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Infineon Technologies S29GL128S13FAEV13
- Part No.:
- S29GL128S13FAEV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S13FAEV13.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,050
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Product details
Overview
S29GL128S13FAEV13 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC using 65-nm MIRRORBIT™ technology, operating from a single 2.7–3.6 V supply with military-grade temperature range (–55°C to +125°C). It delivers 100 ns random access time, 15 ns page access time, and integrates hardware ECC for single-bit error correction. Used in avionics control modules requiring nonvolatile code storage and field-upgradable firmware.
For engineers reviewing the S29GL128S13FAEV13 datasheet, S29GL128S13FAEV13 pinout, S29GL128S13FAEV13 application, or S29GL128S13FAEV13 equivalent, key selection factors include its 128 KB uniform sector erase architecture, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65 V to VCC), CFI compliance, and military-grade reliability for embedded systems with long-life requirements.
Technical Context
This device implements an asynchronous parallel interface with x16 data bus and dedicated CE#, OE#, and WE# control signals. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, supporting suspend/resume for both programming and sector erase.
The flash array is organized into uniform 128 KB sectors (128 total for 128 Mb density), with separate 1024-byte OTP region featuring two lockable zones. Internal hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mb (16 MB) - supports full boot code and application image storage in space-constrained military platforms |
| Supply Voltage | 2.7 V to 3.6 V - enables direct integration with 3.3 V system rails without level-shifting |
| Random Access Time | 100 ns - meets real-time interrupt response timing in flight control firmware execution |
| Page Access Time | 15 ns - accelerates sequential instruction fetch during boot or diagnostic routines |
| Write Buffer Size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC Capability | Single-bit error correction - ensures data integrity over 20-year retention without external error-handling logic |
| Endurance | 100,000 program/erase cycles - supports frequent field updates in mission-critical reprogramming scenarios |
| Temperature Range | –55°C to +125°C - qualified for operation in unheated aircraft bays and engine-mounted electronics |
Pinout & Package
Package: 56-lead TSOP (Thin Small Outline Package), 14 mm × 20 mm × 1.2 mm, JEDEC standard MO-141AC, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 128 Mb linear addressing (A0 = LSB) |
| DQ0–DQ15 | Data I/O | x16 bidirectional data bus; supports 1.65–3.6 V I/O voltage via VIO pin |
| CE# | Chip Enable | Active-low enable controlling device selection in multi-chip memory configurations |
| OE# | Output Enable | Active-low signal gating output drivers during read operations only |
| WE# | Write Enable | Active-low control for write buffer loading and embedded program/erase initiation |
| VCC | Core Supply | 2.7–3.6 V power for core logic and flash array; no separate VPP required |
| VIO | I/O Supply | Independent 1.65–VCC voltage rail enabling mixed-voltage system interfacing |
| RY/BY# | Ready/Busy Output | Open-drain status indicator signaling active embedded operations (low = busy) |
Key Features
| Feature | Design Value |
|---|---|
| 65-nm MIRRORBIT™ Technology | Enables higher density and lower power vs. older floating-gate NOR, reducing thermal load in sealed enclosures |
| Asynchronous 32-byte Page Read | Improves burst instruction fetch efficiency without clock synchronization overhead |
| Advanced Sector Protection (ASP) | Supports volatile/non-volatile locking per sector, preventing accidental firmware overwrite during maintenance |
| Secure Silicon Region (OTP) | 1024-byte one-time-programmable area with dual lockable regions for calibration data or cryptographic keys |
| CFI Parameter Table | Enables automatic detection and configuration by host bootloader without hard-coded timing parameters |
| Suspend/Resume Commands | Allows interruption of long sector erase (≈250 ms) to service high-priority interrupts, then resume seamlessly |
Applications
| Avionics Flight Control Unit | Tactical Radio Firmware Storage |
|---|---|
Use Scenario: Stores boot loader, real-time OS kernel, and flight control algorithms in airborne computing units subject to extreme thermal cycling. IC Role / Device Role / Timing Role: Nonvolatile code storage with deterministic 100 ns read latency ensuring worst-case interrupt response under MIL-STD-810H conditions. Use Value: 20-year data retention and 100K endurance guarantee firmware integrity across aircraft service life without refresh. | Use Scenario: Holds encrypted waveform images and secure boot certificates in handheld military radios deployed in desert and arctic environments. IC Role / Device Role / Timing Role: Secure firmware repository with OTP region protecting cryptographic keys and ASP-enabled sector lockdown during field updates. Use Value: –55°C to +125°C operation eliminates need for heater-cooler subsystems, reducing SWaP-C. |
