Infineon Technologies S29GL128S11FHVV23
- Part No.:
- S29GL128S11FHVV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S11FHVV23.pdf
- Description:
- IC FLASH 128MBIT CFI 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,433
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Product details
Overview
S29GL128S11FHVV23 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.
For engineers reviewing the S29GL128S11FHVV23 datasheet, S29GL128S11FHVV23 pinout, S29GL128S11FHVV23 application, or S29GL128S11FHVV23 equivalent, key selection criteria include its 128-kbyte uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), OTP array for secure configuration, and AEC-Q100 Grade 2 qualification (–40°C to +105°C).
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard and page-mode reads. Its embedded algorithm controller handles autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability during active programming or erasing.
The internal architecture includes a 32-byte page read buffer, 128-kbyte uniform sector layout, dedicated 1024-byte OTP array with dual lockable regions, and Common Flash Interface (CFI) compliance for host software identification and configuration. ECC logic operates transparently during read cycles without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mb (16 MB) - supports full firmware images for mid-range MCUs |
| Interface | Parallel ×16 asynchronous - enables direct XIP execution without external translation logic |
| Random Access Time | 90 ns at VCC = VIO - meets real-time boot latency requirements for industrial controllers |
| Page Access Time | 15 ns - accelerates sequential instruction fetch within same 32-byte aligned page |
| Write Buffer Size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC Support | Internal hardware single-bit correction - eliminates need for external error-handling firmware overhead |
| Endurance | 100,000 program/erase cycles - suitable for field-upgradable firmware with infrequent updates |
| Data Retention | 20 years - ensures long-term reliability in unpowered storage applications |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | Word-aligned address lines; A22 is MSB for 128 Mb (2²³ words) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports Versatile I/O (1.65–3.6 V) |
| CE# | Chip Enable | Active-low device select; controls power-down entry when deasserted |
| OE# | Output Enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write Enable | Active-low control for write/program/erase command latching |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations |
| RESET# | Hardware Reset | Active-low global reset; clears internal state and aborts ongoing operations |
| WP# | Write Protect | Hardware sector protection enable; disables program/erase when asserted |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse technology | Enables higher density and lower power vs. older floating-gate NOR, with improved endurance |
| Asynchronous 32-byte page read | Reduces average instruction fetch latency in XIP applications by minimizing address setup overhead |
| 512-byte programming buffer | Increases effective write bandwidth to 1.5 MBps, cutting firmware update time by >5× vs. single-word programming |
| Hardware ECC with single-bit correction | Guarantees data integrity without software overhead or external error-correcting logic |
| 1024-byte OTP array with dual lockable regions | Supports secure boot keys and calibration data storage with irreversible write-lock capability |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and safety-critical firmware in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory providing deterministic 90 ns read access for MCU instruction fetch. Use Value: Uniform 128-kbyte sectors allow safe over-the-air updates with atomic sector swap; 20-year retention ensures lifetime firmware integrity without refresh. | Use Scenario: Hosting boot code and sensor calibration tables in radar ECU modules certified to AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with hardware reset recovery and RY/BY# status signaling for fail-safe boot sequencing. Use Value: Integrated ECC and OTP lock prevent corruption of safety-critical parameters; Versatile I/O accommodates mixed-voltage SoC interfaces. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Storing diagnostic firmware and hardware initialization routines in FDA-regulated imaging equipment with strict data integrity requirements. IC Role / Device Role / Timing Role: Secure, high-reliability boot memory with CFI-compliant identification and sector-level write protection. Use Value: Dual-lock OTP regions store cryptographic keys and calibration offsets separately; ASP allows selective sector locking during service mode. | Use Scenario: Holding FPGA configuration bitstreams and runtime parameter tables in carrier-grade 5G baseband units requiring hot-swap resilience. IC Role / Device Role / Timing Role: High-speed parallel flash with suspend/resume capability to maintain system responsiveness during background firmware updates. Use Value: 512-byte buffer enables concurrent processing while updating configuration; 100,000-cycle endurance supports frequent field reconfiguration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S10TFIV20 | Same density and core specs, but TSOP-56 package (not BGA); no AEC-Q100 qualification | Targeted at cost-sensitive industrial boards where PCB space permits larger footprint | Select for legacy designs using through-hole or standard surface-mount assembly processes |
| N25Q128A13ESE40F | 128 Mb Quad SPI interface, not parallel; lacks hardware ECC and OTP array | Used where serial interface suffices and MCU supports QSPI XIP with cache assist | Choose only if board redesign allows replacing parallel bus with quad-SPI and firmware supports ECC emulation |
Compared with S29GL128S10TFIV20, this VBU BGA variant offers superior thermal performance and smaller footprint for space-constrained automotive modules; versus N25Q128A13ESE40F, it provides deterministic timing, native ECC, and OTP security-critical for safety-certified boot paths.
Availability
S29GL128S11FHVV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL128S11FHVV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems needing fast, secure, and long-life parallel NOR flash for boot code and firmware storage in harsh environments.
FAQ
Does S29GL128S11FHVV23 support execute-in-place (XIP) operation?
Yes. The device supports true XIP operation due to its asynchronous parallel interface and 90 ns random access time, enabling microcontrollers to fetch instructions directly from flash without copying to RAM. Page-mode reads further accelerate sequential execution within 32-byte boundaries, and CFI compliance allows automatic configuration by host boot ROM.
What is the function of the RY/BY# pin, and how is it used in system design?
The RY/BY# pin is an open-drain ready/busy status output that goes low during embedded program or erase operations and returns high upon completion. It enables hardware polling without CPU intervention and can be wired to an interrupt input for event-driven flow control. Its use eliminates the need for continuous status register reads, reducing bus contention and improving system responsiveness during firmware updates.
How does the Versatile I/O feature benefit mixed-voltage system integration?
Versatile I/O allows independent VIO supply (1.65–3.6 V) separate from VCC (2.7–3.6 V), enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic families without level shifters. This simplifies PCB routing, reduces BOM count, and improves signal integrity in heterogeneous SoC designs-especially critical in automotive ECUs where multiple voltage domains coexist.
Can the 1024-byte OTP array be used for storing cryptographic keys in secure boot implementations?
Yes. The OTP array is divided into two independently lockable 512-byte regions, each programmable once and permanently secured via fuse-based locking. This supports separation of public boot code metadata and private cryptographic keys, meeting requirements for secure boot chains in industrial and automotive applications where tamper resistance and immutability are mandatory.
S29GL128S11FHVV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL128S11FHVV23 FAQ
1.How can I place an order for S29GL128S11FHVV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S11FHVV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S11FHVV23 reliable?
The price and inventory of S29GL128S11FHVV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S11FHVV23 is usually 5 days.
3.What payment methods are accepted for S29GL128S11FHVV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S11FHVV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S11FHVV23?
S29GL128S11FHVV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S11FHVV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S11FHVV23?
For technical support, including S29GL128S11FHVV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S11FHVV23 requirements.
6.How does Aetrix verify that S29GL128S11FHVV23 is sourced from the original manufacturer or authorized distributors?
All S29GL128S11FHVV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S11FHVV23 meets industry standards.
7.What is the process for return or replacement of S29GL128S11FHVV23?
All S29GL128S11FHVV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S11FHVV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S11FHVV23 part is unused and in its original packaging.
Return procedure for S29GL128S11FHVV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S11FHVV23 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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