Infineon Technologies S29GL128S90DHI010
- Part No.:
- S29GL128S90DHI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S90DHI010.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:411
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL128S90DHI010 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and MIRRORBIT™ Eclipse 65 nm technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring AEC-Q100 Grade 3 qualification (–40°C to +85°C).
For engineers reviewing the S29GL128S90DHI010 datasheet, S29GL128S90DHI010 pinout, S29GL128S90DHI010 application, or S29GL128S90DHI010 equivalent, this device supports asynchronous XIP-capable read, 512-byte buffer programming, uniform 128 kB sector erase, and Versatile I/O (1.65 V to VCC) for mixed-voltage system interfacing.
Technical Context
This parallel NOR flash implements an asynchronous interface with CE#, OE#, and WE# control signals, supporting both standard word programming and multi-word buffer programming up to 512 bytes. Its internal Embedded Algorithm Controller (EAC) manages all program/erase operations, status reporting via status register or RY/BY# pin, and automatic ECC generation/correction during read.
The device uses 32-byte page-aligned reads: initial access fetches a full 32-byte page in 90 ns; subsequent accesses within the same page complete in 15 ns. Sector protection includes volatile/non-volatile ASP and a dedicated 1024-byte OTP array with two lockable regions for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words |
| Random Access Time | 90 ns at VCC = VIO = 3.0 V - determines worst-case instruction fetch latency in XIP applications |
| Page Access Time | 15 ns - enables fast sequential reads within 32-byte aligned pages |
| Programming Buffer | 512 bytes - reduces effective programming time by batching writes without host-side overhead |
| ECC Support | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot storage |
| Endurance & Retention | 100,000 program/erase cycles; 20 years data retention - validated for long-life industrial firmware storage |
| Operating Temperature | –40°C to +85°C (Industrial Grade 3) - qualified per AEC-Q100 for automotive ECUs and industrial HMIs |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | 23-bit address bus supporting full 16 MB address space (A22 = MSB) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates at VIO (1.65 V to VCC) |
| CE# | Chip Enable | Active-low enable for device selection; controls power-down entry when deasserted |
| OE# | Output Enable | Active-low control for data output buffer; used during read operations |
| WE# | Write Enable | Active-low control for write latching; initiates program/erase command sequences |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low = operation in progress, high = ready/completed |
| RESET# | Hardware Reset | Active-low asynchronous reset that halts ongoing operations and returns device to read mode |
| VCC | Core Supply | 3.0 V ±0.3 V main supply for core logic and memory array (2.7 V to 3.6 V operating range) |
| VIO | I/O Supply | Independent I/O voltage (1.65 V to VCC) enabling interface with 1.8 V or 3.3 V controllers |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns intra-page timing - accelerates linear code execution in XIP mode |
| 512-Byte Programming Buffer | Reduces average programming time by >60% vs. single-word writes - critical for field firmware updates |
| Hardware ECC Engine | On-the-fly single-bit error correction with no software overhead - meets ASIL-B functional safety requirements |
| Uniform 128 kB Sectors | 64 identical sectors simplify BOM management and enable granular firmware partitioning (e.g., bootloader + app + config) |
| Advanced Sector Protection | Volatile and non-volatile locking per sector - prevents accidental overwrite during development or field service |
Applications
| Automotive ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader and safety-critical firmware in engine control units compliant with ISO 26262 ASIL-B. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <90 ns latency. Use Value: AEC-Q100 Grade 3 qualification and 20-year data retention ensure reliable startup across vehicle lifetime. | Use Scenario: Holds firmware and configuration data in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Standalone parallel NOR flash interfaced directly to ARM Cortex-M7 MCU via static memory controller. Use Value: 128 kB uniform sectors allow independent update of HMI, motion control, and I/O driver modules without full reflash. |
| Medical Imaging System BIOS | Railway Signaling Controller |
