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Infineon Technologies S29GL128S11DHBV13
- Part No.:
- S29GL128S11DHBV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S11DHBV13.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,004
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Product details
Overview
S29GL128S11DHBV13 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte programming buffer-enabling fast embedded code storage and firmware update in microcontroller boot loaders.
For engineers reviewing the S29GL128S11DHBV13 datasheet, S29GL128S11DHBV13 pinout, S29GL128S11DHBV13 application, or S29GL128S11DHBV13 equivalent, key selection criteria include its Versatile I/O (1.65 V to VCC), asynchronous read timing, OTP array support, ASP sector protection, and compatibility with legacy parallel NOR flash interfaces in automotive control units and industrial HMI systems.
Technical Context
This device implements an asynchronous parallel NOR architecture with XIP-capable fast random access and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, while internal hardware ECC corrects single-bit errors on-the-fly during read cycles without CPU intervention.
The 128-kbyte uniform sector structure supports fine-grained firmware partitioning, and the 1024-byte OTP array-divided into two lockable regions-enables secure storage of calibration data or cryptographic keys. Sector protection uses both volatile (SR bits) and non-volatile (lock bits) methods, configurable per sector.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words |
| Random access time (tACC) | 90 ns at VCC = VIO = 3.0 V - determines worst-case instruction fetch latency |
| Page access time (tPACC) | 15 ns - enables rapid sequential reads within 32-byte aligned pages |
| Programming buffer size | 512 bytes - allows burst programming of up to 256 words per command, reducing host overhead |
| ECC capability | Single-bit error correction via dedicated hardware - eliminates need for software ECC in boot ROM applications |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention at 85°C - validated for long-life automotive ECUs |
| Operating voltage | VCC = 2.7 V to 3.6 V; VIO = 1.65 V to VCC - supports mixed-voltage system interfacing |
| Temperature grade | Industrial (–40°C to +85°C) - qualified per JEDEC JESD22-A108, suitable for factory automation controllers |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit address bus supporting full 16 MB address space (AMAX = A22 for 128 Mb) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads with no external byte-enable logic |
| CE# | Chip enable | Active-low chip select; controls device power state and enables internal address latching |
| OE# | Output enable | Active-low control for data bus drivers; used to gate read data without affecting internal state |
| WE# | Write enable | Active-low signal initiating write/program/erase commands; sampled with address and data setup |
| RY/BY# | Ready/Busy output | Open-drain status indicator: low = operation in progress; high = ready for next command |
| RESET# | Hardware reset | Active-low asynchronous reset that halts all embedded operations and returns device to read mode |
| WP# | Write protect | Hardware sector protection override; when asserted, blocks program/erase regardless of software lock settings |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse process | Enables higher density and lower active current vs. older 90 nm NOR flash, reducing thermal load in sealed enclosures |
| Asynchronous 32-byte page read | Reduces average instruction fetch time by >60% compared to full random access in XIP boot sequences |
| Automatic ECC with single-bit correction | Eliminates requirement for external error-detection circuitry or software overhead in safety-critical boot ROMs |
| Advanced sector protection (ASP) | Allows independent locking/unlocking of each 128-kB sector via volatile SR bits or non-volatile lock bits - critical for OTA firmware partitioning |
| Separate 1024-byte OTP array | Provides tamper-resistant storage for device-specific keys or calibration coefficients, with dual lockable regions preventing accidental overwrite |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Human-Machine Interface (HMI) |
|---|---|
Use Scenario: Storing boot firmware and real-time control algorithms in engine management systems requiring AEC-Q100 Grade 3 qualification. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability; provides deterministic <90 ns instruction fetch latency during cold start. Use Value: Hardware ECC ensures boot integrity under EMI-rich environments; ASP enables safe dual-bank firmware updates without runtime corruption. | Use Scenario: Holding GUI assets, configuration profiles, and PLC logic in panel-mounted HMIs operating continuously in factory settings. IC Role / Device Role / Timing Role: Parallel NOR flash serving as primary firmware and asset repository; accessed asynchronously by ARM Cortex-A series SoCs. Use Value: 128-kB uniform sectors simplify firmware versioning; OTP array stores display calibration data immune to field reprogramming. |
| Medical Diagnostic Imaging Controller | Telecom Base Station Management Module |
