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Infineon Technologies S29GL128S11FHIV10
- Part No.:
- S29GL128S11FHIV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S11FHIV10.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,158
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Product details
Overview
S29GL128S11FHIV10 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial controllers.
For engineers reviewing the S29GL128S11FHIV10 datasheet, S29GL128S11FHIV10 pinout, S29GL128S11FHIV10 application, or S29GL128S11FHIV10 equivalent, key selection criteria include its uniform 128 kB sector erase architecture, 512-byte write buffer, Versatile I/O (1.65–VCC), AEC-Q100 Grade 2 qualification, and TSOP-56/LAA/LAE/VBU package compatibility.
Technical Context
This device implements asynchronous parallel interface timing with dedicated CE#, OE#, and WE# control lines, supporting both standard word programming and multi-word buffered writes up to 512 bytes. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status reporting via status register, data polling, and RY/BY# pin.
The flash array is organized into uniform 128 kB sectors, each individually erasable, and includes a separate 1024-byte OTP array with dual lockable regions. Internal hardware ECC corrects single-bit errors on-the-fly during read operations without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words |
| Random access time | 90 ns at VCC = VIO - determines minimum CPU wait-state insertion for reliable read |
| Page access time | 15 ns - enables fast sequential reads within 32-byte aligned pages |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Single-bit error correction - ensures data integrity without external error-handling logic |
| Operating temperature | –40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2) - validated for under-hood automotive use |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - supports long-life embedded deployments |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm, 0.5 mm pitch, JEDEC MO-141AC compliant. Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit address bus; A22 is MSB for 128 Mb (2²³ = 8,388,608 words) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports word-wide reads/writes only |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state |
| WE# | Write enable | Active-low write strobe; initiates program/erase commands and data latching |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal indicating ongoing embedded operation completion |
| VCC | Core supply | 2.7–3.6 V single supply powering core logic, array, and EAC |
| VIO | I/O supply | 1.65–VCC versatile I/O voltage - decouples interface level from core rail |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse technology | Enables higher density and lower power vs. legacy floating-gate NOR, with improved endurance |
| Asynchronous 32-byte page read | Reduces average read latency for instruction fetch sequences in XIP applications |
| Automatic suspend/resume | Allows interrupting erase or program operations to service high-priority reads |
| Advanced sector protection (ASP) | Supports volatile (power-on reset) and non-volatile (permanent) locking per 128 kB sector |
| Common Flash Interface (CFI) | Enables OS- and tool-agnostic firmware update and identification without hard-coded drivers |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in engine management systems requiring AEC-Q100 Grade 2 compliance. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable random access and deterministic 90 ns read latency. Use Value: Enables direct execution from flash without RAM copy, reducing BOM cost and boot time while meeting automotive thermal and reliability requirements. | Use Scenario: Holding configuration tables, ladder logic, and safety-critical firmware in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: High-reliability firmware repository with 100,000-cycle endurance and 20-year data retention. Use Value: Eliminates need for external ECC logic or redundant storage, simplifying design and extending field service life. |
| Medical Diagnostic Imaging Boot ROM | Avionics Display System Code Storage |
Use Scenario: Secure boot image storage in CT/MRI subsystems where firmware integrity and long-term stability are regulated by IEC 62304. IC Role / Device Role / Timing Role: OTP-protected primary boot memory with hardware ECC and sector-level write protection. Use Value: Meets Class C software safety requirements by preventing unauthorized modification and detecting latent bit errors before execution. | Use Scenario: Storing display firmware and graphics assets in DO-178C-certified cockpit displays operating across –40°C to +105°C. IC Role / Device Role / Timing Role: Temperature-hardened parallel NOR flash with guaranteed timing margins under extreme thermal cycling. Use Value: Avoids timing violations during cold-start or rapid ambient shifts, ensuring deterministic boot and rendering initialization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S11TFIV10 | Same die, 64-ball LAA Fortified BGA (13 mm × 11 mm) instead of TSOP-56 | Preferred for space-constrained PCBs with BGA routing; lacks leaded package for manual rework | Select when board layout prioritizes density over serviceability and thermal mass |
| MX29GL128FHT2I-90G | Macronix 128 Mb parallel NOR; 90 ns access, but no integrated ECC or Versatile I/O | Requires external ECC handling and fixed 3.3 V I/O; not AEC-Q100 qualified | Choose only for cost-sensitive industrial designs where ECC is implemented in software or FPGA |
Compared with S29GL128S11FHIV10, the LAA BGA variant offers identical functionality in a smaller footprint but sacrifices hand-solderability, while the Macronix part reduces cost but removes hardware ECC and automotive qualification-requiring additional system-level mitigation.
Availability
S29GL128S11FHIV10 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware updates, and medical imaging boot ROM replacement requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL128S11FHIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for mission-critical applications.
The GL-S family targets high-reliability embedded systems needing XIP-capable parallel NOR flash with integrated ECC, sector protection, and AEC-Q100 qualification-designed specifically for automotive, industrial, and medical firmware storage.
FAQ
What is the function of the Versatile I/O (VIO) feature?
VIO allows independent voltage supply (1.65 V to VCC) for the DQ0–DQ15, CE#, OE#, WE#, and RY/BY# pins. This decouples interface signaling from core logic voltage, enabling seamless integration with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters-reducing BOM count and signal integrity risk.
Does S29GL128S11FHIV10 support execute-in-place (XIP)?
Yes-it supports true XIP operation due to fast 90 ns random access and asynchronous interface. The device delivers instruction words directly to the processor bus without buffering or translation, enabling immediate execution from flash memory in boot ROM and firmware applications.
How does the 512-byte write buffer improve programming efficiency?
The buffer accepts up to 512 bytes (256 words) in a single command sequence, reducing overhead from repeated command issuance. At 1.5 MBps effective rate, it cuts total programming time by ~70% versus single-word programming-critical for field firmware updates and manufacturing provisioning.
Is the OTP array accessible after locking?
Once locked, the 1024-byte OTP array's two regions become permanently read-only and cannot be reprogrammed-even with hardware reset or power cycle. Unlocking requires factory-level fuse blowing; post-lock access is read-only with full ECC protection, making it suitable for secure keys and calibration data.
S29GL128S11FHIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL128S11FHIV10 FAQ
1.How can I place an order for S29GL128S11FHIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S11FHIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S11FHIV10 reliable?
The price and inventory of S29GL128S11FHIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S11FHIV10 is usually 5 days.
3.What payment methods are accepted for S29GL128S11FHIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S11FHIV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S11FHIV10?
S29GL128S11FHIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S11FHIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S11FHIV10?
For technical support, including S29GL128S11FHIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S11FHIV10 requirements.
6.How does Aetrix verify that S29GL128S11FHIV10 is sourced from the original manufacturer or authorized distributors?
All S29GL128S11FHIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S11FHIV10 meets industry standards.
7.What is the process for return or replacement of S29GL128S11FHIV10?
All S29GL128S11FHIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S11FHIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S11FHIV10 part is unused and in its original packaging.
Return procedure for S29GL128S11FHIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S11FHIV10 Tags
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