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Infineon Technologies S29GL128S11FHBV23

Part No.:
S29GL128S11FHBV23
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL128S11FHBV23.pdf
Description:
IC FLASH 128MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,515

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Product details

Overview

S29GL128S11FHBV23 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte programming buffer-used in boot code storage and firmware update in embedded microcontroller systems.

For engineers reviewing the S29GL128S11FHBV23 datasheet, S29GL128S11FHBV23 pinout, S29GL128S11FHBV23 application, or S29GL128S11FHBV23 equivalent, key selection criteria include asynchronous parallel interface timing, Versatile I/O voltage range (1.65 V to VCC), OTP array support, CFI compliance, and AEC-Q100 grade availability for automotive control modules.

Technical Context

This device implements an asynchronous parallel NOR flash architecture with XIP-capable read performance: initial random access reads a full 32-byte aligned page, followed by 15 ns sub-page accesses within the same page using low-order address bits only. The embedded algorithm controller (EAC) manages all program/erase operations-including suspend/resume-and interfaces with status register, data polling, and RY/BY# signaling.

Hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention; the 1024-byte OTP array supports two lockable regions for secure configuration or calibration data storage. Sector protection uses both volatile (via status register) and non-volatile (via command sequence) methods per 128-kbyte sector.

Key Specifications

ParameterValue and Actual Design Meaning
Density128 Mb (16 MB) - supports full boot image and application firmware in space-constrained embedded hosts
InterfaceAsynchronous parallel ×16 - enables direct CPU bus connection without translation logic
Access Time90 ns random / 15 ns page - meets real-time boot latency requirements for industrial controllers
Erase UnitUniform 128-kbyte sectors - simplifies firmware partitioning and field update management
Programming Buffer512-byte write buffer - reduces effective programming time by up to 4× vs. single-word writes
ECCInternal hardware single-bit correction - eliminates need for external error-handling firmware layer
Endurance100,000 program/erase cycles - qualifies for 10+ years of field firmware updates in deployed equipment
Data Retention20 years at +85°C - ensures long-term reliability in uncooled industrial enclosures

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AB footprint with 0.5 mm pitch.

Pin/TerminalCircuit RoleDesign Meaning
A0–A22Address inputs23-bit word address bus (AMAX = A22 for 128 Mb); supports 32-byte page-aligned addressing
DQ0–DQ15Data I/O16-bit bidirectional data bus; compatible with 16-bit microprocessor data paths
CE#Chip enableActive-low chip select; controls device power state and bus contention
OE#Output enableActive-low read strobe; gates output drivers during read cycles
WE#Write enableActive-low write strobe; initiates command latching and embedded operations
RY/BY#Ready/busy indicatorOpen-drain active-low signal indicating internal operation progress
RESET#Hardware resetActive-low asynchronous reset that halts ongoing program/erase and clears status
VCCCore supply3.0 V ±10% supply for core logic and flash array (2.7 V to 3.6 V operational range)
VIOI/O supplyIndependent 1.65 V to VCC I/O voltage - enables interfacing with mixed-voltage SoCs

Key Features

FeatureDesign Value
Versatile I/O (VIO)Independent 1.65 V to VCC I/O rail allows seamless integration with 1.8 V or 3.3 V host processors without level shifters
Page Mode Read15 ns access within 32-byte pages reduces average read latency in sequential instruction fetch scenarios
Embedded Algorithm ControllerOn-die state machine handles all program/erase/suspend/resume sequences - no host CPU overhead required
Advanced Sector ProtectionVolatile and non-volatile locking per 128-kbyte sector prevents accidental firmware overwrite during field updates
CFI ComplianceStandard Common Flash Interface table enables automatic driver detection and configuration in U-Boot/Linux kernel environments

Applications

Industrial PLC Firmware StorageAutomotive Body Control Module

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating in factory-floor environments.

IC Role / Device Role / Timing Role: Non-volatile parallel NOR flash providing XIP-capable instruction execution and fast random access for deterministic startup.

Use Value: 90 ns random access and hardware ECC ensure reliable boot within 500 ms while tolerating EMI-induced bit flips in noisy industrial settings.

Use Scenario: Holding calibrated sensor parameters and safety-critical firmware in body control units certified to AEC-Q100 Grade 2 (–40°C to +105°C).

IC Role / Device Role / Timing Role: Automotive-grade parallel flash with OTP lockable regions for permanent calibration data and secure firmware signature storage.