Use Scenario: Stores BIOS and diagnostic routines in portable ultrasound and MRI subsystems requiring certified component longevity. IC Role / Device Role / Timing Role: Secure boot memory with OTP region storing cryptographic keys and calibration constants. Use Value: Dedicated 1024-byte OTP array with dual lock bits prevents tampering with regulatory-critical parameters. | Use Scenario: Provides fail-safe firmware storage in EN 5012x-certified signaling interlock controllers operating in harsh outdoor rail environments. IC Role / Device Role / Timing Role: Industrial-grade parallel flash with –40°C to +85°C operation and ECC-enabled read integrity. Use Value: Hardware ECC and 100,000-cycle endurance support frequent firmware patches while maintaining SIL-3 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P90TFI010 | Same density and timing, but 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option | Preferred for space-constrained PCBs where board area is prioritized over manual assembly or socket compatibility | Select when footprint miniaturization outweighs ease of prototyping or thermal management needs |
| MX29GL128FPTI-90G | Macronix part with 90 ns access, but lacks hardware ECC and OTP array; requires external error handling | Suitable for cost-sensitive consumer applications where functional safety is not mandated | Choose only if ECC and secure OTP are not required, and BOM cost reduction is primary objective |
Compared with S29GL128P90TFI010, the TSOP package offers better thermal dissipation and hand-solderability; versus MX29GL128FPTI-90G, the Infineon part provides built-in ECC and OTP security essential for industrial and automotive use cases.
Availability
S29GL128S90DHI010 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware storage, and medical imaging BIOS applications requiring stable component supply and long-term lifecycle assurance.
Supply support for S29GL128S90DHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-S family targets high-reliability embedded systems needing XIP-capable flash with industrial and automotive qualification, combining speed, density, and data integrity features for mission-critical firmware storage.
FAQ
What is the purpose of the Versatile I/O (VIO) feature?
The Versatile I/O feature allows independent VIO supply (1.65 V to VCC) for the DQ0–DQ15 bus, enabling direct interface with 1.8 V or 3.3 V host processors without level shifters. This simplifies mixed-voltage system design and reduces BOM count while maintaining signal integrity across voltage domains.
Does S29GL128S90DHI010 support execute-in-place (XIP) operation?
Yes - it supports true XIP operation with 90 ns random access and 15 ns page-mode reads, allowing microcontrollers to execute code directly from flash without copying to RAM. The asynchronous interface and fast page access make it suitable for real-time boot and interrupt vector fetching in safety-critical systems.
How does the hardware ECC function during read operations?
During every read, the internal ECC engine computes and checks Hamming codes on-the-fly. If a single-bit error is detected, it is corrected transparently before data output; the status register flags correction occurrence. No software intervention or additional latency is required, ensuring deterministic timing for safety-critical reads.
Can sector protection be configured dynamically during runtime?
Yes - Advanced Sector Protection (ASP) supports both volatile (cleared on power cycle) and non-volatile (persistent) locking per 128 kB sector. Configuration is performed via standard CFI command sequences, enabling field-upgradeable protection schemes for bootloader or configuration partitions without hardware modification.
S29GL128S90DHI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S90DHI010 FAQ
1.How can I place an order for S29GL128S90DHI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S90DHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S90DHI010 reliable?
The price and inventory of S29GL128S90DHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S90DHI010 is usually 5 days.
3.What payment methods are accepted for S29GL128S90DHI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S90DHI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S90DHI010?
S29GL128S90DHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S90DHI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S90DHI010?
For technical support, including S29GL128S90DHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S90DHI010 requirements.
6.How does Aetrix verify that S29GL128S90DHI010 is sourced from the original manufacturer or authorized distributors?
All S29GL128S90DHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S90DHI010 meets industry standards.
7.What is the process for return or replacement of S29GL128S90DHI010?
All S29GL128S90DHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S90DHI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S90DHI010 part is unused and in its original packaging.
Return procedure for S29GL128S90DHI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S90DHI010 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

