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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL128S11FHBV20

Name: S29GL128S11FHBV20
Brand: Infineon Technologies
SKU: S29GL128S11FHBV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL128S11FHBV20

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL128S11FHBV20.pdf

Description:: IC FLASH 128MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL128S11FHBV20 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte write buffer-enabling fast in-system programming for boot code storage in microcontroller-based embedded systems.

For engineers reviewing the S29GL128S11FHBV20 datasheet, S29GL128S11FHBV20 pinout, S29GL128S11FHBV20 application, or S29GL128S11FHBV20 equivalent, key selection criteria include asynchronous parallel interface timing compliance, OTP array availability for secure configuration, Versatile I/O voltage support (1.65 V to VCC), and AEC-Q100 grade 3 qualification for automotive control modules.

Technical Context

This device implements an asynchronous parallel interface with CE#, OE#, and WE# control signals, supporting word-aligned 16-bit transfers and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.

The flash uses 65 nm MIRRORBIT™ Eclipse technology with uniform 128-kbyte sectors, internal hardware ECC (single-bit correction), and advanced sector protection (ASP) with volatile/non-volatile locking per sector. It includes a dedicated 1024-byte one-time-programmable (OTP) array split into two lockable regions for secure boot or calibration data storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	128 Mb (16 MB) - supports full firmware image storage for mid-complexity MCU applications
Interface type	Asynchronous parallel ×16 - enables direct connection to legacy microcontroller address/data buses without glue logic
Random access time	90 ns at VCC = VIO - meets real-time boot latency requirements for industrial PLCs and automotive ECUs
Page access time	15 ns - accelerates sequential instruction fetch during XIP execution from flash
Erase cycle endurance	100,000 cycles - ensures reliable field updates over 10+ years in telematics or gateway modules
Data retention	20 years - guarantees long-term integrity of stored calibration parameters or security keys
Operating temperature	–40°C to +85°C (Industrial grade) - validated for under-hood and factory-floor deployment
I/O voltage range	1.65 V to VCC - allows interoperability with mixed-voltage SoC interfaces (e.g., 1.8 V I/O with 3.3 V core)

Pinout & Package

Package: 56-ball VBU Fortified BGA (9 mm × 7 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address inputs	23-bit word address bus (AMAX = A22 for 128 Mb); supports 16-MB linear addressing with word alignment
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; operates at VIO (1.65 V to VCC) for flexible host interfacing
CE#	Chip enable	Active-low chip select; controls device power state and enables read/write/erase command execution
OE#	Output enable	Active-low output gate; isolates DQ bus during standby or when multiple devices share data lines
WE#	Write enable	Active-low write strobe; initiates program or erase command latching and data loading into write buffer
RY/BY#	Ready/Busy indicator	Open-drain active-low signal; asserts low during embedded operations (program/erase) for hardware flow control
RESET#	Hardware reset	Active-low asynchronous reset; forces device into known state and aborts ongoing operations
WP#	Write protect	Active-low hardware sector lock; prevents accidental program/erase of protected sectors independent of software commands

Key Features

Feature	Design Value
512-byte programming buffer	Enables single-command multi-word programming up to 512 bytes, reducing host CPU overhead by >70% vs. byte-by-byte writes
Hardware ECC (single-bit correction)	Internal circuitry detects and corrects single-bit errors on-the-fly during read, eliminating need for external error-handling firmware
Uniform 128-kbyte sectors	Allows precise firmware partitioning (e.g., bootloader, app, config) with deterministic erase times (477 kBps typical)
Dedicated 1024-byte OTP array	Two independently lockable regions store immutable security keys or factory calibration data, resistant to field reprogramming
Versatile I/O (VIO)	Supports 1.65 V to VCC I/O voltage-enables direct interface with 1.8 V or 3.3 V host processors without level shifters
Common Flash Interface (CFI)	Standardized parameter table enables automatic driver detection and configuration in U-Boot, Linux MTD, and RTOS BSPs

Applications

Automotive Engine Control Unit

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated engine maps, diagnostic routines, and bootloader code in AEC-Q100 Grade 3 ECU.

IC Role / Device Role / Timing Role: Non-volatile boot memory with XIP-capable page-mode read for deterministic startup timing.

Use Value: 90 ns random access and 15 ns page access ensure sub-100 ms cold-boot time; OTP region secures calibration checksums against tampering.

Use Scenario: Holding firmware, configuration tables, and HMI assets in DIN-rail mounted programmable logic controllers.

IC Role / Device Role / Timing Role: Parallel flash memory providing direct bus interface to ARM Cortex-M7 host with no external bus controller.

Use Value: 100,000 erase cycles and 20-year retention guarantee operational reliability across 15-year product lifecycles in factory automation.

