Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S29GL128S90FAI013

Part No.:
S29GL128S90FAI013
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL128S90FAI013.pdf
Description:
IC FLASH 128MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,719

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S29GL128S90FAI013 from Spansion is a 128 Mbit (16 MB) 3.0 V-only page-mode NOR Flash memory IC fabricated on 65 nm MirrorBit Eclipse process technology, featuring 90 ns random access time, industrial temperature range (–40°C to +85°C), and Fortified BGA package (LAA064, 11 mm × 13 mm). It supports sector protection, password-enabled block locking, and is used in boot code storage for industrial controllers and firmware storage in network edge devices.

For engineers reviewing the S29GL128S90FAI013 datasheet, S29GL128S90FAI013 pinout, S29GL128S90FAI013 application, or S29GL128S90FAI013 equivalent, key selection criteria include verified 90 ns access timing, industrial-grade thermal reliability, VIO/VCC flexibility (2.7–3.6 V), sector-based write protection, and BGA-64 mechanical compatibility with legacy Spansion GL-S footprint designs.

Technical Context

This device implements a synchronous/asynchronous dual-mode interface with standard CFI-compliant command sets and supports both single-word and burst read operations. It integrates embedded erase and program algorithms compliant with JEDEC JESD21-C, enabling autonomous sector erase (typ. 0.5 s) and byte/word programming (typ. 8 µs).

The memory array is organized as 2,097,152 × 8 bits (x8 configuration), with 128 uniform sectors of 128 KB each. Sector protection is implemented via hardware lock bits and software-controlled PPB/DYB mechanisms, supporting both highest- and lowest-address sector protection modes per ordering option (01 = highest protected).

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density128 Mbit (16 MB), x8 organization - supports full boot image storage for ARM Cortex-M7/M4 microcontrollers.
Access Time90 ns - enables direct execution (XIP) from flash in real-time control loops with ≤100 ns latency budget.
Supply VoltageVCC = VIO = 2.7–3.6 V - eliminates level-shifting circuitry in 3.3 V system designs.
Operating Temp–40°C to +85°C - qualified for industrial automation PLCs and outdoor telecom equipment.
PackageLAA064 Fortified BGA, 11 mm × 13 mm - provides mechanical robustness and thermal dissipation for high-reliability mounting.
Sector Size128 KB uniform sectors (128 total) - allows granular firmware update partitioning without erasing entire device.
Write ProtectionHardware lock bits + software PPB/DYB - prevents accidental overwrite of bootloader during field firmware upgrades.

Pinout & Package

Package: Fortified Ball-Grid Array (LAA064), 64-ball, 0.8 mm pitch, 11 mm × 13 mm body, RoHS-compliant Pb-free finish.

Pin/TerminalCircuit RoleDesign Meaning
A0–A20Address Inputs21-bit address bus supporting full 128 Mbit addressing (A0–A20); A20 selects upper/lower half of memory map.
DQ0–DQ7Data I/O8-bit bidirectional data bus; supports byte-wide reads/writes and CFI query mode for automatic detection.
CE#Chip EnableActive-low chip select; must be asserted before OE#/WE# to initiate valid access cycle.
OE#Output EnableActive-low control for data output buffer; decouples read timing from address setup.
WE#Write EnableActive-low control for write/erase command latching; synchronized with CE# and address valid window.
RY/BY#Ready/Busy OutputOpen-drain status indicator; low during embedded erase/program operations, high when ready for next command.
VCC / VIOPower SuppliesSingle 2.7–3.6 V supply for core and I/O - no separate VCCQ required; simplifies power rail design.
WP#/ACCWrite Protect / AccelerationHardware write protect input; when tied low, disables sector protection commands; also enables acceleration mode for faster programming.

Key Features

FeatureDesign Value
MirrorBit Eclipse Technology65 nm process enabling 128 Mbit density in compact BGA-64, reducing PCB area vs. older 90 nm equivalents.
Uniform 128 KB SectorsEnables deterministic firmware update scheduling - critical for OTA updates in medical gateways requiring rollback safety.
PPB/DYB Password ProtectionTwo-tier software locking (permanent PPB + dynamic DYB) prevents unauthorized reprogramming even after power cycle.
CFI ComplianceJEDEC JESD68-compliant Common Flash Interface allows auto-detection and driver abstraction across multiple OS platforms.
Industrial Temperature RangeValidated operation at –40°C to +85°C ensures reliable boot code execution in unheated factory-floor HMIs.

Applications

Industrial PLC Firmware StorageTelecom Edge Router Boot Memory

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers deployed in manufacturing cells.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory mapped into ARM Cortex-R4 processor's XIP space; accessed at 90 ns random read speed.

Use Value: Uniform 128 KB sectors allow atomic firmware patching without disrupting active control tasks; industrial temp rating ensures uptime in ambient 70°C cabinet environments.

Use Scenario: Holding boot code and configuration images for carrier-class Ethernet routers operating at cell tower sites.

IC Role / Device Role / Timing Role: NOR Flash providing immediate instruction fetch on power-up; supports secure boot verification via PPB-locked bootloader sector.

Use Value: Hardware write protection prevents tampering during remote firmware updates; BGA-64 package withstands vibration and thermal cycling in outdoor enclosures.

