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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL128S11DHIV20

Name: S29GL128S11DHIV20
Brand: Infineon Technologies
SKU: S29GL128S11DHIV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL128S11DHIV20

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL128S11DHIV20.pdf

Description:: IC FLASH 128MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL128S11DHIV20 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.

For engineers reviewing the S29GL128S11DHIV20 datasheet, S29GL128S11DHIV20 pinout, S29GL128S11DHIV20 application, or S29GL128S11DHIV20 equivalent, key selection criteria include its 128-kbyte uniform sector erase granularity, 512-byte programming buffer throughput (1.5 MBps), Versatile I/O support (1.65 V to VCC), and AEC-Q100 Grade 2 qualification (–40°C to +105°C).

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supports both standard and page-mode reads, and uses embedded algorithms for sector erase and buffered programming. Its internal state machine handles command execution, status reporting via RY/BY# pin or status register, and automatic ECC generation/correction during read operations.

The GL-S architecture separates address decoding (X/Y decoders), erase/program voltage generation, and sector protection logic into dedicated blocks. Sector-level locking (volatile/non-volatile), OTP array (1024 bytes, two lockable regions), and CFI-compliant parameter tables enable standardized firmware compatibility across host systems.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	128 Mb (16 MB), organized as 1,048,576 × 16-bit words - defines maximum boot image or firmware partition size.
Random Access Time	90 ns at VCC = VIO - enables direct XIP execution from flash without performance penalty on MCU instruction fetch.
Page Access Time	15 ns - allows rapid sequential reads within 32-byte aligned pages, improving data streaming efficiency.
Programming Buffer	512 bytes - reduces effective programming time by batching writes; supports up to 256 words per operation.
ECC Support	Internal hardware single-bit error correction - eliminates need for external ECC logic or software overhead in safety-critical firmware storage.
Endurance & Retention	100,000 program/erase cycles / 20 years data retention - ensures long-term reliability in infrequently updated embedded control applications.
Operating Temperature	–40°C to +105°C (AEC-Q100 Grade 2) - validated for under-hood automotive ECUs and industrial motor drives.
Supply Voltage	VCC = 2.7–3.6 V, VIO = 1.65 V to VCC - supports mixed-voltage system interfacing without level shifters.

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width), JEDEC MO-141AC compliant. Pin pitch: 0.5 mm. Body dimensions: 18.4 mm × 10.16 mm × 1.2 mm.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address Inputs	Word-aligned address bus (23 bits); A22 is MSB for 128 Mb density - defines 1-Mword address space.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes and reads - matches ARM Cortex-M or Power Architecture MCU interfaces.
CE#	Chip Enable	Active-low device select; controls power state entry/exit - critical for low-power standby sequencing.
OE#	Output Enable	Active-low read strobe; gates output drivers - enables shared bus arbitration in multi-device systems.
WE#	Write Enable	Active-low write strobe; initiates programming/erase commands - must be synchronized with address/data setup/hold timing.
RY/BY#	Ready/Busy Output	Open-drain status indicator; low = operation in progress - provides hardware flow control without polling overhead.
RESET#	Hardware Reset	Active-low asynchronous reset; aborts ongoing operations and returns to read mode - required for safe power-cycle recovery.
WP#	Write Protect	Active-low hardware sector lock override - enables physical write inhibition during field updates or maintenance.

Key Features

Feature	Design Value
65 nm MIRRORBIT™ Eclipse Technology	Enables higher density and lower active current vs. older floating-gate NOR - reduces thermal load in compact enclosures.
Uniform 128-kbyte Sectors	Allows precise firmware partitioning (e.g., bootloader, app, config) with independent erase control - prevents corruption during partial updates.
Suspend/Resume for Program & Erase	Permits interrupt-driven background operations - essential for real-time OS tasks requiring deterministic latency.
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands - enables auto-detection and driver portability across flash vendors.
Advanced Sector Protection (ASP)	Combines volatile (power-on default) and non-volatile (permanent) lock bits per sector - supports secure boot and field-service modes.
1024-byte OTP Array	Two independently lockable regions store calibration data, MAC addresses, or security keys - immune to accidental overwrite after programming.

Applications

Automotive Engine Control Unit (ECU)

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated engine maps, diagnostic routines, and boot firmware in diesel ECU modules operating under hood temperatures up to +105°C.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with <90 ns latency and AEC-Q100 Grade 2 qualification.

Use Value: Eliminates external SRAM copy step during boot; hardware ECC ensures integrity of safety-critical calibration data over 15+ year vehicle lifetime.

Use Scenario: Holding ladder logic firmware and configuration parameters in DIN-rail mounted programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Primary firmware storage with sector-protected bootloader region and field-updatable application partition.

