Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL128S11TFVV20

Name: S29GL128S11TFVV20
Brand: Infineon Technologies
SKU: S29GL128S11TFVV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL128S11TFVV20

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL128S11TFVV20.pdf

Description:: IC FLASH 128MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,492

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL128S11TFVV20 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, supports Versatile I/O (1.65–VCC), delivers 90 ns random access and 15 ns page access, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.

For engineers reviewing the S29GL128S11TFVV20 datasheet, S29GL128S11TFVV20 pinout, S29GL128S11TFVV20 application, or S29GL128S11TFVV20 equivalent, key selection criteria include 128-Mb density, 56-ball VBU Fortified BGA (9 mm × 7 mm) package, 100,000 program/erase cycles, industrial temperature grade (–40°C to +85°C), and CFI-compliant command set for firmware update compatibility.

Technical Context

This device implements asynchronous parallel interface logic with dedicated CE#, OE#, and WE# control lines, supporting both standard word programming and 512-byte buffer programming. Its embedded algorithm controller (EAC) manages sector erase (128 kB uniform sectors), suspend/resume, and automatic ECC generation/correction during read and write operations.

The architecture features a 32-byte page-aligned read path, where initial access fetches a full page in 90 ns, and subsequent intra-page reads complete in 15 ns. The status register, data polling, and RY/BY# pin provide three independent methods to monitor operation completion-critical for real-time firmware update sequencing in safety-critical embedded systems.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	128 Mb (16 MB); provides sufficient space for full bootloader + firmware image in resource-constrained industrial controllers.
Interface Type	Asynchronous parallel ×16; enables direct CPU bus connection without glue logic or translation layers.
Random Access Time	90 ns at VCC = VIO; ensures sub-100 ns instruction fetch latency for XIP execution in ARM Cortex-M or RISC-V SoCs.
Page Access Time	15 ns; allows rapid sequential reads within 32-byte aligned pages-critical for tight-loop code execution.
Programming Buffer	512 bytes; reduces effective programming time by >3× vs. single-word writes, accelerating field firmware updates.
ECC Support	Hardware single-bit correction; eliminates need for external ECC logic or software overhead in mission-critical storage.
Endurance & Retention	100,000 program/erase cycles / 20-year data retention; meets long-lifecycle requirements for industrial automation equipment.

Pinout & Package

Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, industrial-grade thermal profile.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address Inputs	23-bit address bus supporting full 128 Mb addressing (word-aligned, A22 = MSB); no byte-enable required.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports both read and write transfers with configurable VIO (1.65–VCC).
CE#	Chip Enable	Active-low chip select; must be asserted before OE#/WE# to enable device operation and reduce standby current.
OE#	Output Enable	Active-low read strobe; controls output drivers only-does not affect internal state or timing of ongoing erase/program.
WE#	Write Enable	Active-low write strobe; initiates command latching or data loading into internal registers/buffer.
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during embedded operations (erase/program), high when ready for next command.
RESET#	Hardware Reset	Active-low asynchronous reset; forces device into reading ID mode and aborts pending operations safely.
WP#	Write Protect	Hardware sector protection enable; disables program/erase commands to protected sectors when asserted.

Key Features

Feature	Design Value
Versatile I/O (VIO)	Independent 1.65–VCC I/O voltage range allows seamless interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters.
512-byte Programming Buffer	Enables burst programming of up to 512 bytes per command-reducing firmware update time by minimizing command overhead.
Uniform 128-kB Sector Erase	Eliminates complex block management; simplifies over-the-air (OTA) update partitioning and wear leveling in embedded Linux or RTOS environments.
Hardware ECC	Single-bit error correction performed transparently in hardware-no CPU intervention or latency penalty during read operations.
Secure Silicon Region (OTP)	1024-byte one-time-programmable array with two lockable regions; stores cryptographic keys or calibration data with irreversible write protection.

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot loader and safety-critical firmware in programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability; serves as first-stage boot device accessed directly by ARM Cortex-R5F during power-on reset.

Use Value: 90 ns random access and hardware ECC ensure deterministic boot timing and immunity to bit flips in electrically noisy plant-floor environments.

Use Scenario: Holding boot firmware and sensor fusion algorithms for automotive camera ECU in Level 2+ ADAS systems.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 (–40°C to +105°C) flash memory providing secure, high-reliability boot code storage with OTP key storage.