Medical Diagnostic Imaging UIAutomotive ADAS Camera Module

Use Scenario: Storing GUI assets and calibration data in ultrasound machine front panels with touch-screen interfaces.

IC Role / Device Role / Timing Role: Read-optimized storage for static assets; accessed via parallel bus with burst read capability for rapid UI rendering.

Use Value: 90 ns access time reduces UI frame load latency; CFI compliance simplifies integration with Linux-based display frameworks.

Use Scenario: Storing camera sensor initialization sequences and lens correction tables in rear-view camera modules.

IC Role / Device Role / Timing Role: Configuration memory accessed during cold start; sector protection isolates critical calibration data from application firmware updates.

Use Value: DYB password locking prevents corruption of lens distortion coefficients during over-the-air updates; industrial temp range covers vehicle cabin extremes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL128P90FAI010Same density and package, but uses older 90 nm MirrorBit process; 100 ns access time; no PPB support.Lacks password-based permanent block protection; unsuitable for secure boot implementations requiring tamper resistance.Select only if cost sensitivity outweighs security requirements and 10 ns slower access is acceptable in non-real-time systems.
MX29GL128FHI-90GMacronix 128 Mbit NOR Flash, 90 ns, same LAA064 BGA; supports CFI but lacks DYB/PPB dual-lock architecture.Relies on external MCU-based locking; no hardware-enforced sector protection independent of host firmware state.Prefer where existing Macronix toolchain and qualification are established, and host-side security controls suffice.

Compared with S29GL128P90FAI010 and MX29GL128FHI-90G, the S29GL128S90FAI013 uniquely combines 90 ns speed, industrial temperature rating, and dual-layer (PPB+DYB) password protection - making it the only choice for safety-critical boot memory where firmware integrity must survive power loss and unauthorized access attempts.

Availability

S29GL128S90FAI013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom edge router boot memory, and medical diagnostic imaging UI requiring stable component supply across extended product lifecycles.

Supply support for S29GL128S90FAI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Spansion Inc. was a leading provider of flash memory solutions, formed from the merger of AMD and Fujitsu flash divisions, later acquired by Cypress Semiconductor in 2015 and integrated into Infineon Technologies.

The S29GL-S family targets high-reliability embedded systems requiring deterministic boot performance, sector-level firmware update safety, and long-term industrial qualification - especially in automotive, industrial control, and networking infrastructure.

FAQ

What is the maximum clock frequency supported for burst read operations?

The S29GL128S90FAI013 does not use a clock signal; it is an asynchronous NOR Flash. Burst read timing is governed by address hold/setup times and CE#/OE# pulse widths. Maximum effective throughput is determined by 90 ns random access time and 30 ns minimum OE# pulse width, yielding up to ~11 MB/s in continuous burst mode under optimal bus timing.

Does this part support Quad SPI or other serial interfaces?

No. The S29GL128S90FAI013 is a parallel-interface NOR Flash with x8 data bus and discrete control signals (CE#, OE#, WE#). It does not implement SPI, QSPI, or any serial protocol. Interface compatibility is limited to standard asynchronous parallel memory buses found in ARM9, Cortex-R, and PowerPC-based controllers.

How is sector protection configured - via hardware pins or software commands?

Sector protection uses both methods: hardware WP# pin disables all protection commands when asserted low, while software commands (via CFI command set) configure PPB (Permanent Protection Bit) and DYB (Dynamic Protection Bit) registers. PPB locking is irreversible without factory reset; DYB can be toggled in-system using password authentication.

Is the LAA064 BGA package compatible with reflow soldering per IPC-J-STD-020?

Yes. The LAA064 package is qualified for lead-free reflow per IPC-J-STD-020D, with peak temperature rating of 260°C for 30 seconds. Its fortified construction includes enhanced solder joint reliability testing per JESD22-A113, making it suitable for high-vibration industrial assembly lines.

S29GL128S90FAI013 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
64-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
8M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
90 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (13x11)

S29GL128S90FAI013 FAQ

1.How can I place an order for S29GL128S90FAI013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S90FAI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S90FAI013 reliable?

The price and inventory of S29GL128S90FAI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S90FAI013 is usually 5 days.

3.What payment methods are accepted for S29GL128S90FAI013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S90FAI013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S90FAI013?

S29GL128S90FAI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S90FAI013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S90FAI013?

For technical support, including S29GL128S90FAI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S90FAI013 requirements.

6.How does Aetrix verify that S29GL128S90FAI013 is sourced from the original manufacturer or authorized distributors?

All S29GL128S90FAI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S90FAI013 meets industry standards.

7.What is the process for return or replacement of S29GL128S90FAI013?

All S29GL128S90FAI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S90FAI013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S90FAI013 part is unused and in its original packaging.

Return procedure for S29GL128S90FAI013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S29GL128S90FAI013 Tags

  • S29GL128S90FAI013
  • S29GL128S90FAI013 PDF
  • S29GL128S90FAI013 Datasheet
  • S29GL128S90FAI013 Specifications
  • S29GL128S90FAI013 Images
  • Infineon Technologies
  • Infineon Technologies S29GL128S90FAI013
  • Buy S29GL128S90FAI013
  • S29GL128S90FAI013 Price
  • S29GL128S90FAI013 Distributor
  • S29GL128S90FAI013 Supplier
  • S29GL128S90FAI013 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER