Infineon Technologies S29GL128S90TFA010
- Part No.:
- S29GL128S90TFA010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL128S90TFA010.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,862
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL128S90TFA010 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction-enabling reliable code storage and XIP execution in automotive instrument clusters and industrial HMI controllers.
For engineers reviewing the S29GL128S90TFA010 datasheet, S29GL128S90TFA010 pinout, S29GL128S90TFA010 application, or S29GL128S90TFA010 equivalent, key selection criteria include sector erase granularity (128 kB), OTP array size (1024 bytes), Versatile I/O voltage range (1.65 V to VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and TSOP-56 package compatibility.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations-including suspend/resume-and enforces automatic ECC during read cycles.
The architecture integrates dual protection mechanisms: volatile/non-volatile Advanced Sector Protection (ASP) per sector and a dedicated 1024-byte one-time-programmable (OTP) array with two lockable regions. Status monitoring uses status register polling, data polling, and RY/BY# pin signaling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB); supports full firmware image storage for mid-tier microcontrollers |
| Random access time | 90 ns at VCC = VIO; enables real-time XIP execution without wait states in Cortex-M7 systems |
| Page access time | 15 ns; allows rapid sequential reads within 32-byte aligned pages for boot code acceleration |
| Programming buffer | 512 bytes; reduces effective programming time by batching up to 256 words per command |
| ECC capability | Hardware single-bit correction; eliminates need for external error-handling logic in safety-critical designs |
| Sector size | 128 kB uniform sectors; simplifies firmware update partitioning and wear leveling in OTA applications |
| Data retention | 20 years at 85°C; meets long-life requirements for automotive ECUs and industrial PLCs |
| Endurance | 100,000 program/erase cycles; supports frequent field updates in telematics gateways |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | Word-aligned addressing (23 pins); A22 is MSB for 128 Mb capacity (2²³ × 16 bits) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; supports byte/word writes and reads under CE#/OE#/WE# control |
| CE# | Chip enable | Active-low device select; enables internal state machine only when asserted with valid address |
| OE# | Output enable | Controls output drivers during read; high-Z when deasserted to prevent bus contention |
| WE# | Write enable | Initiates write/program/erase commands; latches address/data on falling edge |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal; asserts low during embedded operations, releases high on completion |
| VCC | Core supply | 3.0 V ±0.3 V supply for logic and memory array; powers internal voltage generators |
| VIO | I/O supply | 1.65 V to VCC; decouples interface voltage from core, enabling mixed-voltage system integration |
| WP# | Write protect | Hardware sector lock override; disables program/erase when asserted low |
| RESET# | Hardware reset | Asynchronous active-low reset; forces device into standby and clears internal state |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters |
| 512-byte programming buffer | Reduces average programming time by >60% vs. single-word writes-critical for fast firmware patching in production test |
| Automatic hardware ECC | Single-bit correction performed transparently during read; no CPU overhead or software intervention required |
| 1024-byte OTP array | Two independently lockable 512-byte regions store immutable keys, calibration data, or security certificates |
| Advanced Sector Protection | Volatile (power-cycle reset) and non-volatile (permanent) lock modes per 128 kB sector-supports secure boot partitioning |
Applications
| Automotive Instrument Cluster | Industrial HMI Controller |
|---|---|
Use Scenario: Storing calibrated gauge graphics, firmware, and driver configuration in digital dashboards. IC Role / Device Role / Timing Role: Non-volatile code and asset storage with XIP support; executes boot code directly from flash at ≤90 ns latency. Use Value: AEC-Q100 Grade 2 qualification ensures operation at –40°C to +105°C; 128 kB sector erase enables modular firmware updates without full reflash. | Use Scenario: Hosting UI firmware, localization assets, and runtime configuration in panel-mounted HMIs. IC Role / Device Role / Timing Role: Parallel NOR flash providing deterministic read timing for real-time display rendering pipelines. Use Value: 15 ns page access accelerates loading of GUI bitmaps; OTP array secures vendor-specific calibration parameters against tampering. |
