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Infineon Technologies S29GL128S11TFIV20
- Part No.:
- S29GL128S11TFIV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL128S11TFIV20.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:601
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Product details
Overview
S29GL128S11TFIV20 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 3.0 V core supply, ×16 data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring reliable non-volatile program execution.
For engineers reviewing the S29GL128S11TFIV20 datasheet, S29GL128S11TFIV20 pinout, S29GL128S11TFIV20 application, or S29GL128S11TFIV20 equivalent, key selection criteria include its 128-kbyte uniform sector erase granularity, 512-byte programming buffer, Versatile I/O (1.65 V to VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant interface.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, suspend/resume capability, and status reporting via status register, data polling, or RY/BY# pin.
The flash array is organized into uniform 128-kbyte sectors, each independently erasable. Internal hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention and flagging uncorrectable multi-bit errors via status bits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mb (16 MB); supports full boot image storage for mid-size microcontrollers. |
| Random Access Time | 90 ns at VCC = VIO; enables fast XIP execution in real-time firmware. |
| Page Access Time | 15 ns; allows rapid sequential reads within 32-byte aligned pages. |
| Programming Buffer | 512 bytes; reduces effective programming time by batching writes per operation. |
| ECC | Internal hardware single-bit correction; eliminates need for external error-handling logic. |
| Endurance | 100,000 program/erase cycles; suitable for field-upgradable firmware with moderate update frequency. |
| Data Retention | 20 years at 85°C; ensures long-term reliability in industrial environments. |
| Operating Temp | –40°C to +105°C (AEC-Q100 Grade 2); qualified for under-hood automotive and high-temp industrial use. |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | 23-bit word address bus (A22 = MSB); supports full 128 Mb address space (2²³ × 16-bit). |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates at VIO voltage (1.65 V to VCC) independent of core supply. |
| CE# | Chip Enable | Active-low chip select; controls device power state and command latching timing (tCE = 90 ns max). |
| OE# | Output Enable | Active-low read strobe; gates output drivers during read cycles (tOE = 25 ns max). |
| WE# | Write Enable | Active-low write strobe; initiates command sequences and data loading for program/erase. |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations, high when ready for next command. |
| RESET# | Hardware Reset | Active-low asynchronous reset; forces device into known state and aborts ongoing operations. |
| VCC | Core Supply | 3.0 V ±0.3 V supply (2.7–3.6 V); powers core logic, EAC, and internal voltage generators. |
| VIO | I/O Supply | Independent I/O voltage (1.65–VCC); enables interfacing with mixed-voltage host systems. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns cycle time improves sequential instruction fetch efficiency. |
| 512-Byte Programming Buffer | Reduces average programming time by up to 4× vs. single-word writes in firmware update scenarios. |
| Hardware ECC Engine | Single-bit correction on every read without CPU overhead or latency penalty. |
| Uniform 128-kB Sector Erase | Enables deterministic erase scheduling and wear leveling across 128 independent sectors. |
| Suspend/Resume Capability | Allows interrupting long erase operations to service higher-priority reads or commands. |
| CFI Parameter Table | Standardized JEDEC-compliant descriptor enables automatic driver configuration in bootloader environments. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory providing deterministic 90 ns read latency for hard real-time task initialization. Use Value: 20-year data retention and 100K-cycle endurance ensure firmware integrity over 15+ year product lifecycles without refresh. | Use Scenario: Hosting safety-critical boot code for radar processing units in advanced driver assistance systems. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel NOR flash enabling secure, fast boot from cold start at –40°C to +105°C. Use Value: Integrated ECC and sector protection prevent corruption-induced boot failures in mission-critical automotive functions. