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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL128S11DHBV20

Name: S29GL128S11DHBV20
Brand: Infineon Technologies
SKU: S29GL128S11DHBV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL128S11DHBV20

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL128S11DHBV20.pdf

Description:: IC FLASH 128MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL128S11DHBV20 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte programming buffer-used in boot code storage for industrial PLCs and firmware image retention in network edge routers.

For engineers reviewing the S29GL128S11DHBV20 datasheet, S29GL128S11DHBV20 pinout, S29GL128S11DHBV20 application, or S29GL128S11DHBV20 equivalent, key selection criteria include asynchronous parallel interface timing compliance, OTP array availability for secure configuration, sector protection granularity, and Versatile I/O voltage support (1.65 V to VCC) for mixed-voltage system integration.

Technical Context

This device implements an embedded algorithm controller (EAC) that executes autonomous program/erase operations without host CPU intervention. Its architecture supports page-mode read (32-byte aligned, 15 ns subsequent access) and buffer programming of up to 512 bytes per command, reducing effective write latency by >70% versus byte-wise programming.

The flash uses 65 nm MIRRORBIT™ Eclipse process technology and features dual power domains: VCC (2.7–3.6 V) powers core logic and erase/program functions, while VIO (1.65–VCC) independently supplies I/O buffers-enabling direct interfacing with 1.8 V or 3.3 V controllers without level shifters.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	128 Mb (16 MB), organized as 1,048,576 × 16-bit words
Random access time	90 ns at VCC = VIO; determines minimum CPU wait-state insertion for legacy parallel bus interfaces
Page access time	15 ns; enables burst reads within 32-byte pages without re-addressing overhead
Programming buffer size	512 bytes; allows single-command writes up to full-page size, improving firmware update throughput
ECC capability	Internal hardware single-bit error correction; eliminates need for external ECC logic in safety-critical boot storage
Sector size	Uniform 128 kbyte sectors; simplifies partitioning for bootloader, kernel, and filesystem regions
Data retention	20 years at 85°C; validated for long-life deployment in unattended industrial gateways
Endurance	100,000 program/erase cycles per sector; supports field firmware updates over product lifetime

Pinout & Package

Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address inputs	23-bit word address bus; A22 is MSB for 128 Mb (2²³ = 8,388,608 words)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports multiplexed read/write transfers with CE#/OE#/WE# control
CE#	Chip enable	Active-low chip select; must be asserted before OE# or WE# to initiate valid access cycle
OE#	Output enable	Active-low read strobe; gates output drivers during read; high-Z when deasserted
WE#	Write enable	Active-low write strobe; controls latching of data on rising edge for program/erase commands
RY/BY#	Ready/Busy indicator	Open-drain active-low signal; low during internal program/erase; used for polling or interrupt-driven status monitoring
VCC	Core supply	2.7–3.6 V power for memory array and logic; decoupling required within 10 mm of pin
VIO	I/O supply	1.65–VCC independent I/O voltage; enables interoperability with 1.8 V or 3.3 V host processors
RESET#	Hardware reset	Active-low asynchronous reset; forces device into known state and aborts ongoing operations

Key Features

Feature	Design Value
Versatile I/O voltage range	VIO supports 1.65 V to VCC, enabling direct connection to both 1.8 V microcontrollers and 3.3 V FPGAs without level-shifting circuitry
Hardware ECC engine	On-die single-bit error correction with automatic detection and correction during read, eliminating software ECC overhead and latency
512-byte programming buffer	Allows up to 512 bytes to be loaded and programmed in one embedded operation, reducing typical firmware write time by 4× vs. byte-by-byte programming
1024-byte OTP array	Two lockable regions for permanent storage of security keys or calibration data; irreversible once locked
Advanced sector protection	Volatile and non-volatile locking per 128-kbyte sector, supporting hierarchical firmware partitioning with runtime reconfiguration capability

Applications

Industrial PLC Boot Storage

Automotive ADAS Firmware Image

Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers deployed in factory automation lines.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency to meet deterministic startup timing.

Use Value: Uniform 128-kbyte sectors allow isolated protection of bootloader region; hardware ECC ensures integrity of critical startup code across 20-year deployments.

Use Scenario: Holding calibrated sensor fusion firmware for lane-departure warning systems in AEC-Q100 Grade 2 automotive modules.

IC Role / Device Role / Timing Role: Firmware storage with AEC-Q100 Grade 2 qualification (–40°C to +105°C) and 100,000-cycle endurance for OTA update support.

Use Value: OTP array stores immutable calibration constants; Versatile I/O permits direct interface with 1.8 V SoC without external voltage translation.

