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Infineon Technologies S29GL128S11TFIV10
- Part No.:
- S29GL128S11TFIV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL128S11TFIV10.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:179
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Product details
Overview
S29GL128S11TFIV10 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware update storage in industrial control and automotive infotainment systems.
For engineers reviewing the S29GL128S11TFIV10 datasheet, S29GL128S11TFIV10 pinout, S29GL128S11TFIV10 application, or S29GL128S11TFIV10 equivalent, key selection criteria include its 128-kbyte uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and TSOP-56 package compatibility.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supports both standard and page-mode reads, and uses embedded algorithms for program/erase operations without external timing control. Its internal state machine handles command execution, status reporting via RY/BY# pin or status register, and automatic ECC generation/correction during read cycles.
The architecture includes a dedicated 1024-byte OTP array with two lockable regions, Advanced Sector Protection (volatile/non-volatile), suspend/resume capability for program and erase, and CFI-compliant parameter tables enabling host software auto-configuration. All operations are compatible with JEDEC-standard command sets.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words - defines maximum firmware image size and boot partition capacity. |
| Random access time | 90 ns at VCC = VIO - enables direct XIP execution from flash with minimal CPU stall cycles. |
| Page access time | 15 ns - accelerates sequential instruction fetch within 32-byte aligned pages. |
| Write buffer size | 512 bytes (256 words) - reduces effective programming time by batching writes and minimizing command overhead. |
| ECC support | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot paths. |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - ensures long-term reliability in unattended industrial deployments. |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive ECUs and high-ambient industrial HMIs. |
| Supply voltage | VCC = 2.7–3.6 V, VIO = 1.65–VCC - allows interfacing with mixed-voltage SoCs without level shifters. |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I), 14 mm × 20 mm, 0.5 mm pitch, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | Word-aligned address bus (23 bits); A22 is MSB for 128 Mb density - determines maximum addressable space. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads - matches ARM Cortex-M/A series external memory interfaces. |
| CE# | Chip enable | Active-low chip select; controls device power state and bus contention - used for memory-mapped peripheral decoding. |
| OE# | Output enable | Active-low read strobe; gates output drivers - enables shared bus operation with other peripherals. |
| WE# | Write enable | Active-low write strobe; initiates program/erase commands - synchronized with address/data setup/hold timing. |
| RY/BY# | Ready/Busy indicator | Open-drain status output; low during embedded operations - provides hardware flow control without polling overhead. |
| RESET# | Hardware reset | Active-low asynchronous reset; clears internal state and aborts ongoing operations - critical for safe power-cycle recovery. |
| WP# | Write protect | Active-low hardware sector protection enable - prevents accidental erase/write during system startup or brown-out. |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse technology | Enables higher density and lower active current vs. older floating-gate NOR, reducing thermal load in sealed enclosures. |
| Asynchronous 32-byte page read | Reduces average instruction fetch latency by >6× compared to full random access when executing contiguous code. |
| Uniform 128-kbyte sector erase | Supports deterministic firmware update partitioning with fixed-size erase blocks - simplifies bootloader design and OTA validation. |
| Separate 1024-byte OTP array | Stores immutable keys, calibration data, or serial numbers; dual lockable regions prevent runtime corruption of critical fields. |
| Common Flash Interface (CFI) | Allows runtime detection of geometry, timing, and command set - eliminates hard-coded flash initialization in BSPs. |
| Versatile I/O voltage range | VIO = 1.65–VCC enables direct connection to 1.8 V, 2.5 V, or 3.3 V logic without external translators - lowers BOM count. |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, driver-assist logic, and fail-safe boot images in digital instrument clusters. IC Role / Device Role / Timing Role: Non-volatile boot ROM and runtime firmware store; executes XIP code with ≤90 ns latency to meet ASIL-B timing constraints. Use Value: AEC-Q100 Grade 2 qualification and hardware ECC ensure functional safety compliance without software-level redundancy overhead. | Use Scenario: Holding ladder logic firmware, configuration parameters, and field-upgradeable motion control algorithms in programmable logic controllers. IC Role / Device Role / Timing Role: Primary firmware storage with sector-level write protection; supports hot firmware swap via suspend/resume during runtime. Use Value: 128-kbyte uniform sectors and 512-byte write buffer enable atomic firmware updates with <50 ms erase time per sector. |