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Storing diagnostic firmware and calibration tables in portable ultrasound devices subject to frequent thermal cycling. IC Role / Device Role / Timing Role: High-reliability boot memory with hardware ECC and Versatile I/O supporting 1.8 V host interfaces. Use Value: 128-kB uniform sectors allow atomic firmware updates without disrupting active imaging sessions. | Use Scenario: Holding FPGA configuration bitstreams and system management firmware in 5G base station remote radio units. IC Role / Device Role / Timing Role: Parallel interface flash with suspend/resume capability enabling background reconfiguration during live traffic. Use Value: 512-byte programming buffer accelerates field upgrades while minimizing service window duration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P11TFIV20 | Same density and package, but uses older 90 nm process; 110 ns random access, no Versatile I/O (VIO fixed to VCC). | Lacks 1.65–VCC I/O flexibility and slower access limits XIP performance in latency-sensitive designs. | Select only if legacy compatibility or cost sensitivity outweighs speed and interface flexibility needs. |
| MX29GL128FPTI-90G | Micron 128 Mb parallel NOR; 90 ns access, but no integrated ECC and only 10K erase cycles. | Requires external error detection logic and has significantly lower endurance for frequent field updates. | Prefer only in cost-constrained, low-update-frequency applications where ECC is handled externally. |
Compared with S29GL128P11TFIV20 and MX29GL128FPTI-90G, the S29GL128S11TFIV20 offers superior XIP latency, built-in ECC, higher endurance, and flexible I/O voltage - making it optimal for safety-critical, high-reliability embedded boot applications.
Availability
S29GL128S11TFIV20 is available at Aetrix Electronics and suitable for industrial control systems, automotive ADAS modules, medical imaging platforms, and telecom infrastructure requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL128S11TFIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.
The GL-S family targets embedded systems requiring robust, high-speed parallel NOR flash for XIP boot code and firmware storage - emphasizing endurance, ECC, and AEC-Q100 qualification.
FAQ
What is the maximum operating voltage range for VIO on S29GL128S11TFIV20?
The VIO supply accepts 1.65 V to VCC (up to 3.6 V), enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters. This Versatile I/O feature is confirmed in the datasheet's Distinctive Characteristics section and electrical specifications table.
Does S29GL128S11TFIV20 support true XIP (execute-in-place) operation?
Yes - its 90 ns random access time and asynchronous parallel interface enable direct CPU instruction fetch from flash without copying to RAM. The datasheet explicitly states it "combines the best features of eXecute-In-Place (XIP) and data storage flash memories" in the Product Overview section.
How many uniform sectors does S29GL128S11TFIV20 contain, and what is their size?
It contains exactly 128 uniform sectors, each 128 kbytes in size, totaling 16 MB (128 Mb). This is verified in the Distinctive Characteristics section ("Sector erase – Uniform 128-kbyte sectors") and confirmed by the address space map (2²³ words × 2 bytes = 16 MB).
Is hardware reset (RESET#) required for reliable power-on initialization?
Yes - the datasheet specifies that RESET# must be asserted for ≥100 ns after VCC reaches stable operating voltage to ensure proper internal state initialization and avoid undefined behavior. This requirement is documented in Section 11.3 (Power-on reset and warm reset).
S29GL128S11TFIV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL128S11TFIV20 FAQ
1.How can I place an order for S29GL128S11TFIV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S11TFIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S11TFIV20 reliable?
The price and inventory of S29GL128S11TFIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S11TFIV20 is usually 5 days.
3.What payment methods are accepted for S29GL128S11TFIV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S11TFIV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S11TFIV20?
S29GL128S11TFIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S11TFIV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S11TFIV20?
For technical support, including S29GL128S11TFIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S11TFIV20 requirements.
6.How does Aetrix verify that S29GL128S11TFIV20 is sourced from the original manufacturer or authorized distributors?
All S29GL128S11TFIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S11TFIV20 meets industry standards.
7.What is the process for return or replacement of S29GL128S11TFIV20?
All S29GL128S11TFIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S11TFIV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S11TFIV20 part is unused and in its original packaging.
Return procedure for S29GL128S11TFIV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S11TFIV20 Tags
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