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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL128S90FHI010

Name: S29GL128S90FHI010
Brand: Infineon Technologies
SKU: S29GL128S90FHI010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL128S90FHI010

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL128S90FHI010.pdf

Description:: IC FLASH 128MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL128S90FHI010 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C), used for XIP-capable firmware storage in microcontroller boot loaders and embedded control systems.

For engineers reviewing the S29GL128S90FHI010 datasheet, S29GL128S90FHI010 pinout, S29GL128S90FHI010 application, or S29GL128S90FHI010 equivalent, this device supports asynchronous read, sector erase, buffer programming up to 512 bytes, hardware ECC, and versatile I/O (1.65 V to VCC) - critical for legacy parallel NOR designs requiring long-term reliability and AEC-Q100-compliant variants.

Technical Context

The S29GL128S90FHI010 implements an asynchronous parallel interface with word-aligned addressing (A0–A22), 32-byte page read architecture, and embedded algorithm controller (EAC) managing program/erase operations without host CPU intervention. It uses internal voltage generators for erase/program and supports status polling, RY/BY# signaling, and command-set-based operation per CFI specification.

Its 65 nm MIRRORBIT™ Eclipse process enables uniform 128-kbyte sectors, suspend/resume capability for both program and erase, and advanced sector protection (volatile/non-volatile lock). The device integrates a 1024-byte OTP array with two lockable regions and supports automatic single-bit error correction via on-die hardware ECC.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	128 Mb (16 MB), organized as 1,048,576 × 16-bit words - defines firmware image capacity and address space size.
Random access time (tACC)	90 ns at VCC = VIO - determines worst-case instruction fetch latency in XIP applications.
Page access time (tPACC)	15 ns - enables fast sequential reads within 32-byte aligned pages for burst code execution.
Programming buffer size	512 bytes (256 words) - reduces effective programming time by minimizing command overhead per write block.
Erase cycle endurance	100,000 cycles per sector - ensures longevity in field-updatable firmware partitions.
Data retention	20 years at +85°C - guarantees non-volatility over full industrial temperature lifetime.
Operating voltage range	VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - allows interfacing with mixed-voltage SoCs and legacy 3.3 V logic.

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint, lead-free and RoHS compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address inputs	Word-aligned address bus; A22 is MSB for 128 Mb (2²³ = 8,388,608 words × 2 bytes).
DQ0–DQ15	Data I/O bidirectional bus	×16 parallel interface; supports byte/word writes and reads without external multiplexing.
CE#	Chip enable	Active-low chip select; controls device power state and enables read/write/erase operations.
OE#	Output enable	Active-low control for output buffer; used during read cycles to gate data onto DQ lines.
WE#	Write enable	Active-low strobe for write operations; latches address/data and initiates embedded algorithms.
RY/BY#	Ready/Busy indicator	Open-drain output signaling active program/erase; eliminates need for polling in real-time systems.
RESET#	Hardware reset	Active-low asynchronous abort of ongoing operations and return to read mode.
WP#	Write protect	Hardware sector lock override; disables program/erase when asserted low.

Key Features

Feature	Design Value
Asynchronous page-mode read	32-byte aligned page access with 15 ns intra-page timing - accelerates linear code execution without cache.
Hardware ECC engine	On-die single-bit error correction with automatic detection - eliminates need for external ECC logic or software overhead.
Versatile I/O (VIO)	Independent VIO supply (1.65 V to VCC) - enables direct connection to 1.8 V or 3.3 V controllers without level shifters.
Uniform 128-kB sectors	128 identically sized erase blocks - simplifies firmware partitioning and wear leveling in bootloader-resident code.
Suspend/resume capability	Interruptible program and erase operations - allows high-priority read access during background writes.

Applications

Industrial PLC Firmware Storage

Automotive Instrument Cluster Boot Memory

Use Scenario: Storing boot code and configuration parameters in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable firmware memory with deterministic 90 ns read latency and 100,000-cycle endurance.

Use Value: Eliminates external SRAM buffering and enables direct execution from flash, reducing BOM count and power consumption.

Use Scenario: Holding calibrated display firmware and safety-critical boot images in automotive digital instrument clusters.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified parallel NOR flash with 20-year data retention and hardware ECC for ASIL-B compliance support.

