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Infineon Technologies S29GL128S90DHA010

Part No.:
S29GL128S90DHA010
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL128S90DHA010.pdf
Description:
IC FLASH 128MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,804

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Product details

Overview

S29GL128S90DHA010 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 3.0 V core supply, ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C), used for XIP-capable firmware storage in embedded microcontroller boot systems.

For engineers reviewing the S29GL128S90DHA010 datasheet, S29GL128S90DHA010 pinout, S29GL128S90DHA010 application, or S29GL128S90DHA010 equivalent, key selection criteria include asynchronous read timing, 512-byte write buffer performance, sector-level erase granularity, ECC-enabled data integrity, and Versatile I/O voltage compatibility (1.65 V to VCC).

Technical Context

This device implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling simultaneous bit-line sensing for higher density and lower power. It supports asynchronous page-mode reads (32-byte aligned pages) and embeds hardware-based single-bit ECC correction without software overhead.

The embedded algorithm controller handles all program/erase operations autonomously, including suspend/resume capability, status register polling, and ready/busy# signaling. Sector protection includes volatile and non-volatile lock bits plus a dedicated 1024-byte OTP array with two lockable regions.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density128 Mb (16 MB), organized as 1,048,576 × 16-bit words
Random access time90 ns at VCC = VIO, enabling fast instruction fetch in XIP applications
Page access time15 ns for subsequent 32-byte page reads, reducing average latency in burst code execution
Write buffer size512 bytes (256 words), allowing single-command programming of full page without host intervention
ECC supportOn-die single-bit error correction with automatic detection and correction during read
Endurance & retention100,000 program/erase cycles and 20-year data retention at 85°C
Operating voltageVCC = 2.7 V to 3.6 V; VIO = 1.65 V to VCC, supporting mixed-voltage system interfacing

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), standard JEDEC MO-141AC footprint, 20.0 mm × 10.16 mm × 1.2 mm height, lead-free and RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A22Address inputs23-bit address bus supporting 16-MB word-addressable space (A22 MSB active)
DQ0–DQ15Data I/O16-bit bidirectional data bus; supports 1.65 V to VCC I/O voltage range
CE#Chip enableActive-low chip select; controls device power state and command decoding
OE#Output enableActive-low control for data bus output drivers during read operations
WE#Write enableActive-low strobe for latching address/data during program/erase commands
RY/BY#Ready/Busy indicatorOpen-drain output signaling internal operation progress (low = busy)
RESET#Hardware resetActive-low input that aborts ongoing operations and returns device to read mode
WP#Write protectHardware sector protection enable; low = sectors locked against program/erase

Key Features

FeatureDesign Value
Asynchronous page-mode read32-byte aligned page access with 15 ns cycle time after initial 90 ns latency
Embedded program/erase algorithmsFully autonomous execution with suspend/resume support for real-time system responsiveness
Hardware ECC engineSingle-bit correction per 512-byte sector without CPU intervention or latency penalty
Advanced sector protectionVolatile and non-volatile locking per uniform 128-kB sector, plus OTP array with dual lock regions
Common Flash Interface (CFI)Standardized parameter table enabling OS/driver auto-configuration and cross-platform compatibility

Applications

Industrial PLC Firmware StorageAutomotive Instrument Cluster Boot Memory

Use Scenario: Storing boot code and configuration data in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable firmware storage with deterministic 90 ns read access for real-time task initialization.

Use Value: Eliminates external RAM copy step during boot; 20-year data retention ensures field reliability without recalibration.

Use Scenario: Holding calibrated display firmware and safety-critical UI assets in automotive digital instrument clusters.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified boot memory supporting rapid cold-start (<500 ms) via fast page-mode reads.

Use Value: Hardware ECC prevents silent corruption of gauge rendering code; ASP enables secure OTA update partitioning.

Medical Imaging System ConfigurationTelecom Baseband Processor Code Storage

Use Scenario: Retaining calibration profiles and regulatory-compliant image processing parameters in portable ultrasound devices.

IC Role / Device Role / Timing Role: Secure, long-life parameter storage with OTP region for immutable regulatory signatures.

Use Value: Dual-lock OTP prevents unauthorized firmware modification; 100K-cycle endurance supports field recalibration over device lifetime.

Use Scenario: Hosting baseband processor firmware in 4G/5G small cell radios requiring high-reliability code execution.

IC Role / Device Role / Timing Role: High-speed parallel NOR flash enabling zero-wait-state execution directly from memory.

Use Value: 15 ns page access reduces instruction fetch bottleneck; Versatile I/O allows direct interface to 1.8 V FPGA logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL128P90TFI010Same density and timing, but 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP optionTargeted at space-constrained PCB layouts where board area is prioritized over manual assemblySelect when footprint miniaturization and thermal performance outweigh through-hole assembly needs
MX29GL128FPTI-90GMacronix part with identical 128 Mb ×16, 90 ns access, but lacks on-die ECC and OTP arrayRequires external ECC handling and software-managed protection; lower BOM cost but higher validation effortSelect only if system-level ECC is already implemented and OTP security is not required

Compared with S29GL128P90TFI010, this TSOP variant offers easier prototyping and rework; versus MX29GL128FPTI-90G, it delivers integrated data integrity and secure provisioning without host CPU overhead.

Availability

S29GL128S90DHA010 is available at Aetrix Electronics and suitable for industrial control systems, automotive instrument clusters, medical imaging devices, and telecom baseband modules requiring stable component supply across extended product lifecycles.

Supply support for S29GL128S90DHA010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems requiring deterministic XIP performance, long-term data integrity, and automotive-grade qualification - designed specifically for firmware storage where code correctness and uptime are critical.

FAQ

What is the maximum operating temperature range for S29GL128S90DHA010?

This part is specified for industrial grade operation from –40°C to +85°C, with full electrical performance guaranteed across that range. It does not support the +105°C industrial-plus or automotive grade 2 variants, which require different ordering codes (e.g., S29GL128S90DHI010).

Does S29GL128S90DHA010 support hardware reset recovery without power cycling?

Yes. The RESET# pin provides asynchronous hardware reset: asserting it low aborts any active program or erase operation, clears internal state machines, and returns the device to read mode within 100 µs - no VCC interruption required.

Can the 512-byte write buffer be used across sector boundaries?

No. Programming must remain within a single 128-kB sector. Attempting buffer writes spanning sector boundaries triggers an error condition; the device will halt programming and set status bit 4 (VPP error) in the status register.

Is the CFI table accessible without issuing a command sequence?

Yes. The Common Flash Interface parameter table is mapped into the device's address space starting at offset 0x0055 (within the ID-CFI ASO region) and is readable using standard asynchronous read cycles - no command unlock sequence needed.

S29GL128S90DHA010 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
64-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
8M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
90 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (9x9)

S29GL128S90DHA010 FAQ

1.How can I place an order for S29GL128S90DHA010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S90DHA010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S90DHA010 reliable?

The price and inventory of S29GL128S90DHA010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S90DHA010 is usually 5 days.

3.What payment methods are accepted for S29GL128S90DHA010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S90DHA010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S90DHA010?

S29GL128S90DHA010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S90DHA010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S90DHA010?

For technical support, including S29GL128S90DHA010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S90DHA010 requirements.

6.How does Aetrix verify that S29GL128S90DHA010 is sourced from the original manufacturer or authorized distributors?

All S29GL128S90DHA010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S90DHA010 meets industry standards.

7.What is the process for return or replacement of S29GL128S90DHA010?

All S29GL128S90DHA010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S90DHA010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S90DHA010 part is unused and in its original packaging.

Return procedure for S29GL128S90DHA010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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