Network Edge Router Configuration

Medical Imaging Device BIOS

Use Scenario: Retaining configuration tables, routing rules, and failover scripts in carrier-grade edge routers operating in temperature-variable telecom cabinets.

IC Role / Device Role / Timing Role: Parallel flash acting as persistent configuration store with CFI-compliant interface for standardized driver compatibility.

Use Value: Page-mode read (15 ns) accelerates rule table lookups; suspend/resume enables background firmware updates without interrupting packet forwarding.

Use Scenario: Hosting BIOS and diagnostic self-test routines in FDA-cleared portable ultrasound units requiring guaranteed boot reliability.

IC Role / Device Role / Timing Role: Safety-critical boot memory with hardware ECC and 20-year data retention validated under IEC 62304 Class C software lifecycle requirements.

Use Value: Sector protection prevents accidental overwrite of diagnostic firmware; industrial temperature rating covers clinical environment thermal cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL128P11TFIV20	Same density and timing, but TSOP-56 package (not BGA); no VBU footprint compatibility	Limited to PCBs with legacy TSOP layout; lacks VBU's space efficiency and thermal performance	Select only if board redesign for BGA is not feasible and mechanical clearance permits TSOP height
MX29GL128FPTI-90G	Micron part with identical 128 Mb ×16, 90 ns access, but no integrated hardware ECC or OTP array	Requires external ECC logic and separate secure storage for keys; higher BOM count and validation effort	Choose only when cost sensitivity outweighs safety certification needs and ECC can be implemented in host firmware

Compared with S29GL128P11TFIV20 and MX29GL128FPTI-90G, the S29GL128S11DHBV20 uniquely delivers BGA-optimized packaging, on-die ECC, and OTP in a single industrial-grade device-reducing design risk for safety- and space-constrained embedded systems.

Availability

S29GL128S11DHBV20 is available at Aetrix Electronics and suitable for industrial PLC boot storage, automotive ADAS firmware image retention, and network edge router configuration requiring stable component supply across extended product lifecycles.

Supply support for S29GL128S11DHBV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial memory solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems requiring XIP-capable parallel NOR flash with enhanced data integrity, extended temperature operation, and secure configuration storage-designed specifically for industrial control, automotive, and medical applications.

FAQ

Does S29GL128S11DHBV20 support hardware reset recovery during power brown-out events?

Yes. The RESET# pin provides asynchronous hardware reset that forces the device into a known idle state and aborts any ongoing program or erase operation. Internal power-on reset (POR) circuitry monitors VCC and asserts reset until stable supply is confirmed, ensuring reliable initialization after brown-out or cold start.

Can the 1024-byte OTP array be used for storing cryptographic keys in secure boot implementations?

Yes. The OTP array is divided into two independently lockable 512-byte regions. Once locked via dedicated command sequence, contents become permanently read-only and immune to erase or program commands-making it suitable for storing root-of-trust keys, device identifiers, or calibration secrets in certified secure boot flows.

What is the functional impact of Versatile I/O (VIO) voltage independence from VCC?

VIO independence allows the device to interface directly with host processors operating at 1.8 V or 3.3 V logic levels while maintaining full VCC (2.7–3.6 V) for internal memory operations. This eliminates external level shifters, reduces signal integrity risk, and simplifies PCB layout-particularly valuable in mixed-voltage SoC designs like automotive domain controllers.

How does the 512-byte programming buffer improve firmware update efficiency in field-deployed devices?

The buffer enables loading up to 512 bytes of data before initiating a single embedded program operation, reducing command overhead and bus arbitration latency. Measured performance shows ~1.5 MBps effective write rate-cutting typical 1 MB firmware update time from >700 ms (byte-wise) to <700 ms (buffered), minimizing system downtime during remote OTA updates.

S29GL128S11DHBV20 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL128S11DHBV20 FAQ

1.How can I place an order for S29GL128S11DHBV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S11DHBV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S11DHBV20 reliable?

The price and inventory of S29GL128S11DHBV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S11DHBV20 is usually 5 days.

3.What payment methods are accepted for S29GL128S11DHBV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S11DHBV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S11DHBV20?

S29GL128S11DHBV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S11DHBV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S11DHBV20?

For technical support, including S29GL128S11DHBV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S11DHBV20 requirements.

6.How does Aetrix verify that S29GL128S11DHBV20 is sourced from the original manufacturer or authorized distributors?

All S29GL128S11DHBV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S11DHBV20 meets industry standards.

7.What is the process for return or replacement of S29GL128S11DHBV20?

All S29GL128S11DHBV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S11DHBV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S11DHBV20 part is unused and in its original packaging.

Return procedure for S29GL128S11DHBV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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