Medical Imaging Bootloader

Smart Grid Communication Module

Use Scenario: Hosting secure bootloader and FPGA configuration bitstream in FDA-cleared imaging equipment.

IC Role / Device Role / Timing Role: Trusted boot source with hardware ECC and OTP-locked root-of-trust keys.

Use Value: Internal ECC eliminates uncorrectable read errors during critical boot sequence; ASP allows field-upgradable application partitions while protecting bootloader sector.

Use Scenario: Storing protocol stacks (DLMS/COSEM, IEC 61850), encryption keys, and firmware in ANSI C12.18-compliant smart meters.

IC Role / Device Role / Timing Role: High-reliability non-volatile storage with sector-level protection for regulatory-compliant field updates.

Use Value: 128-kbyte uniform sectors align with firmware update packet sizes; Versatile I/O simplifies integration with 1.8 V RF SoCs in dual-band communication modules.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL128S10TFIV20	Same die, TSOP-56 package (vs. VBU BGA); 100 ns random access (vs. 90 ns); identical OTP, ECC, and sector architecture	Preferred for cost-sensitive, space-tolerant designs where PCB real estate permits larger footprint and manual assembly is acceptable	Select when board layout constraints allow TSOP and thermal profile favors through-hole or wave-solder compatibility
MX29GL128FDTI-90G	Micron 128 Mb parallel NOR; 90 ns access; no integrated hardware ECC; requires external error management; different CFI layout and command set	Suitable for legacy systems already using Micron-compatible drivers but lacks ECC-driven reliability for safety-critical boot paths	Choose only if existing firmware stack is tightly coupled to Micron command sequences and ECC is handled in software

Compared with S29GL128S11FHBV20, the TSOP variant trades packaging flexibility for identical functionality, while the Micron alternative sacrifices hardware ECC and CFI compatibility-making Infineon's part preferable for new designs requiring robustness, security, and standardized driver support.

Availability

S29GL128S11FHBV20 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLC firmware storage, medical imaging bootloaders, and smart grid communication modules requiring stable component supply across extended product lifecycles.

Supply support for S29GL128S11FHBV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems requiring deterministic boot performance, long-term data integrity, and automotive-grade qualification-designed specifically for ECU, industrial control, and medical device firmware storage.

FAQ

Does S29GL128S11FHBV20 support execute-in-place (XIP) operation?

Yes, it supports XIP via fast page-mode reads (15 ns) and low-latency random access (90 ns), enabling direct instruction execution from flash without copying to RAM. The 32-byte aligned page structure and asynchronous interface allow predictable timing for real-time interrupt response in automotive and industrial applications.

What is the function of the STB pin on S29GL128S11FHBV20?

The STB (Standby) pin is not present on this device. The S29GL128S11FHBV20 uses CE# and RESET# for power-state control; standby mode is entered automatically when CE# is deasserted, drawing only 100 µA. No separate STB signal exists in the VBU BGA pinout per Infineon's official datasheet Rev. *U.

Can the OTP array be reprogrammed after initial programming?

No. The 1024-byte OTP array consists of two lockable regions that can be permanently secured after programming. Once locked (via specific command sequence), neither region accepts further writes-even with full VPP voltage-ensuring cryptographic keys or calibration data remain immutable throughout the device's lifetime.

Is AEC-Q100 Grade 2 qualification available for this specific part number?

No. S29GL128S11FHBV20 is qualified to AEC-Q100 Grade 3 (–40°C to +85°C). Grade 2 (–40°C to +105°C) is offered in other variants like S29GL128S11FHBI20 (same package, higher temp grade), but this exact orderable part number is specified exclusively for industrial and Grade 3 automotive use per Infineon's ordering matrix in datasheet section 13.3.

S29GL128S11FHBV20 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL128S11FHBV20 FAQ

1.How can I place an order for S29GL128S11FHBV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S11FHBV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S11FHBV20 reliable?

The price and inventory of S29GL128S11FHBV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S11FHBV20 is usually 5 days.

3.What payment methods are accepted for S29GL128S11FHBV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S11FHBV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S11FHBV20?

S29GL128S11FHBV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S11FHBV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S11FHBV20?

For technical support, including S29GL128S11FHBV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S11FHBV20 requirements.

6.How does Aetrix verify that S29GL128S11FHBV20 is sourced from the original manufacturer or authorized distributors?

All S29GL128S11FHBV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S11FHBV20 meets industry standards.

7.What is the process for return or replacement of S29GL128S11FHBV20?

All S29GL128S11FHBV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S11FHBV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S11FHBV20 part is unused and in its original packaging.

Return procedure for S29GL128S11FHBV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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