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Infineon Technologies S29GL128S90FHA020

Part No.:
S29GL128S90FHA020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL128S90FHA020.pdf
Description:
IC FLASH 128MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,356

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Product details

Overview

S29GL128S90FHA020 from Infineon is a 128 Mb (16 MB), 16-bit parallel NOR flash memory IC with 3.0 V core supply, 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across –40°C to +85°C (industrial grade) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.

For engineers reviewing the S29GL128S90FHA020 datasheet, S29GL128S90FHA020 pinout, S29GL128S90FHA020 application, or S29GL128S90FHA020 equivalent, this device delivers deterministic asynchronous read timing, Versatile I/O (1.65 V–VCC), 512-byte write buffer programming, and AEC-Q100-compliant variants for automotive control modules requiring high-reliability non-volatile storage.

Technical Context

The S29GL128S90FHA020 implements an asynchronous parallel interface with word-aligned addressing (A0–A22), 16-bit DQ bus, and dedicated control signals (CE#, OE#, WE#, RY/BY#). Its MIRRORBIT™ Eclipse 65 nm architecture enables simultaneous bit-line sensing for fast random access and page-mode reads within aligned 32-byte boundaries.

It integrates an Embedded Algorithm Controller (EAC) that executes internal program/erase sequences, automatic ECC encoding/decoding, and status reporting via status register, data polling, or RY/BY# pin. Sector protection includes volatile/non-volatile lock bits and a separate 1024-byte OTP array with two lockable regions.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density 128 Mb (16 MB), organized as 1,048,576 × 16-bit words - defines maximum boot image or firmware partition size
Random access time 90 ns at VCC = VIO - guarantees worst-case latency for first-word fetch in XIP execution
Page access time 15 ns - enables rapid sequential reads within 32-byte aligned pages for tight-loop code execution
Write buffer size 512 bytes (256 words) - reduces effective programming time by batching writes without host-side overhead
ECC capability Single-bit error correction per 512-byte sector - ensures data integrity without software intervention during read cycles
Endurance & retention 100,000 program/erase cycles; 20-year data retention - supports long-life industrial firmware updates and logging
Operating temperature –40°C to +85°C (industrial grade) - validated for use in base station controllers and PLCs without derating

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint. Pin-compatible with legacy S29GLxxxS family devices in same package variant.

Pin/Terminal Circuit Role Design Meaning
A0–A22 Address inputs Word-aligned address bus; A22 is MSB for 128 Mb (2²³ = 8,388,608 words)
DQ0–DQ15 Data I/O bus 16-bit bidirectional data path; supports byte/word writes per command sequence
CE# Chip enable Active-low device select; controls power state entry and command latching timing window
OE# Output enable Active-low read strobe; gates output drivers without affecting internal state machine
WE# Write enable Active-low write strobe; initiates command register load or data latch on rising edge
RY/BY# Ready/Busy indicator Open-drain active-low signal; asserts low during embedded program/erase operations
VCC Core supply 3.0 V ±0.3 V supply for logic and memory array; powers internal voltage generators
VIO I/O supply 1.65 V to VCC; sets input threshold and output drive strength independently of core voltage

Key Features

Feature Design Value
Asynchronous page-mode read 32-byte aligned page access with 15 ns cycle time - accelerates linear code fetch in microcontroller boot loaders
Hardware ECC engine On-the-fly single-bit correction per 512-byte sector - eliminates need for external error-handling firmware
Uniform 128-kbyte sectors 128 identically sized erasable blocks - simplifies BOM management and firmware update partitioning
Versatile I/O voltage range VIO = 1.65 V to VCC - enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters
OTP secure silicon region 1024-byte one-time-programmable array with dual lockable regions - stores cryptographic keys or calibration data permanently

Applications

Industrial PLC Firmware Storage Automotive ADAS Boot Memory

Use Scenario: Storing firmware images and configuration tables in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with deterministic 90 ns latency.

Use Value: Eliminates external SRAM copy step during boot; 20-year data retention ensures firmware persistence over equipment lifetime.

Use Scenario: Holding boot code and safety-critical initialization routines for radar ECU and camera processing units meeting ISO 26262 ASIL-B requirements.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified parallel NOR flash used as primary boot device with hardware ECC for fault containment.

Use Value: Single-bit ECC and 100K-cycle endurance support repeated OTA updates while maintaining functional safety compliance.

