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Infineon Technologies S29GL128S90DHI020
- Part No.:
- S29GL128S90DHI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S90DHI020.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:651
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Product details
Overview
S29GL128S90DHI020 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte programming buffer-enabling fast embedded code storage and firmware update in microcontroller boot loaders.
For engineers reviewing the S29GL128S90DHI020 datasheet, S29GL128S90DHI020 pinout, S29GL128S90DHI020 application, or S29GL128S90DHI020 equivalent, this device supports asynchronous XIP-capable read, suspend/resume during program/erase, versatile I/O (1.65 V to VCC), OTP array, and CFI-compliant interface-critical for deterministic boot timing and field-upgradable firmware in industrial control and automotive ECUs.
Technical Context
The S29GL128S90DHI020 implements an asynchronous parallel flash architecture with dedicated command register, embedded algorithm controller (EAC), and status monitoring via RY/BY# pin, status register, or data polling. Its 65 nm MIRRORBIT™ Eclipse process enables 100,000 program/erase cycles and 20-year data retention at 85°C.
It supports three read modes: standard asynchronous read (90 ns), page-mode read (15 ns within 32-byte aligned pages), and CFI parameter table access. Programming uses a 512-byte write buffer with automatic ECC generation and verification per 512-byte sector, while sector protection includes volatile/non-volatile ASP and OTP lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB) organized as 1,048,576 × 16-bit words |
| Supply voltage (VCC) | 2.7 V to 3.6 V - single supply for read, program, and erase operations |
| Random access time (tACC) | 90 ns - determines worst-case latency for first word fetch from any address |
| Page access time (tPACC) | 15 ns - enables rapid sequential reads within same 32-byte aligned page |
| Programming buffer size | 512 bytes - allows burst programming of up to 256 words per command, reducing host overhead |
| ECC capability | Internal hardware single-bit error correction - ensures data integrity without software intervention |
| Sector size | 128 kbytes uniform sectors - simplifies firmware partitioning and OTA update management |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit address bus supporting full 16 MB address space (A22 = MSB) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65 V to VCC versatile I/O voltage range |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low control for data bus output drivers during read operations |
| WE# | Write enable | Active-low signal initiating write/program/erase command execution |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low = busy) |
| WP# | Write protect | Hardware sector protection override; low = disable program/erase on protected sectors |
| VCC | Core supply | 3.0 V nominal supply powering logic, memory array, and internal voltage generators |
| VIO | I/O supply | Independent I/O voltage rail (1.65 V to VCC) enabling mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 15 ns access within 32-byte aligned pages - reduces instruction fetch latency in XIP applications |
| 512-byte programming buffer | Enables single-command programming of up to 256 words - cuts host-side command overhead by >70% vs. byte-wise writes |
| Hardware ECC engine | On-the-fly single-bit error correction per 512-byte sector - eliminates need for external error-handling logic |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per 128-kbyte sector - prevents accidental firmware corruption during field updates |
| 1024-byte OTP array | Two lockable regions for secure boot keys or calibration data - immutable after programming |
Applications
| Industrial PLC Firmware Storage | Automotive ECU Boot Memory |
|---|---|
|
Use Scenario: Storing real-time control firmware in programmable logic controllers with frequent field updates. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch and atomic sector erase for safe firmware rollback. Use Value: 90 ns random access and 15 ns page mode ensure deterministic task scheduling; 100,000 erase cycles support >10 years of quarterly updates. |
Use Scenario: Hosting boot loader and safety-critical application code in AEC-Q100 Grade 3 engine control units. IC Role / Device Role / Timing Role: Primary flash memory mapped into MCU address space for cold-start execution and secure firmware validation. Use Value: Hardware ECC and OTP array meet ISO 26262 ASIL-B requirements; –40°C to +85°C rating ensures reliability under hood conditions. |
| Medical Imaging System BIOS | Network Router Configuration Storage |
|
Use Scenario: Storing calibrated imaging algorithms and device initialization parameters in portable ultrasound systems. IC Role / Device Role / Timing Role: Persistent configuration and boot image storage with guaranteed 20-year data retention at 85°C. Use Value: 128-kbyte uniform sectors simplify versioned firmware partitioning; ASP prevents unauthorized modification during service mode. |
