-purpose GPIO?

No. RY/BY# is a dedicated open-drain status output that reflects internal program/erase progress. It cannot be driven high by the host, lacks input capability, and has no configurable direction or pull-up control. Using it as GPIO would violate timing specifications and risk undefined behavior during embedded operations.

Is the 56-ball VBU package lead-free and RoHS compliant?

Yes. The S29GL128S10TFV023 in the 56-ball VBU Fortified BGA package is manufactured using lead-free solder bumps and complies with EU RoHS Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity requirements (MSL3).

S29GL128S10TFV023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL128S10TFV023 FAQ

1.How can I place an order for S29GL128S10TFV023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S10TFV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S10TFV023 reliable?

The price and inventory of S29GL128S10TFV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10TFV023 is usually 5 days.

3.What payment methods are accepted for S29GL128S10TFV023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10TFV023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S10TFV023?

S29GL128S10TFV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S10TFV023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S10TFV023?

For technical support, including S29GL128S10TFV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10TFV023 requirements.

6.How does Aetrix verify that S29GL128S10TFV023 is sourced from the original manufacturer or authorized distributors?

All S29GL128S10TFV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10TFV023 meets industry standards.

7.What is the process for return or replacement of S29GL128S10TFV023?

All S29GL128S10TFV023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10TFV023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S10TFV023 part is unused and in its original packaging.

Return procedure for S29GL128S10TFV023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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