Use Value: Ensures firmware integrity across thermal cycling and EMI exposure without requiring redundant checksum verification layers.

Medical Diagnostic Equipment BIOS

Telecom Base Station Configuration Storage

Use Scenario: Hosting BIOS and calibration tables in portable ultrasound and imaging devices requiring regulatory traceability.

IC Role / Device Role / Timing Role: Secure silicon region (OTP) with dual lockable zones for storing cryptographic keys and device-specific identifiers.

Use Value: Enables hardware-enforced one-time provisioning of security credentials, meeting IEC 62304 Class C requirements.

Use Scenario: Retaining FPGA configuration bitstreams and runtime parameter sets in carrier-grade wireless infrastructure.

IC Role / Device Role / Timing Role: Sector-erasable flash supporting concurrent read while programming via suspend/resume commands.

Use Value: Allows live reconfiguration of baseband processing units without service interruption during OTA updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL128S90TFI010	Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP package; identical timing and feature set.	Used where board space is constrained and PCB routing favors BGA over gull-wing leads.	Select when footprint miniaturization and thermal performance outweigh manual rework constraints.
MX29GL128FPTI-90G	Macronix 128 Mb parallel NOR; 90 ns tACC, but lacks hardware ECC and OTP array; CFI-compatible but no ASP or suspend/resume.	Suitable for cost-sensitive consumer applications where ECC and security features are omitted.	Choose only if firmware integrity monitoring is handled externally and sector protection is software-managed.

Compared with S29GL128S90FHI010, the TSOP-packaged Infineon variant offers superior reliability features (ECC, OTP, ASP) over Macronix, while the LAE-BGA alternative provides identical functionality in a smaller footprint - enabling trade-offs between serviceability and density.

Availability

S29GL128S90FHI010 is available at Aetrix Electronics and suitable for industrial PLCs, automotive instrument clusters, medical diagnostic equipment, and telecom base station configurations requiring stable component supply and long-lifecycle support.

Supply support for S29GL128S90FHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with leadership in industrial and automotive-grade non-volatile memory solutions.

The GL-S family targets high-reliability embedded systems requiring XIP-capable parallel NOR flash with extended endurance, hardware ECC, and AEC-Q100 qualification - bridging legacy interface needs with modern process technology.

FAQ

Does S29GL128S90FHI010 support execute-in-place (XIP) operation?

Yes. The device supports true XIP operation with 90 ns random access and 15 ns page-mode timing, enabling direct CPU instruction fetch from flash without copying to RAM. Its asynchronous interface and deterministic latency meet real-time OS and bootloader requirements without caching.

What is the function of the RY/BY# pin?

RY/BY# is an open-drain ready/busy status indicator. When low, it signals active program or erase; when high, the device is ready for read or new command input. This eliminates software polling overhead and enables interrupt-driven operation in time-critical systems.

How does the Versatile I/O (VIO) feature benefit system design?

VIO allows independent supply of the I/O buffer (1.65 V to VCC) separate from the core VCC (2.7 V to 3.6 V). This permits direct interfacing with 1.8 V microcontrollers or FPGAs without external level shifters, reducing component count and signal integrity risk in mixed-voltage designs.

Is the 1024-byte OTP array field-programmable?

Yes. The OTP array is one-time programmable in two independently lockable 512-byte regions. Once locked, contents cannot be altered. It is commonly used for storing cryptographic keys, device serial numbers, or calibration data that must remain immutable after manufacturing test.

S29GL128S90FHI010 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 90 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL128S90FHI010 FAQ

1.How can I place an order for S29GL128S90FHI010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S90FHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S90FHI010 reliable?

The price and inventory of S29GL128S90FHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S90FHI010 is usually 5 days.

3.What payment methods are accepted for S29GL128S90FHI010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S90FHI010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S90FHI010?

S29GL128S90FHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S90FHI010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S90FHI010?

For technical support, including S29GL128S90FHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S90FHI010 requirements.

6.How does Aetrix verify that S29GL128S90FHI010 is sourced from the original manufacturer or authorized distributors?

All S29GL128S90FHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S90FHI010 meets industry standards.

7.What is the process for return or replacement of S29GL128S90FHI010?

All S29GL128S90FHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S90FHI010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S90FHI010 part is unused and in its original packaging.

Return procedure for S29GL128S90FHI010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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