Use Value: Uniform 128-kbyte sectors allow atomic firmware swaps; suspend/resume enables seamless runtime updates without stopping I/O scanning.

Medical Imaging System Boot ROM

Avionics Display Processor Code Storage

Use Scenario: Hosting boot loader and FPGA configuration bitstreams in portable ultrasound devices requiring radiation-tolerant, high-reliability non-volatile memory.

IC Role / Device Role / Timing Role: Secure, ECC-protected boot ROM with OTP-stored device-specific calibration coefficients.

Use Value: Internal hardware ECC meets IEC 62304 Class C software safety requirements; 20-year data retention avoids recalibration drift in field-deployed units.

Use Scenario: Storing display controller firmware and graphics assets in DO-254-compliant cockpit display units subject to extended thermal cycling and vibration.

IC Role / Device Role / Timing Role: High-speed parallel flash memory supporting deterministic boot timing (<100 ms) and real-time graphics asset loading.

Use Value: 15 ns page access time accelerates bitmap rendering; Versatile I/O (1.65–3.6 V) interfaces directly with 1.8 V display ASICs without level shifters.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL128P11TFIV10	Same density and core specs, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm) instead of TSOP - smaller footprint, higher I/O density.	Preferred for space-constrained PCBs where thermal dissipation permits BGA reflow; lacks through-hole mounting option.	Select when board area is constrained and automated assembly is available; verify thermal profile compatibility with BGA pad layout.
MX29GL128FHT2I-90G	Macronix part with identical 128 Mb density, 90 ns access, and 1.65–3.6 V I/O, but no integrated hardware ECC and only 10,000 erase cycles.	Suitable for cost-sensitive consumer applications where ECC is handled in software and update frequency is low.	Choose for non-safety-critical designs with existing software ECC infrastructure and lower endurance requirements.

Compared with S29GL128P11TFIV10, this TSOP variant offers easier prototyping and thermal management; versus MX29GL128FHT2I-90G, it delivers superior reliability via hardware ECC and 10× higher endurance - critical for automotive and industrial firmware storage.

Availability

S29GL128S11DHIV20 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, medical imaging boot systems, and avionics display processors requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL128S11DHIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.

The GL-S family targets mission-critical embedded systems needing fast, secure, and durable non-volatile code storage - specifically engineered for automotive ECU boot, industrial control firmware, and safety-certified medical devices.

FAQ

Does S29GL128S11DHIV20 support execute-in-place (XIP) operation?

Yes, it supports true XIP operation due to its 90 ns random access time and asynchronous parallel interface. The device delivers instructions directly to the CPU without copying to RAM, enabling deterministic boot and real-time code execution - confirmed by Infineon's GL-S family documentation and verified in automotive ECU reference designs.

What is the function of the RY/BY# pin, and how is it used in system design?

RY/BY# is an open-drain ready/busy status output that goes low during program or erase operations and returns high upon completion. It enables hardware handshaking to prevent bus contention and eliminates the need for continuous status register polling - reducing CPU overhead and improving deterministic timing in real-time systems.

Can the 1024-byte OTP array be reprogrammed after initial write?

No, the OTP array is one-time programmable: each bit can be written from '1' to '0' only once, and lock bits permanently disable further writes to either of the two 512-byte regions. This ensures permanent storage of immutable identifiers like MAC addresses or cryptographic keys, as specified in Section 2.6 and 3.3 of the datasheet.

How does Versatile I/O (VIO) simplify interface design with mixed-voltage SoCs?

Versatile I/O allows the device's I/O pins to operate between 1.65 V and VCC (2.7–3.6 V), enabling direct connection to 1.8 V, 2.5 V, or 3.3 V logic without external level shifters. This is implemented via internal I/O buffers with adaptive voltage tracking - reducing BOM count and PCB complexity in heterogeneous voltage domain systems.

S29GL128S11DHIV20 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL128S11DHIV20 FAQ

1.How can I place an order for S29GL128S11DHIV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S11DHIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S11DHIV20 reliable?

The price and inventory of S29GL128S11DHIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S11DHIV20 is usually 5 days.

3.What payment methods are accepted for S29GL128S11DHIV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S11DHIV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S11DHIV20?

S29GL128S11DHIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S11DHIV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S11DHIV20?

For technical support, including S29GL128S11DHIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S11DHIV20 requirements.

6.How does Aetrix verify that S29GL128S11DHIV20 is sourced from the original manufacturer or authorized distributors?

All S29GL128S11DHIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S11DHIV20 meets industry standards.

7.What is the process for return or replacement of S29GL128S11DHIV20?

All S29GL128S11DHIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S11DHIV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S11DHIV20 part is unused and in its original packaging.

Return procedure for S29GL128S11DHIV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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