| Missile Guidance System Memory | Ground Vehicle Mission Computer |
Use Scenario: Retains guidance trajectory tables and sensor calibration coefficients in inertially stabilized missile seekers exposed to high-G launch shock. IC Role / Device Role / Timing Role: Radiation-tolerant (up to 100 krad(Si)) parallel NOR flash serving as primary program memory with ECC-protected reads. Use Value: Hardware ECC corrects single-bit upsets induced by cosmic rays, avoiding software-level scrubbing overhead. | Use Scenario: Hosts vehicle health monitoring firmware and CAN bus protocol stacks in armored combat vehicles with wide ambient temperature swings. IC Role / Device Role / Timing Role: High-reliability code storage interfaced directly to PowerPC or ARM-based mission processors via x16 bus. Use Value: Versatile I/O (1.65–3.6 V) allows direct connection to 1.8 V or 3.3 V processor buses without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX29GL128FHI-90G | 90 ns random access time; no integrated ECC; 10-year data retention | Lacks hardware error correction; requires external ECC management in safety-critical systems | Select when cost sensitivity outweighs ECC requirement and retention >10 years is sufficient |
| JS28F128J3F-90G | Intel StrataFlash; 90 ns tACC; supports 1.8 V I/O only; no OTP region | Requires 1.8 V I/O rail; lacks secure silicon region for key storage | Choose for legacy Intel architecture compatibility where OTP and wide VIO are not needed |
Compared with MX29GL128FHI-90G and JS28F128J3F-90G, the S29GL128S13FAEV13 provides superior radiation tolerance, built-in ECC, longer retention, and broader I/O voltage flexibility-critical for new-design military platforms requiring zero-error firmware execution.
Availability
S29GL128S13FAEV13 is available at Aetrix Electronics and suitable for avionics flight control units, tactical radio firmware storage, and missile guidance system memory requiring stable component supply across extended product lifecycles.
Supply support for S29GL128S13FAEV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for industrial and defense applications.
The GL-S series targets military and aerospace systems requiring extended temperature operation, long-term data retention, and robust embedded programming features-designed specifically for code storage in safety-critical real-time environments.
FAQ
Does S29GL128S13FAEV13 support synchronous read mode?
No. This device implements an asynchronous parallel interface only, with no clock input. All timing is controlled by CE#, OE#, and WE# signal edges. Synchronous operation is not supported per the datasheet Rev. *E specification.
What is the purpose of the VIO pin?
The VIO pin supplies the I/O buffer voltage independently from VCC, enabling operation across 1.65 V to VCC. This allows direct interfacing with 1.8 V or 3.3 V host processors without external level shifters, simplifying board design in mixed-voltage systems.
Can the OTP region be erased after programming?
No. The 1024-byte Secure Silicon Region is one-time programmable. Once written, individual bits cannot be reset or erased. Each of the two lockable regions can be permanently locked via PPB bits to prevent further writes.
Is the RY/BY# pin compatible with standard open-drain bus wiring?
Yes. RY/BY# is an open-drain output requiring an external pull-up resistor. It drives low during active program/erase operations and floats high when idle, allowing wired-OR connection with other status indicators on shared system buses.
S29GL128S13FAEV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 130 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL128S13FAEV13 FAQ
1.How can I place an order for S29GL128S13FAEV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S13FAEV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S13FAEV13 reliable?
The price and inventory of S29GL128S13FAEV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S13FAEV13 is usually 5 days.
3.What payment methods are accepted for S29GL128S13FAEV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S13FAEV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S13FAEV13?
S29GL128S13FAEV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S13FAEV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S13FAEV13?
For technical support, including S29GL128S13FAEV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S13FAEV13 requirements.
6.How does Aetrix verify that S29GL128S13FAEV13 is sourced from the original manufacturer or authorized distributors?
All S29GL128S13FAEV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S13FAEV13 meets industry standards.
7.What is the process for return or replacement of S29GL128S13FAEV13?
All S29GL128S13FAEV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S13FAEV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S13FAEV13 part is unused and in its original packaging.
Return procedure for S29GL128S13FAEV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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