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Infineon Technologies S29GL128S90DHI013
- Part No.:
- S29GL128S90DHI013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S90DHI013.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,047
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Product details
Overview
S29GL128S90DHI013 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and MIRRORBIT™ Eclipse 65 nm technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring deterministic read latency and long-term data retention.
For engineers reviewing the S29GL128S90DHI013 datasheet, S29GL128S90DHI013 pinout, S29GL128S90DHI013 application, or S29GL128S90DHI013 equivalent, this device supports asynchronous XIP-capable boot execution, sector-level erase with suspend/resume, and versatile I/O (1.65 V–VCC) for mixed-voltage host interfacing - critical for legacy microcontroller-based designs.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), 32-byte page read capability, and embedded algorithm controller (EAC) for autonomous program/erase operations. It uses internal voltage generators for programming (VPP) and erase without external high-voltage supplies.
Hardware ECC operates transparently during read cycles, correcting single-bit errors on-the-fly using dedicated status registers (ECC Status ASO). Sector protection includes volatile (lock bits) and non-volatile (ASP) methods, plus a separate 1024-byte OTP array with two lockable regions for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words - sufficient for full firmware images in mid-tier microcontrollers. |
| Access time (random) | 90 ns at VCC = VIO - enables direct XIP execution from flash without wait states on 80 MHz bus interfaces. |
| Page access time | 15 ns - allows burst reads within 32-byte aligned pages for accelerated sequential instruction fetch. |
| Programming buffer | 512 bytes (256 words) - reduces effective programming time by batching writes, critical for field firmware updates. |
| Erase granularity | Uniform 128 kB sectors (128 sectors total) - supports modular firmware partitioning and safe over-the-air update rollback. |
| Data retention | 20 years - ensures reliable operation across product lifecycle in unattended industrial deployments. |
| Endurance | 100,000 program/erase cycles per sector - validated for frequent logging or parameter storage in edge controllers. |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint. Compatible with wave and reflow soldering per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | Word-aligned address bus (23 pins); A22 is MSB for 128 Mb addressing (2²³ = 8,388,608 words). |
| DQ0–DQ15 | Data I/O bidirectional bus | 16-bit parallel data path; supports both read and write transfers with byte/word select via address LSB. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables command decoding when asserted. |
| OE# | Output enable | Active-low read strobe; gates output drivers to prevent bus contention during shared-memory access. |
| WE# | Write enable | Active-low write strobe; initiates program/erase commands and data latching on rising edge. |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; low during embedded operations (program/erase), high when ready for next command. |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known state and aborts ongoing operations. |
| VCC | Core supply | 3.0 V ±0.3 V supply (2.7–3.6 V); powers logic, EAC, and memory array - no separate VPP required. |
| VIO | I/O supply | 1.65 V to VCC; decouples I/O voltage from core, enabling interoperability with 1.8 V or 3.3 V hosts. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned page access with 15 ns intra-page timing - accelerates linear code fetch without CPU intervention. |
| Hardware ECC engine | On-die single-bit error correction with automatic detection and correction during read - eliminates need for software ECC overhead. |
| Suspend/resume capability | Interruptible program or erase operations - allows high-priority read access during background flash maintenance. |
| Advanced sector protection (ASP) | Volatile (lock bits) and non-volatile (sector lock bits) protection modes - enables runtime-locked bootloader partitions. |
| Common Flash Interface (CFI) | Standardized parameter table accessible via command sequence - enables OS/driver auto-detection and vendor-agnostic firmware tools. |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 90 ns latency. Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity across 15+ year equipment lifecycles without refresh. |
Use Scenario: Holding calibrated display graphics and safety-critical boot code in automotive digital instrument clusters meeting AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Secure boot memory with OTP region for calibration constants and ASP-protected bootloader partition. Use Value: Hardware ECC prevents silent corruption of gauge rendering assets under thermal stress (-40°C to +105°C). |
