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Infineon Technologies S29GL128S11DHVV23
- Part No.:
- S29GL128S11DHVV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S11DHVV23.pdf
- Description:
- IC FLASH 128MBIT CFI 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,941
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Product details
Overview
S29GL128S11DHVV23 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte write buffer-enabling fast embedded code storage and firmware update in microcontroller boot loaders.
For engineers reviewing the S29GL128S11DHVV23 datasheet, S29GL128S11DHVV23 pinout, S29GL128S11DHVV23 application, or S29GL128S11DHVV23 equivalent, key selection criteria include asynchronous parallel interface timing compliance, Versatile I/O voltage support (1.65 V to VCC), OTP array availability, AEC-Q100 grade options, and sector protection configuration via status register or hardware WP#.
Technical Context
This device implements an asynchronous parallel NOR flash architecture with XIP-capable read performance and data-storage-class programming efficiency. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, suspend/resume capability, and real-time status reporting via RY/BY#, data polling, or status register reads.
The 65 nm MIRRORBIT™ Eclipse process enables 100,000 program/erase cycles and 20-year data retention. The 512-byte programming buffer supports up to 256-word buffered writes, while the 128-kbyte uniform sector layout simplifies firmware partitioning and field update management in resource-constrained embedded systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words |
| Random access time | 90 ns at VCC = VIO = 3.0 V - determines worst-case instruction fetch latency in XIP boot scenarios |
| Page access time | 15 ns - enables rapid sequential reads within 32-byte aligned pages during code execution |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical firmware storage |
| Operating temperature | –40°C to +85°C (Industrial grade) - validated for use in industrial HMIs, PLCs, and gateway controllers |
| Endurance & retention | 100,000 program/erase cycles; 20 years data retention - supports long-life field deployment without refresh |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit address bus supporting full 16 MB address space (A22 = MSB) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports word-wide reads/writes only |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low control for data bus drivers during read operations |
| WE# | Write enable | Active-low strobe for latching address/data during program/erase commands |
| RY/BY# | Ready/Busy output | Open-drain status indicator: low = operation in progress, high = ready |
| WP# | Hardware write protect | Active-low input enabling volatile/non-volatile sector lock via ASP |
| VCC | Core supply | 3.0 V ±10% supply for core logic, programming, and erase functions |
| VIO | I/O supply | 1.65 V to VCC - allows interfacing with 1.8 V or 3.3 V host buses independently |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - enables direct connection to mixed-voltage SoCs without level shifters |
| 512-byte programming buffer | Reduces average programming time by >60% vs. byte/word programming in firmware update sequences |
| Hardware ECC engine | Single-bit correction on-the-fly during read - ensures firmware integrity without CPU overhead |
| Uniform 128-kbyte sectors | 128 identical sectors simplify BOM management and field update partitioning across product variants |
| OTP array (1024 bytes) | Two lockable regions store immutable keys, calibration data, or secure boot parameters |
Applications
| Industrial HMI Boot Storage | Automotive Gateway Firmware |
|---|---|
Use Scenario: Storing boot loader and kernel image for ARM Cortex-A series HMIs in factory automation panels. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and deterministic 90 ns read latency. Use Value: Eliminates external SRAM copy step during boot; supports secure firmware validation using OTP-stored public keys. | Use Scenario: Holding bootloader, CAN FD stack, and OTA update image in automotive telematics gateways. IC Role / Device Role / Timing Role: AEC-Q100 Grade 3-compliant firmware repository with suspend/resume during vehicle power transitions. Use Value: Enables safe interruptible firmware updates under battery brownout conditions without corruption risk. |
| PLC Configuration Memory | Medical Device Parameter Storage |
Use Scenario: Retaining user-configurable logic programs and I/O mapping tables in DIN-rail programmable logic controllers. IC Role / Device Role / Timing Role: Sector-protected non-volatile storage with hardware WP# and ASP for tamper-resistant parameter retention. Use Value: Prevents accidental overwrite during runtime; supports 100,000-cycle field reconfiguration over 15+ year service life. | Use Scenario: Storing calibrated sensor offsets, regulatory compliance flags, and usage logs in portable diagnostic equipment. IC Role / Device Role / Timing Role: High-reliability data archive with 20-year retention and ECC-protected read integrity. Use Value: Meets IEC 62304 Class C software requirements for persistent medical data without periodic refresh. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P11TFV23 | Same density and timing, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option | Preferred for space-constrained PCBs where board area is critical and thermal profile permits BGA reflow | Select when footprint reduction outweighs hand-solderability and test accessibility needs |
| MX29GL128FHT2I-90G | Macronix part; 90 ns access, but lacks integrated ECC and OTP array; requires external error handling | Suitable for cost-sensitive consumer applications where ECC is managed in firmware | Choose only if system-level ECC implementation is already available and OTP security is not required |
Compared with S29GL128P11TFV23, the TSOP package offers easier prototyping and boundary scan testing; versus MX29GL128FHT2I-90G, the Infineon part delivers hardware ECC and OTP security out-of-box-reducing firmware complexity and certification effort in industrial and medical designs.