Use Value: 100,000 erase cycles and 20-year retention meet OEM requirements for 15-year vehicle service life without field reprogramming failure.

Medical Diagnostic Imaging Boot MemoryNetwork Equipment Configuration Storage

Use Scenario: Hosting boot firmware and FPGA configuration bitstreams in portable ultrasound and MRI subsystems requiring rapid cold-start capability.

IC Role / Device Role / Timing Role: High-reliability parallel flash with suspend/resume support enabling safe firmware updates during system maintenance windows.

Use Value: 512-byte programming buffer cuts update time by >70% versus legacy single-word writes, reducing downtime during regulatory-mandated field patches.

Use Scenario: Storing switch/router configuration tables, MAC address pools, and secure boot keys in carrier-grade Ethernet switches.

IC Role / Device Role / Timing Role: CFI-compliant NOR flash used as primary configuration store with hardware ECC protecting against cosmic-ray-induced corruption.

Use Value: Independent VIO rail (1.8 V) matches switch ASIC I/O voltage, eliminating level-shifter components and PCB area in high-port-density designs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL128S10TFBHI0Same density and architecture, but 64-ball LAE BGA (9 mm × 9 mm) package and 100 ns random accessTargeted at space-constrained, high-pin-count PCBs where TSOP routing is impracticalSelect when board layout requires BGA footprint and thermal profile permits 100 ns timing margin
MX29GL128FPTI-90GMicron-compatible pinout and command set; 90 ns access, but no integrated hardware ECC or OTP arrayUsed where external ECC handling is acceptable and cost sensitivity outweighs security featuresChoose only if existing firmware already implements software ECC and OTP emulation via reserved sectors

Compared with S29GL128S11FHBV23, the TSOP-packaged alternative offers identical timing and feature set in legacy-compatible form factor, while the Micron part trades ECC/OTP for lower unit cost and broader second-source availability-requiring firmware-level compensation.

Availability

S29GL128S11FHBV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive body control modules, medical diagnostic imaging boot memory, and network equipment configuration storage requiring stable component supply across extended product lifecycles.

Supply support for S29GL128S11FHBV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems requiring deterministic boot performance, field-upgradable firmware, and long-term data integrity-designed specifically for industrial automation, automotive ECUs, and medical electronics.

FAQ

Does S29GL128S11FHBV23 support both 1.8 V and 3.3 V I/O interfaces?

Yes. Its Versatile I/O (VIO) feature supports independent I/O supply from 1.65 V to VCC, enabling direct connection to 1.8 V microcontrollers or 3.3 V FPGAs without external level shifters. VIO must be powered within this range and may differ from VCC, which remains fixed at 2.7–3.6 V for core operation.

Can the 1024-byte OTP array be reprogrammed after locking?

No. Once either of the two OTP regions is locked via the dedicated lock command, its contents become permanently immutable-even after power cycle or reset. Unlocking is not supported. This ensures cryptographic keys or calibration data remain tamper-proof throughout the device's lifetime.

What is the minimum sector size that can be erased independently?

The device supports only uniform 128-kbyte sector erase; there is no smaller erasable unit such as block or page erase. Each sector must be erased as a whole before reprogramming, and sector protection can be applied individually to prevent accidental erasure during firmware updates.

Is hardware reset (RESET#) required before power-on initialization?

No. Power-on reset (POR) is handled internally and automatically asserts RESET# for ≥100 µs upon VCC ramp. External RESET# assertion is optional and used only for emergency recovery-such as aborting a corrupted erase operation or clearing status flags after unexpected power loss.

S29GL128S11FHBV23 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
64-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
8M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
110 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (13x11)

S29GL128S11FHBV23 FAQ

1.How can I place an order for S29GL128S11FHBV23 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S11FHBV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S11FHBV23 reliable?

The price and inventory of S29GL128S11FHBV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S11FHBV23 is usually 5 days.

3.What payment methods are accepted for S29GL128S11FHBV23?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S11FHBV23 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S11FHBV23?

S29GL128S11FHBV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S11FHBV23 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S11FHBV23?

For technical support, including S29GL128S11FHBV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S11FHBV23 requirements.

6.How does Aetrix verify that S29GL128S11FHBV23 is sourced from the original manufacturer or authorized distributors?

All S29GL128S11FHBV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S11FHBV23 meets industry standards.

7.What is the process for return or replacement of S29GL128S11FHBV23?

All S29GL128S11FHBV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S11FHBV23, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S11FHBV23 part is unused and in its original packaging.

Return procedure for S29GL128S11FHBV23:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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