Infineon Technologies S29GL128S90DHA023
- Part No.:
- S29GL128S90DHA023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S90DHA023.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S29GL128S90DHA023 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction - deployed in automotive instrument clusters requiring fast XIP boot code execution and robust firmware storage.
For engineers reviewing the S29GL128S90DHA023 datasheet, S29GL128S90DHA023 pinout, S29GL128S90DHA023 application, or S29GL128S90DHA023 equivalent, key selection criteria include industrial-plus temperature grade (–40°C to +105°C), uniform 128 kB sector erase, 512-byte programming buffer, Versatile I/O support (1.65 V to VCC), and AEC-Q100 Grade 2 qualification.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
The architecture integrates dedicated erase voltage and program voltage generators, on-die ECC logic, and advanced sector protection (ASP) with volatile/non-volatile lock options. The OTP array (1024 bytes, two lockable regions) enables secure boot configuration and device-specific calibration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words |
| Random Access Time | 90 ns at VCC = VIO; determines minimum instruction fetch latency in XIP systems |
| Page Access Time | 15 ns; enables rapid sequential reads within 32-byte aligned pages |
| Programming Buffer | 512 bytes (256 words); reduces effective programming time by batching writes |
| ECC Support | On-die hardware single-bit error correction; eliminates need for external ECC logic |
| Endurance & Retention | 100,000 program/erase cycles; 20-year data retention at +85°C |
| Operating Temp | –40°C to +105°C (Industrial Plus grade); validated per AEC-Q100 Grade 2 |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 400 mil width, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | 23-bit word address bus; A22 is MSB for 128 Mb density |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes per command |
| CE# | Chip Enable | Active-low enable for device selection; controls power-down entry |
| OE# | Output Enable | Active-low control for data output drivers during read operations |
| WE# | Write Enable | Active-low strobe for latching address/data during program/erase commands |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations |
| RESET# | Hardware Reset | Active-low asynchronous reset; clears internal state and aborts operations |
| VCC | Core Supply | 3.0 V ±0.3 V supply for core logic and memory array (2.7–3.6 V operational) |
| VIO | I/O Supply | Independent I/O voltage (1.65–VCC V); enables mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O Interface | Separate VIO pin allows interface to 1.8 V or 3.3 V host buses without level shifters |
| Page-Mode Read | 32-byte aligned page access with 15 ns cycle time improves sequential code fetch efficiency |
| Embedded Algorithm Controller | Autonomous program/erase execution with suspend/resume avoids CPU intervention overhead |
| Advanced Sector Protection | Volatile and non-volatile locking per 128 kB sector prevents accidental firmware overwrite |
| Secure OTP Array | 1024-byte one-time-programmable region with dual lock bits for calibration or security keys |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and GUI assets for real-time digital dashboards with AEC-Q100 compliance requirements. IC Role / Device Role / Timing Role: NOR flash executing XIP code directly from memory; provides deterministic 90 ns instruction fetch latency. Use Value: AEC-Q100 Grade 2 qualification and 105°C operation ensure reliability in under-hood thermal environments. | Use Scenario: Holding firmware images and configuration tables in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Non-volatile program storage with sector-level write protection to prevent runtime corruption during field updates. Use Value: Uniform 128 kB sectors and ASP enable selective firmware partitioning and secure over-the-air update rollback. |
| Medical Diagnostic Imaging Boot | Avionics Display System |
Use Scenario: Hosting boot loader and safety-critical initialization routines in MRI or CT scanner control modules. IC Role / Device Role / Timing Role: High-reliability flash with on-die ECC ensuring bit-error-free boot code execution after 20 years of storage. Use Value: Hardware ECC eliminates need for software-based error detection, reducing boot time and BOM cost. | Use Scenario: Storing display firmware and font assets in certified cockpit display units requiring DO-254 compliance. IC Role / Device Role / Timing Role: Parallel NOR flash supporting deterministic read timing for real-time rendering pipelines. Use Value: Page-mode read (15 ns) accelerates loading of graphical assets during display initialization sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S90TFI020 | Same density and timing, but 64-ball LAE FBGA (9 mm × 9 mm); no TSOP option | Preferred for space-constrained PCB layouts where footprint reduction outweighs routing simplicity | Select when board area is constrained and BGA assembly capability exists |
| MX29GL128FPTI-90G | Macronix part; 90 ns access, but lacks Versatile I/O (VIO fixed to VCC) and OTP array | Acceptable for cost-sensitive industrial designs without mixed-voltage or secure storage needs | Choose only if VIO flexibility and OTP are not required; verify CFI compatibility |
Compared with S29GL128S90DHA023, the TSOP-packaged Infineon variant offers superior routing simplicity and legacy system compatibility, while the LAE FBGA alternative trades package size for higher I/O density, and the Macronix part sacrifices Versatile I/O and OTP for lower unit cost.
Availability
S29GL128S90DHA023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical diagnostic imaging boot, and avionics display systems requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL128S90DHA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions.
The GL-S family targets automotive and industrial applications demanding AEC-Q100 qualification, extended temperature operation, and deterministic XIP performance - designed specifically for mission-critical firmware storage where data integrity and timing predictability are non-negotiable.
FAQ
What is the purpose of the Versatile I/O (VIO) pin on S29GL128S90DHA023?
The VIO pin supplies independent voltage to the device's I/O buffers, allowing operation with 1.65 V to VCC (up to 3.6 V). This enables direct interfacing with 1.8 V or 3.3 V host processors without external level shifters - critical for mixed-voltage automotive ECUs where core logic runs at 1.8 V while memory interface must remain robust.
Does S29GL128S90DHA023 support true random-access reads or only page-mode operation?
S29GL128S90DHA023 supports both true random-access reads (90 ns tACC) and faster page-mode reads (15 ns tPACC within 32-byte pages). Random access initiates a new page load; subsequent reads to addresses within the same page use the cached page, delivering consistent 15 ns latency - essential for efficient XIP execution of tightly packed code.
How does the on-die ECC function, and what error scenarios does it cover?
The hardware ECC corrects single-bit errors per 512-byte sector during read operations and detects double-bit errors. It operates transparently without CPU intervention and requires no external syndrome calculation. ECC coverage applies to all array reads, including CFI and status register accesses, but does not extend to OTP region reads unless explicitly enabled per datasheet configuration.
Can S29GL128S90DHA023 be used in systems requiring AEC-Q100 Grade 1 (–40°C to +125°C)?
No - S29GL128S90DHA023 is qualified for AEC-Q100 Grade 2 (–40°C to +105°C), not Grade 1. Its thermal specifications, including data retention and endurance, are validated only up to +105°C. For Grade 1 applications, Infineon offers other GL-S variants with extended characterization, but this specific TSOP-part is not rated beyond +105°C.
S29GL128S90DHA023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S90DHA023 FAQ
1.How can I place an order for S29GL128S90DHA023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S90DHA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S90DHA023 reliable?
The price and inventory of S29GL128S90DHA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S90DHA023 is usually 5 days.
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Once your S29GL128S90DHA023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S90DHA023?
For technical support, including S29GL128S90DHA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S90DHA023 requirements.
6.How does Aetrix verify that S29GL128S90DHA023 is sourced from the original manufacturer or authorized distributors?
All S29GL128S90DHA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S90DHA023 meets industry standards.
7.What is the process for return or replacement of S29GL128S90DHA023?
All S29GL128S90DHA023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S90DHA023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S90DHA023 part is unused and in its original packaging.
Return procedure for S29GL128S90DHA023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S90DHA023 Tags

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M24C02-WMN6TP
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