Availability
S29GL128S11DHVV23 is available at Aetrix Electronics and suitable for industrial HMIs, automotive gateways, PLCs, and medical diagnostics requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant variants.
Supply support for S29GL128S11DHVV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.
The GL-S family targets embedded systems needing XIP-capable flash with robust data integrity, field-upgrade resilience, and extended temperature operation-designed specifically for boot code, firmware, and configuration storage in safety-aware environments.
FAQ
Does S29GL128S11DHVV23 support both 1.8 V and 3.3 V I/O interfaces?
Yes. Its Versatile I/O feature allows VIO to operate from 1.65 V to VCC (2.7–3.6 V), enabling direct interface with 1.8 V logic families (e.g., modern ARM SoCs) and 3.3 V microcontrollers without external level shifters. This is confirmed in Section 8.3 of the datasheet and validated across all operating modes including read, program, and erase.
What is the function of the STB pin on this device?
The STB (Strobe) pin is not present on S29GL128S11DHVV23. It appears only in certain automotive-grade variants (e.g., S29GL128SxxDHVxx with "HV" suffix) for synchronous burst mode operation. This TSOP-part uses fully asynchronous protocol; all timing is controlled by CE#, OE#, and WE# signals per the AC characteristics table on page 89 of Rev. *U.
Can the OTP array be reprogrammed after initial lock?
No. The 1024-byte OTP (One-Time Programmable) array consists of two independently lockable regions. Once a region is locked via the appropriate command sequence (0x60 → 0xD0), its contents become permanently read-only. Unlocking is not supported-this is a hardware-enforced security feature documented in Section 3.3 and verified in the Secure Silicon Region ASO map (Section 2.6).
Is hardware reset (RESET#) required before issuing commands?
Not strictly required, but strongly recommended. The RESET# pin performs a hardware reset that clears internal state machines and returns the device to reading mode. While software reset commands exist, hardware reset ensures deterministic recovery from unknown states-especially after power-up or brownout. Datasheet Section 8.5 specifies RESET# pulse width ≥100 ns and recommends asserting it for ≥1 µs after VCC stabilization.
S29GL128S11DHVV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S11DHVV23 FAQ
1.How can I place an order for S29GL128S11DHVV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S11DHVV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S11DHVV23 reliable?
The price and inventory of S29GL128S11DHVV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S11DHVV23 is usually 5 days.
3.What payment methods are accepted for S29GL128S11DHVV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S11DHVV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S11DHVV23?
S29GL128S11DHVV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S11DHVV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S11DHVV23?
For technical support, including S29GL128S11DHVV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S11DHVV23 requirements.
6.How does Aetrix verify that S29GL128S11DHVV23 is sourced from the original manufacturer or authorized distributors?
All S29GL128S11DHVV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S11DHVV23 meets industry standards.
7.What is the process for return or replacement of S29GL128S11DHVV23?
All S29GL128S11DHVV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S11DHVV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S11DHVV23 part is unused and in its original packaging.
Return procedure for S29GL128S11DHVV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S11DHVV23 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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