Use Scenario: Hosting boot loader and diagnostic self-test routines in FDA-cleared imaging equipment with strict data retention requirements. IC Role / Device Role / Timing Role: Secure, long-life code storage with 20-year data retention at 85°C; supports fail-safe recovery after unexpected power loss. Use Value: Hardware reset and RY/BY# signaling enable robust watchdog coordination; WP# pin provides physical write lock during service mode. | Use Scenario: Storing FPGA configuration bitstreams and baseband firmware in remote radio units exposed to wide ambient temperature swings. IC Role / Device Role / Timing Role: High-reliability firmware repository interfaced to PowerPC or ARM-based management processors via parallel bus. Use Value: Versatile I/O (1.65 V to VCC) accommodates mixed-voltage backplane designs; 100,000-cycle endurance supports frequent field upgrades. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S10TFI010 | Same density and core voltage, but TSOP-56 package (vs. VBU BGA); no OTP array | Lacks 1024-byte OTP region - unsuitable for secure key storage or calibration data | Select only if board layout requires through-hole or standard TSOP footprint and OTP is not required |
| MX29GL128FDTI-90G | Macronix part; 90 ns tACC, but no hardware ECC and no Versatile I/O (VIO fixed at VCC) | Requires external error handling; incompatible with mixed-voltage host interfaces | Choose only for cost-sensitive, non-safety-critical applications where ECC and flexible I/O are unnecessary |
Compared with S29GL128S11DHBV13, the TSOP variant sacrifices OTP and BGA miniaturization, while the Macronix alternative omits hardware ECC and voltage flexibility-making the Infineon part uniquely suited for safety-aware, space-constrained, and mixed-voltage embedded designs.
Availability
S29GL128S11DHBV13 is available at Aetrix Electronics and suitable for automotive engine control units, industrial human-machine interfaces, and medical diagnostic imaging controllers requiring stable component supply across extended product lifecycles.
Supply support for S29GL128S11DHBV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q200.
The GL-S family targets high-reliability embedded systems needing XIP-capable NOR flash with enhanced data integrity, offering a migration path from legacy 90 nm devices while maintaining pin- and command-set compatibility.
FAQ
Does S29GL128S11DHBV13 support execute-in-place (XIP) operation?
Yes. The device supports true XIP operation with 90 ns random access time and 15 ns page-mode reads, enabling direct execution of code from flash without copying to RAM. Its asynchronous interface and deterministic timing meet real-time interrupt latency requirements in automotive and industrial control applications.
What is the function of the STB pin on S29GL128S11DHBV13?
The STB (Strobe) pin is not present on the S29GL128S11DHBV13. This pin appears only on certain earlier Infineon flash families (e.g., S29GL-P) and was removed in the GL-S series. The VBU BGA package has no STB pin; all timing control is managed internally via CE#, OE#, and WE# signals.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP (One-Time Programmable) array consists of two independently lockable regions. Once a region is locked via the appropriate command sequence, it cannot be unlocked or rewritten. Programming is irreversible, ensuring permanent storage of calibration data or cryptographic keys.
How does the Versatile I/O feature affect system-level voltage design?
Versatile I/O allows VIO to operate independently from VCC across 1.65 V to VCC, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic without level shifters. This simplifies PCB routing and reduces BOM count in mixed-voltage SoC designs, especially when connecting to ARM or RISC-V processors with flexible I/O banks.
S29GL128S11DHBV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S11DHBV13 FAQ
1.How can I place an order for S29GL128S11DHBV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S11DHBV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S11DHBV13 reliable?
The price and inventory of S29GL128S11DHBV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S11DHBV13 is usually 5 days.
3.What payment methods are accepted for S29GL128S11DHBV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S11DHBV13 transactions.
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4.How is shipping managed for S29GL128S11DHBV13?
S29GL128S11DHBV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S11DHBV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S11DHBV13?
For technical support, including S29GL128S11DHBV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S11DHBV13 requirements.
6.How does Aetrix verify that S29GL128S11DHBV13 is sourced from the original manufacturer or authorized distributors?
All S29GL128S11DHBV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S11DHBV13 meets industry standards.
7.What is the process for return or replacement of S29GL128S11DHBV13?
All S29GL128S11DHBV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S11DHBV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S11DHBV13 part is unused and in its original packaging.
Return procedure for S29GL128S11DHBV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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