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Infineon Technologies S29GL128S90DHA013

Name: S29GL128S90DHA013
Brand: Infineon Technologies
SKU: S29GL128S90DHA013
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL128S90DHA013

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL128S90DHA013.pdf

Description:: IC FLASH 128MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL128S90DHA013 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 3.0 V core supply, ×16 data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring AEC-Q100 Grade 3 qualification (–40°C to +85°C).

For engineers reviewing the S29GL128S90DHA013 datasheet, S29GL128S90DHA013 pinout, S29GL128S90DHA013 application, or S29GL128S90DHA013 equivalent, this device supports asynchronous XIP-capable read, 512-byte buffer programming, uniform 128-kB sector erase, and Versatile I/O (1.65 V to VCC) for mixed-voltage system interfacing.

Technical Context

This parallel NOR flash implements an embedded algorithm controller (EAC) that executes autonomous program/erase operations without external timing control. Its architecture supports page-mode reads (32-byte aligned), status register polling, RY/BY# pin signaling, and CFI-compliant identification - enabling plug-and-play compatibility with standard flash-aware bootloaders.

The device integrates on-die ECC logic, automatic error detection and correction during read, and advanced sector protection (ASP) with volatile/non-volatile lock options per 128-kB sector. It also includes a dedicated 1024-byte OTP array with two independently lockable regions for secure configuration or calibration data storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	128 Mb (16 MB), organized as 1,048,576 × 16-bit words - sufficient for full firmware images in mid-tier microcontrollers.
Random access time	90 ns at VCC = VIO - enables direct execution (XIP) from flash with minimal CPU wait states in real-time systems.
Page access time	15 ns - accelerates sequential instruction fetch within 32-byte pages, improving effective throughput over standard NOR.
Programming buffer	512 bytes (256 words) - reduces total programming time by batching writes, critical for field firmware updates.
ECC capability	On-chip single-bit error correction - eliminates need for external ECC logic or software overhead in safety-critical applications.
Sector size	Uniform 128 kB sectors - simplifies partitioning for bootloader, application, and parameter storage with deterministic erase granularity.
Endurance & retention	100,000 program/erase cycles; 20-year data retention - meets long-life requirements for industrial and automotive ECUs.

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint. Compatible with automated PCB assembly and legacy socketed designs.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address inputs	23-bit address bus supporting full 128 Mb addressing (AMAX = A22); word-aligned only - no byte enable required.
DQ0–DQ15	Data I/O bus	16-bit bidirectional data path; supports Versatile I/O (VIO = 1.65 V to VCC) for interfacing with 1.8 V/2.5 V/3.3 V controllers.
CE#	Chip enable	Active-low chip select; controls device power state - deassertion places flash in low-power standby (100 µA).
OE#	Output enable	Active-low read strobe; gates output drivers during read - enables shared bus operation with other peripherals.
WE#	Write enable	Active-low write strobe; initiates internal command latching and embedded program/erase sequences.
RY/BY#	Ready/Busy indicator	Open-drain output; low during active program/erase, high when ready - provides hardware flow control without polling.
RESET#	Hardware reset	Active-low asynchronous reset; forces device into known state and aborts ongoing operations - critical for fail-safe recovery.
WP#	Write protect	Active-low hardware sector lock; enables physical write inhibition independent of software protection mechanisms.

Key Features

Feature	Design Value
Asynchronous page-mode read	32-byte aligned access with 15 ns intra-page latency - improves instruction fetch bandwidth by >3× vs. random access.
Embedded Algorithm Controller (EAC)	Self-timed program/erase execution - removes external timing constraints and simplifies host firmware driver design.
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands - enables automatic flash detection and configuration in U-Boot/Linux MTD stacks.
Advanced Sector Protection (ASP)	Volatile and non-volatile locking per 128-kB sector - supports secure bootloader partitioning and field-upgrade isolation.
Secure OTP array	1024-byte one-time-programmable region with dual lock bits - stores immutable keys, calibration constants, or device serial numbers.

Applications

Industrial PLC Firmware Storage

Automotive Body Control Module (BCM)

Use Scenario: Storing boot code and application firmware in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 90 ns latency.

Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity across 15+ year product lifecycles without refresh.

Use Scenario: Holding calibrated sensor parameters, CAN protocol stack, and diagnostic routines in AEC-Q100 Grade 3 qualified BCMs.

IC Role / Device Role / Timing Role: Secure, sector-protected flash for safety-critical configuration data and firmware with hardware write-protection (WP#).

Use Value: Integrated ECC and ASP prevent corruption from ESD or voltage transients - meeting ISO 26262 ASIL-B functional safety requirements.

