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Infineon Technologies S29GL128S11DHVV20
- Part No.:
- S29GL128S11DHVV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S11DHVV20.pdf
- Description:
- IC FLASH 128MBIT CFI 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,460
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Product details
Overview
S29GL128S11DHVV20 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware update storage for industrial microcontroller systems.
For engineers reviewing the S29GL128S11DHVV20 datasheet, S29GL128S11DHVV20 pinout, S29GL128S11DHVV20 application, or S29GL128S11DHVV20 equivalent, key selection criteria include its 128-kbyte uniform sector erase granularity, 512-byte write buffer, Versatile I/O support (1.65 V to VCC), and AEC-Q100 Grade 2 qualification for automotive embedded control units.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supports both standard and page-mode reads, and uses embedded algorithms for program/erase without external timing control. Its internal state machine handles command execution, status reporting via RY/BY# pin or status register, and automatic ECC generation/correction during read.
The architecture includes a dedicated 1024-byte OTP array with two lockable regions, CFI-compliant parameter tables for host auto-configuration, and Advanced Sector Protection with volatile/non-volatile locking per 128-kbyte sector-enabling secure firmware partitioning in safety-critical boot loaders.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words |
| Random access time | 90 ns at VCC = VIO = 3.0 V - determines minimum instruction fetch latency in XIP applications |
| Page access time | 15 ns - enables fast sequential reads within 32-byte aligned pages |
| Write buffer size | 512 bytes - allows burst programming of up to 256 words per command, reducing effective programming time |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic in firmware storage |
| Sector size | Uniform 128 kbyte sectors - simplifies firmware partitioning and OTA update management |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - meets long-life requirements for industrial controllers |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | Word-aligned address bus; A22 is MSB for 128 Mb (2²³ = 8,388,608 words) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports Versatile I/O (VIO = 1.65 V to VCC) |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low read strobe; gates output drivers during read operations |
| WE# | Write enable | Active-low write strobe; initiates program/erase command sequences |
| RY/BY# | Ready/Busy indicator | Open-drain active-low status signal; asserts low during embedded operations |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into reading state and clears status registers |
| WP# | Write protect | Active-low hardware sector protection override; disables program/erase when asserted |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse technology | Enables higher density and lower power vs. older floating-gate NOR, with improved endurance and retention |
| Asynchronous 32-byte page read | Reduces average read latency for contiguous firmware code by >80% vs. full random access |
| Automatic hardware ECC | Corrects single-bit errors on-the-fly during read, eliminating software overhead and improving system reliability |
| Separate 1024-byte OTP array | Provides immutable storage for security keys or calibration data, with dual lockable regions for staged provisioning |
| CFI parameter table support | Allows host bootloader to auto-detect device geometry, timing, and command set without hard-coded configuration |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Loader |
|---|---|
Use Scenario: Storing real-time control firmware in programmable logic controllers with field-upgrade capability. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction storage with deterministic 90 ns access. Use Value: Uniform 128-kbyte sectors simplify firmware image partitioning; hardware ECC ensures integrity across 20-year deployment life. | Use Scenario: Hosting boot code and safety-critical initialization routines in camera-based driver assistance modules. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified NOR flash serving as primary boot device for SoC startup sequence. Use Value: 100,000 erase cycles and -40°C to +105°C operation support repeated OTA updates under under-hood thermal stress. |
| Medical Imaging System Configuration | Telecom Base Station BIOS |
Use Scenario: Storing calibrated sensor parameters and regulatory-compliant diagnostic profiles in portable ultrasound devices. IC Role / Device Role / Timing Role: Secure configuration store using OTP array and Advanced Sector Protection for tamper-resistant data. Use Value: Dual-lock OTP regions allow separate provisioning of factory calibration and field-service updates without cross-contamination. | Use Scenario: Holding BIOS and FPGA configuration bitstreams in carrier-grade wireless infrastructure equipment. IC Role / Device Role / Timing Role: High-reliability parallel flash interfaced to PowerPC or ARM-based baseband processors. Use Value: 512-byte write buffer accelerates BIOS patching; CFI compliance enables automatic detection across multi-vendor hardware platforms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S10TFI010 | Same density and core specs, but TSOP-56 package (vs. VBU BGA); no AEC-Q100 qualification | Targeted at cost-sensitive industrial PCBs where BGA assembly is unavailable | Select when board-level rework or manual inspection is required, and automotive temperature range is not needed |
| N25Q128A13ESE40F | Serial Quad SPI interface, 3 V supply, 128 Mb density; lacks parallel bus, page read, or hardware ECC | Used in space-constrained designs where pin count reduction outweighs performance loss | Select only if host MCU supports QSPI XIP and firmware size permits slower read throughput |
Compared with S29GL128S11DHVV20, the TSOP variant trades package flexibility for easier prototyping, while the serial alternative sacrifices deterministic latency and ECC for footprint savings-neither offers identical XIP performance with built-in error resilience.
Availability
S29GL128S11DHVV20 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot loader design, and medical imaging system configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL128S11DHVV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.
The GL-S family targets embedded systems needing deterministic XIP performance, robust firmware storage, and long-term data integrity-designed specifically for mission-critical boot and update applications in harsh environments.
FAQ
What is the maximum operating temperature range for S29GL128S11DHVV20?
The S29GL128S11DHVV20 is qualified to AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C. This rating is verified per Infineon's official datasheet revision *U (June 2024) and applies to the VBU BGA package variant. Thermal derating is not required within this range for standard industrial or automotive under-hood use cases.
Does S29GL128S11DHVV20 support execute-in-place (XIP) operation?
Yes, the device supports true XIP operation due to its asynchronous parallel interface, 90 ns random access time, and page-mode read capability. Host processors can fetch instructions directly from flash without copying to RAM, enabling deterministic real-time startup and reduced SRAM footprint in resource-constrained embedded systems.
How is sector protection implemented on this device?
Sector protection uses Advanced Sector Protection (ASP) with both volatile (register-based) and non-volatile (lock-bit based) methods per 128-kbyte sector. Protection can be enabled/disabled via command sequences or hardware WP# assertion. The OTP array provides additional immutable protection for critical calibration or security data.
Can S29GL128S11DHVV20 be used with a 1.8 V I/O interface?
Yes, the Versatile I/O feature supports VIO from 1.65 V to VCC. With VCC = 3.0 V, VIO may be set to 1.8 V, allowing direct interfacing to 1.8 V logic families without level shifters. This is confirmed in the "VersatileIO" timing mode specifications (tACC = 100 ns, tPACC = 25 ns) in the datasheet's Performance Summary table.
S29GL128S11DHVV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S11DHVV20 FAQ
1.How can I place an order for S29GL128S11DHVV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S11DHVV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S11DHVV20 reliable?
The price and inventory of S29GL128S11DHVV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S11DHVV20 is usually 5 days.
3.What payment methods are accepted for S29GL128S11DHVV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S11DHVV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S11DHVV20?
S29GL128S11DHVV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S11DHVV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S11DHVV20?
For technical support, including S29GL128S11DHVV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S11DHVV20 requirements.
6.How does Aetrix verify that S29GL128S11DHVV20 is sourced from the original manufacturer or authorized distributors?
All S29GL128S11DHVV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S11DHVV20 meets industry standards.
7.What is the process for return or replacement of S29GL128S11DHVV20?
All S29GL128S11DHVV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S11DHVV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S11DHVV20 part is unused and in its original packaging.
Return procedure for S29GL128S11DHVV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S11DHVV20 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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Microchip Technology
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Microchip Technology
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M24C02-FMC6TG
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Microchip Technology
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