Telecom Base Station BIOS Medical Imaging System Configuration

Use Scenario: Hosting BIOS and FPGA configuration bitstreams in 5G remote radio units operating in extended temperature ranges.

IC Role / Device Role / Timing Role: High-reliability parallel flash with Versatile I/O enabling direct connection to 1.8 V FPGA configuration interfaces.

Use Value: 1.65–3.6 V VIO range avoids level-shifter components; 128-kbyte uniform sectors simplify field-upgrade partitioning.

Use Scenario: Storing calibration coefficients, DICOM metadata templates, and regulatory audit logs in FDA-cleared MRI and CT scanner control boards.

IC Role / Device Role / Timing Role: Secure non-volatile memory with OTP region for immutable calibration signatures and tamper-evident logging.

Use Value: Dual-lock OTP regions prevent accidental overwrite of medical device calibration data while supporting traceable revision history.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL128S90TFI020 Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP package Used where board space constraints prohibit 56-pin TSOP; requires different PCB layout and reflow profile Select when footprint miniaturization is prioritized over legacy socket compatibility
MX29GL128FPTI-90G Macronix 128 Mb parallel NOR; 90 ns access; no integrated ECC; CFI-compatible but separate ECC must be implemented in host Lower cost where host MCU handles ECC or where single-bit errors are acceptable per system-level redundancy Select only if host processor has dedicated ECC logic or system-level error mitigation already exists

Compared with S29GL128S90FHA020, the TSOP-packaged Infineon variant offers plug-in replacement for legacy designs, while the LAE BGA alternative trades serviceability for compactness; the Macronix part reduces BOM cost but shifts ECC responsibility to the host, increasing firmware complexity and validation scope.

Availability

S29GL128S90FHA020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and telecom base station BIOS requiring stable component supply across extended temperature operation and long product lifecycles.

Supply support for S29GL128S90FHA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.

This device belongs to the GL-S MIRRORBIT™ Eclipse NOR flash product line, engineered for embedded systems demanding XIP-capable boot memory with industrial-grade endurance, ECC, and flexible I/O voltage operation.

FAQ

Does S29GL128S90FHA020 support both 1.8 V and 3.3 V I/O interfaces?

Yes. Its Versatile I/O feature allows VIO to operate from 1.65 V to VCC (max 3.6 V), enabling direct connection to 1.8 V microcontrollers or 3.3 V FPGAs without external level shifters. The device automatically adapts input thresholds and output drive strength based on VIO voltage, verified per datasheet Section 8.3.

What is the function of the RY/BY# pin during programming?

RY/BY# is an open-drain ready/busy indicator that asserts low during all embedded operations - including buffer programming, sector erase, and status register writes. It remains low until the operation completes and the internal state machine returns to read mode, providing hardware-synchronized timing for host polling without software delays.

How does the 512-byte write buffer improve effective programming speed?

The write buffer allows up to 256 words (512 bytes) to be loaded into an internal latch before initiating a single embedded program operation. This reduces total programming time by ~70% compared to single-word programming, as overhead from command sequencing and setup is amortized across multiple words - confirmed in datasheet Section 5.7 performance table.

Is the OTP region truly one-time programmable, and how is it secured?

Yes. The 1024-byte OTP array contains two independently lockable regions. Once a lock bit is set via the CFI command set, the corresponding region becomes permanently read-only. Locking is irreversible and survives power cycles; verification is performed via status register bit 6 (OTP_LOCK), documented in Section 2.6 and Table 7-1 of the datasheet.

S29GL128S90FHA020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
64-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
8M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
90 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (13x11)

S29GL128S90FHA020 FAQ

1.How can I place an order for S29GL128S90FHA020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S90FHA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S90FHA020 reliable?

The price and inventory of S29GL128S90FHA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S90FHA020 is usually 5 days.

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S29GL128S90FHA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S90FHA020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S90FHA020?

For technical support, including S29GL128S90FHA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S90FHA020 requirements.

6.How does Aetrix verify that S29GL128S90FHA020 is sourced from the original manufacturer or authorized distributors?

All S29GL128S90FHA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S90FHA020 meets industry standards.

7.What is the process for return or replacement of S29GL128S90FHA020?

All S29GL128S90FHA020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S90FHA020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S90FHA020 part is unused and in its original packaging.

Return procedure for S29GL128S90FHA020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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