Medical Diagnostic Imaging Bootloader

Telecom Base Station Configuration

Use Scenario: Hosting certified bootloader and FPGA bitstream in portable ultrasound or MRI subsystems requiring regulatory traceability.

IC Role / Device Role / Timing Role: Trusted boot source with OTP-locked security keys and CFI-verified identity for secure boot chain validation.

Use Value: Dual-lock OTP region ensures cryptographic keys remain immutable after manufacturing - satisfying FDA 510(k) firmware integrity mandates.

Use Scenario: Storing FPGA configuration, RF calibration tables, and network protocol stacks in outdoor 4G/5G base station radios.

IC Role / Device Role / Timing Role: High-reliability parallel flash with 105°C industrial-plus grade option for thermal-stressed outdoor enclosures.

Use Value: Versatile I/O (1.65 V to VCC) allows direct interface with 1.8 V FPGAs and 3.3 V management MCUs - eliminating level-shifters.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL128S90TFI010	Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP package; identical timing and features.	Targeted for space-constrained PCBs where fine-pitch BGA routing is acceptable and thermal dissipation favors smaller footprint.	Select when board layout prioritizes miniaturization over serviceability or socket-based prototyping.
MX29GL128FHI-90G	Micron-compatible pinout and command set; 90 ns access; lacks on-die ECC and OTP array; 512-byte buffer retained.	Suitable for cost-sensitive industrial gateways where external ECC handling is acceptable and security features are not mandated.	Choose only if firmware stack already implements software ECC and OTP emulation, and BOM cost reduction is primary objective.

Compared with S29GL128S90DHA013, the TSOP-packaged Infineon variant offers superior serviceability and thermal margin, while the BGA alternative trades repairability for density, and the Micron part requires external ECC implementation - making the original optimal for safety- and reliability-critical designs.

Availability

S29GL128S90DHA013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive body control modules, medical diagnostic imaging bootloaders, and telecom base station configuration requiring stable component supply across extended product lifecycles.

Supply support for S29GL128S90DHA013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.

The GL-S family targets embedded systems demanding robust, pin-compatible NOR flash for boot code and firmware storage - emphasizing XIP performance, data integrity, and long-term supply stability in automotive and industrial markets.

FAQ

Does S29GL128S90DHA013 support execute-in-place (XIP) operation?

Yes. The device supports true asynchronous XIP with 90 ns random access time and 15 ns page-mode latency, enabling direct CPU instruction fetch without copying to RAM. Its 32-byte page alignment and fast initial access make it suitable for real-time deterministic boot and runtime code execution in Cortex-M and PowerPC-based systems.

What is the function of the RY/BY# pin, and how should it be used in system design?

RY/BY# is an open-drain ready/busy indicator that asserts low during internal program or erase operations and goes high when complete. It must be pulled up externally (typically 4.7 kΩ to VIO). System firmware should monitor this pin or use status register polling to avoid premature read/write attempts - eliminating timing uncertainty in interrupt-driven or multi-threaded environments.

Can the 1024-byte OTP array be reprogrammed after initial programming?

No. The OTP array is physically one-time programmable: once a bit is set to '0', it cannot be reverted to '1'. Each of the two lockable regions (512 bytes each) can be permanently locked via dedicated lock bits, preventing further writes. This ensures cryptographic keys or calibration data remain tamper-proof after final test and programming.

How does Versatile I/O (VIO) simplify interface design with mixed-voltage SoCs?

Versatile I/O allows the device's I/O pins to operate between 1.65 V and VCC (2.7–3.6 V), independent of core voltage. This permits direct connection to 1.8 V or 2.5 V microcontrollers without level shifters - provided VIO is supplied at the controller's I/O voltage. The feature maintains signal integrity and timing compliance across voltage domains while reducing BOM count and PCB area.

S29GL128S90DHA013 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 90 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL128S90DHA013 FAQ

1.How can I place an order for S29GL128S90DHA013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S90DHA013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S90DHA013 reliable?

The price and inventory of S29GL128S90DHA013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S90DHA013 is usually 5 days.

3.What payment methods are accepted for S29GL128S90DHA013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S90DHA013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S90DHA013?

S29GL128S90DHA013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S90DHA013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S90DHA013?

For technical support, including S29GL128S90DHA013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S90DHA013 requirements.

6.How does Aetrix verify that S29GL128S90DHA013 is sourced from the original manufacturer or authorized distributors?

All S29GL128S90DHA013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S90DHA013 meets industry standards.

7.What is the process for return or replacement of S29GL128S90DHA013?

All S29GL128S90DHA013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S90DHA013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S90DHA013 part is unused and in its original packaging.

Return procedure for S29GL128S90DHA013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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