| Medical Diagnostic Display Boot | Telecom Base Station Configuration |
Use Scenario: Hosting secure boot loader, UI assets, and regulatory-compliant diagnostic firmware in portable ultrasound displays. IC Role / Device Role / Timing Role: Trusted boot source with OTP-locked cryptographic keys; verified via hardware ECC before code execution. Use Value: Internal ECC and OTP region eliminate need for external secure element in Class II medical device designs. | Use Scenario: Storing FPGA bitstreams, radio calibration tables, and protocol stack configurations in 5G remote radio units. IC Role / Device Role / Timing Role: High-reliability configuration store with CFI auto-detection - adapts to multiple FPGA vendors' memory mapping requirements. Use Value: Versatile I/O (1.65–3.6 V) allows direct interface with 1.8 V FPGA I/O banks, avoiding level-shifter components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P11TFIV10 | Same density and package, but lacks hardware ECC and OTP array - uses legacy MIRRORBIT™ (not Eclipse) process. | Not suitable for safety-critical boot storage requiring ECC; limited to non-safety firmware storage. | Select only if cost sensitivity outweighs ECC requirement and AEC-Q100 Grade 2 is not mandated. |
| MX29GL128FHT2I-90G | 128 Mb parallel NOR, 90 ns access, but no Versatile I/O (fixed 3.3 V I/O), no OTP, and no suspend/resume support. | Cannot interface directly with 1.8 V SoCs; unsuitable for dynamic firmware updates requiring operation suspension. | Choose only for legacy 3.3 V-only designs where OTP and suspend/resume are unused. |
Compared with S29GL128P11TFIV10 and MX29GL128FHT2I-90G, the S29GL128S11TFIV10 uniquely combines AEC-Q100 Grade 2, hardware ECC, Versatile I/O, and suspend/resume - making it the only option qualified for automotive boot and industrial hot-update use cases.
Availability
S29GL128S11TFIV10 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical diagnostic displays, and telecom base stations requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL128S11TFIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for safety-critical and high-reliability applications.
The GL-S family targets automotive and industrial embedded systems requiring robust, high-density parallel NOR flash with advanced data integrity features - specifically designed for XIP-capable boot storage and field-upgradable firmware.
FAQ
What is the difference between S29GL128S11TFIV10 and S29GL128S11TFIV20?
The suffix 'V10' indicates AEC-Q100 Grade 2 qualification (–40°C to +105°C), while 'V20' denotes Grade 3 (–40°C to +85°C). Both share identical electrical specs, pinout, and feature set, but only V10 is rated for under-hood automotive environments requiring higher thermal tolerance.
Does S29GL128S11TFIV10 support burst reads or synchronous operation?
No - it is strictly asynchronous and does not support burst reads or clocked interfaces. All read operations are initiated by CE#, OE#, and address setup; timing is governed by tACC and tPACC specifications, not a clock signal.
Can the OTP region be reprogrammed after locking?
No - once either OTP lock bit is set, that 512-byte region becomes permanently read-only. The lock bits themselves are one-time programmable and cannot be cleared, ensuring cryptographic key or calibration data immutability.
Is hardware reset (RESET#) required before every power-on sequence?
Yes - the device requires a valid RESET# pulse (≥100 ns low) after VCC stabilizes to initialize internal logic and clear pending status flags. Skipping this may result in undefined behavior or failed command execution during early boot.
S29GL128S11TFIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL128S11TFIV10 FAQ
1.How can I place an order for S29GL128S11TFIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S11TFIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S11TFIV10 reliable?
The price and inventory of S29GL128S11TFIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S11TFIV10 is usually 5 days.
3.What payment methods are accepted for S29GL128S11TFIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S11TFIV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S11TFIV10?
S29GL128S11TFIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S11TFIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S11TFIV10?
For technical support, including S29GL128S11TFIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S11TFIV10 requirements.
6.How does Aetrix verify that S29GL128S11TFIV10 is sourced from the original manufacturer or authorized distributors?
All S29GL128S11TFIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S11TFIV10 meets industry standards.
7.What is the process for return or replacement of S29GL128S11TFIV10?
All S29GL128S11TFIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S11TFIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S11TFIV10 part is unused and in its original packaging.
Return procedure for S29GL128S11TFIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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