| Medical Diagnostic Equipment BIOS | Telecom Base Station Configuration Storage |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound and imaging devices requiring regulatory-compliant reliability. IC Role / Device Role / Timing Role: Dual-role memory: boot code store + configuration data repository with sector-level update isolation. Use Value: Suspend/resume allows diagnostic software to query status registers mid-erase, avoiding system freeze during field updates. |
Use Scenario: Storing FPGA configuration, RF calibration tables, and protocol stack parameters in 4G/5G remote radio units deployed outdoors. IC Role / Device Role / Timing Role: High-reliability configuration store supporting hot-swap firmware updates via 512-byte buffered programming. Use Value: Versatile I/O (1.65 V–3.6 V) enables direct interface to 1.8 V FPGAs and 3.3 V management MCUs without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P90TFI010 | Same density and timing, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm) instead of TSOP; lacks OTP array. | Preferred for space-constrained PCBs where board area is premium; unsuitable where OTP-based secure calibration is required. | Select when footprint reduction outweighs need for OTP security features. |
| MX29GL128FPTI-90G | 128 Mb parallel NOR with 90 ns access, but no hardware ECC; requires external error handling; 10K endurance rating. | Acceptable for non-critical data logging where ECC is implemented in software or not required. | Select only if cost sensitivity overrides reliability requirements and ECC is managed at system level. |
Compared with S29GL128P90TFI010, this TSOP variant offers OTP and larger package pitch for easier assembly; versus MX29GL128FPTI-90G, it delivers certified ECC and 10× higher endurance - essential for safety-critical boot storage.
Availability
S29GL128S90DHI013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical diagnostic equipment BIOS requiring stable component supply and long-term lifecycle support.
Supply support for S29GL128S90DHI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets embedded systems needing deterministic XIP performance and robust data integrity - designed specifically for industrial automation, automotive clusters, and medical devices where firmware reliability is non-negotiable.
FAQ
Does S29GL128S90DHI013 support 1.8 V I/O operation?
Yes. Its versatile I/O feature supports VIO from 1.65 V to VCC (max 3.6 V), enabling direct connection to 1.8 V microcontrollers without level shifters. This is confirmed in the "Versatile I/O feature" section of the datasheet and validated across all operating temperature grades.
What is the function of the RY/BY# pin during programming?
RY/BY# is an open-drain ready/busy indicator that goes low during active program or erase operations and returns high when the embedded algorithm completes. It provides hardware flow control, allowing the host processor to poll status without reading status registers - reducing bus traffic and improving efficiency.
Can the OTP array be reprogrammed after locking?
No. The 1024-byte OTP array has two lockable regions; once locked via specific command sequences, those regions become permanently read-only. Unlocking is not supported - this is a hardware-enforced security feature for calibration data or cryptographic keys.
Is sector erase suspend supported for all sector sizes?
Yes. Suspend/resume is supported for all uniform 128 kB sectors regardless of address location. The command is issued mid-erase and halts the operation immediately, allowing priority read access before resuming - verified in Section 5.5 (Status Monitoring) of the datasheet.
S29GL128S90DHI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S90DHI013 FAQ
1.How can I place an order for S29GL128S90DHI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S90DHI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S90DHI013 reliable?
The price and inventory of S29GL128S90DHI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S90DHI013 is usually 5 days.
3.What payment methods are accepted for S29GL128S90DHI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S90DHI013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S90DHI013?
S29GL128S90DHI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S90DHI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S90DHI013?
For technical support, including S29GL128S90DHI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S90DHI013 requirements.
6.How does Aetrix verify that S29GL128S90DHI013 is sourced from the original manufacturer or authorized distributors?
All S29GL128S90DHI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S90DHI013 meets industry standards.
7.What is the process for return or replacement of S29GL128S90DHI013?
All S29GL128S90DHI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S90DHI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S90DHI013 part is unused and in its original packaging.
Return procedure for S29GL128S90DHI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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