Use Scenario: Holding router boot code, OS kernel, and persistent configuration tables in carrier-grade edge infrastructure. IC Role / Device Role / Timing Role: Parallel flash interfaced to MIPS or ARM SoC for high-throughput firmware loading and runtime parameter updates. Use Value: Versatile I/O (1.65 V to VCC) enables direct connection to 1.8 V or 3.3 V SoC buses; CFI table allows auto-detection in bootloader. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S90TFI020 | Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm) package instead of 56-pin TSOP | Requires PCB redesign for BGA layout and reflow profile; better thermal performance in high-density boards | Select when board space is constrained and automated assembly is available |
| MX29GL128FPTI-90G | Macronix 128 Mb parallel NOR; 90 ns tACC but no integrated ECC or OTP array; requires external error handling | Lacks hardware ECC and secure OTP - increases firmware validation burden in safety-critical designs | Select only for cost-sensitive, non-safety applications where software ECC is acceptable |
Compared with S29GL128S90DHI020, the TSOP variant offers drop-in compatibility with legacy industrial PCBs, while the BGA alternative improves thermal dissipation and footprint efficiency; the Macronix part trades integrated reliability features for lower unit cost but adds design complexity in error management.
Availability
S29GL128S90DHI020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, and medical imaging system BIOS requiring stable component supply across long-lifecycle programs.
Supply support for S29GL128S90DHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with leadership in industrial and automotive-grade non-volatile memory.
The GL-S family targets embedded systems needing deterministic XIP performance, high endurance, and robust data integrity-designed specifically for boot code, firmware, and configuration storage in harsh-environment applications.
FAQ
Does S29GL128S90DHI020 support execute-in-place (XIP) operation?
Yes, it supports true XIP operation due to its asynchronous parallel interface and 90 ns random access time, allowing microcontrollers to fetch instructions directly from flash without copying to RAM. Page-mode reads (15 ns) further accelerate sequential instruction flow, making it suitable for real-time embedded applications requiring deterministic boot and runtime execution.
What is the function of the VIO pin, and can it be tied to VCC?
VIO sets the I/O buffer voltage level independently from VCC and must be supplied within 1.65 V to VCC. It can be tied to VCC for 3.3 V system interfacing, but separating VIO enables direct connection to 1.8 V or 2.5 V processors-eliminating level shifters. This versatility simplifies mixed-voltage board design while maintaining signal integrity and timing compliance.
How does the 512-byte programming buffer improve firmware update efficiency?
The buffer allows up to 512 bytes (256 words) to be loaded and programmed in a single embedded operation, reducing host CPU intervention and bus arbitration overhead. Compared to single-word programming, this cuts effective programming time by up to 6× for contiguous firmware blocks, accelerating field updates and minimizing system downtime during maintenance windows.
Is the OTP array truly one-time programmable, and how is it secured?
Yes, the 1024-byte OTP array consists of two independently lockable regions; once locked via dedicated CFI commands, further writes are permanently disabled. Locking is irreversible and enforced by on-chip fuses, ensuring cryptographic keys or calibration data remain tamper-proof-even under power cycling or reset-meeting requirements for secure boot and regulatory compliance.
S29GL128S90DHI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S90DHI020 FAQ
1.How can I place an order for S29GL128S90DHI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S90DHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S90DHI020 reliable?
The price and inventory of S29GL128S90DHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S90DHI020 is usually 5 days.
3.What payment methods are accepted for S29GL128S90DHI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S90DHI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S90DHI020?
S29GL128S90DHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S90DHI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S90DHI020?
For technical support, including S29GL128S90DHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S90DHI020 requirements.
6.How does Aetrix verify that S29GL128S90DHI020 is sourced from the original manufacturer or authorized distributors?
All S29GL128S90DHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S90DHI020 meets industry standards.
7.What is the process for return or replacement of S29GL128S90DHI020?
All S29GL128S90DHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S90DHI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S90DHI020 part is unused and in its original packaging.
Return procedure for S29GL128S90DHI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S90DHI020 Tags
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