Use Value: 100,000 erase cycles and 20-year retention meet ISO 26262 ASIL-B requirements for functional safety lifetime validation.

Medical Imaging System BIOS

Telecom Base Station Configuration

Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound and MRI subsystems requiring regulatory traceability.

IC Role / Device Role / Timing Role: Dual-role memory: executes boot code via XIP and stores calibrated transducer parameters in OTP region.

Use Value: Separate 1024-byte OTP array with two lockable regions enables HIPAA-compliant secure storage of device-specific calibration data.

Use Scenario: Storing FPGA configuration images and runtime configuration tables in 5G remote radio units operating in outdoor cabinets.

IC Role / Device Role / Timing Role: High-density, low-power parallel flash used for cold-start FPGA reconfiguration and dynamic parameter loading over SPI bridge.

Use Value: 100 µA standby current and industrial temperature rating ensure stable operation across –40°C to +85°C ambient swings without thermal throttling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL128P11TFIV20	Same density and package, but uses legacy 90 nm process; lacks Versatile I/O (fixed VIO = VCC) and hardware ECC.	Not suitable for mixed-voltage designs or safety-critical applications requiring ECC.	Select only if cost sensitivity outweighs I/O flexibility and reliability requirements.
MX29GL128FPTI-90G	128 Mb parallel NOR flash from Macronix; 90 ns access, no integrated ECC, supports CFI but no OTP array.	Lacks secure silicon region and hardware ECC-requires external error handling in firmware.	Consider for cost-driven consumer applications where security and ECC are managed in software.

Compared with S29GL128P11TFIV20 and MX29GL128FPTI-90G, the S29GL128S11TFVV20 uniquely combines Versatile I/O, hardware ECC, and OTP security in a 56-ball VBU package-making it the only option meeting industrial safety and mixed-voltage design constraints without external components.

Availability

S29GL128S11TFVV20 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S29GL128S11TFVV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.

The GL-S family targets embedded systems needing robust, high-speed parallel NOR flash with advanced data integrity features-including XIP-capable boot memory for safety-certified applications.

FAQ

Is S29GL128S11TFVV20 pin-compatible with earlier S29GL128P variants?

No. While both use 56-ball VBU packages, S29GL128S11TFVV20 adds dedicated WP# and RESET# pins not present in S29GL128P, and its VIO voltage domain requires separate I/O rail routing. PCB redesign is required for migration.

Does this device support Quad SPI or other serial interfaces?

No. S29GL128S11TFVV20 is strictly a parallel ×16 interface device with CE#, OE#, and WE# control lines. It does not implement SPI, QSPI, or any serial protocol-only asynchronous parallel read/write and CFI-compliant command sets.

What is the function of the STB pin shown in the block diagram?

The STB (Strobe) pins are internal test signals used during wafer-level testing and are not bonded out or accessible on the S29GL128S11TFVV20 package. They have no user-facing functionality and are omitted from the pinout table.

Can the OTP region be erased or rewritten after programming?

No. The 1024-byte OTP array is physically one-time programmable. Once a bit is set to '0', it cannot be reverted to '1'. Each of the two lockable regions can be permanently locked via dedicated CFI commands, preventing further writes even under debug access.

S29GL128S11TFVV20 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL128S11TFVV20 FAQ

1.How can I place an order for S29GL128S11TFVV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S11TFVV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S11TFVV20 reliable?

The price and inventory of S29GL128S11TFVV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S11TFVV20 is usually 5 days.

3.What payment methods are accepted for S29GL128S11TFVV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S11TFVV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S11TFVV20?

S29GL128S11TFVV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S11TFVV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S11TFVV20?

For technical support, including S29GL128S11TFVV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S11TFVV20 requirements.

6.How does Aetrix verify that S29GL128S11TFVV20 is sourced from the original manufacturer or authorized distributors?

All S29GL128S11TFVV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S11TFVV20 meets industry standards.

7.What is the process for return or replacement of S29GL128S11TFVV20?

All S29GL128S11TFVV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S11TFVV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S11TFVV20 part is unused and in its original packaging.

Return procedure for S29GL128S11TFVV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

2026-06-27 Machine Vision System: Components, Inspection Applications and Integration Guide

Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

2026-06-23 Electronic Devices and Circuits: Fundamentals, Components and Applications

Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…