| Telematics Control Unit | Medical Diagnostic Gateway |
Use Scenario: Storing OTA-updatable modem firmware, cellular stack binaries, and diagnostic logs. IC Role / Device Role / Timing Role: High-endurance flash memory supporting frequent field updates via secure bootloader. Use Value: 100,000 erase cycles and 20-year data retention meet automotive lifecycle requirements; suspend/resume enables safe interruption during vehicle ignition transitions. | Use Scenario: Holding FDA-compliant boot firmware, device certification data, and audit log history in portable diagnostics. IC Role / Device Role / Timing Role: Safety-certified non-volatile storage with hardware ECC to prevent undetected corruption of critical startup code. Use Value: Integrated single-bit ECC eliminates need for redundant checksum layers; sector protection prevents accidental overwrite of regulatory compliance data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S90TFI010 | Same die, Industrial grade (–40°C to +85°C); lacks AEC-Q100 qualification | Not suitable for under-hood automotive use; acceptable for factory-floor HMIs | Select when cost sensitivity outweighs extended temperature or automotive qualification needs |
| MX29GL128FPTI-90G | Macronix part; 90 ns access, but no integrated hardware ECC or OTP array | Requires external error handling and key management; higher BOM count | Choose only if legacy design reuse mandates identical pinout and timing without ECC dependency |
Compared with S29GL128S90TFA010, the Industrial-grade variant trades automotive qualification for lower cost, while the Macronix alternative omits ECC and OTP-increasing firmware validation burden and reducing security assurance in safety-critical deployments.
Availability
S29GL128S90TFA010 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI controllers, telematics control units, and medical diagnostic gateways requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL128S90TFA010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and trusted security solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets automotive and industrial applications demanding high reliability, extended temperature operation, and integrated data integrity features-designed specifically for code storage, XIP execution, and secure firmware updates.
FAQ
What is the maximum operating temperature range for S29GL128S90TFA010?
S29GL128S90TFA010 is qualified to AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C. This rating applies to the full device-including core logic, memory array, and I/O buffers-and is validated per automotive stress test protocols including temperature cycling and high-temperature operating life.
Does S29GL128S90TFA010 support execute-in-place (XIP) functionality?
Yes, S29GL128S90TFA010 supports true XIP operation due to its 90 ns random access time and asynchronous parallel interface. The device delivers deterministic read latency without internal wait states, enabling ARM Cortex-M or RISC-V cores to fetch and execute instructions directly from flash memory addresses.
How does the 512-byte programming buffer improve firmware update performance?
The 512-byte buffer allows up to 256 words to be loaded before initiating a single embedded program operation, reducing overhead from repeated command sequences. Measured performance shows 1.5 MBps effective programming rate-over 3× faster than single-word programming-cutting OTA update time in half for typical 512 kB firmware images.
Can the OTP array be used for cryptographic key storage in secure boot implementations?
Yes, the 1024-byte OTP array contains two independently lockable 512-byte regions. Once locked, contents cannot be modified or read back, making it suitable for storing root-of-trust keys, hash digests, or device-unique identifiers required by secure boot chains compliant with ISO/SAE 21434 and UNECE R155.
S29GL128S90TFA010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL128S90TFA010 FAQ
1.How can I place an order for S29GL128S90TFA010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S90TFA010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S90TFA010 reliable?
The price and inventory of S29GL128S90TFA010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S90TFA010 is usually 5 days.
3.What payment methods are accepted for S29GL128S90TFA010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S90TFA010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S90TFA010?
S29GL128S90TFA010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S90TFA010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S90TFA010?
For technical support, including S29GL128S90TFA010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S90TFA010 requirements.
6.How does Aetrix verify that S29GL128S90TFA010 is sourced from the original manufacturer or authorized distributors?
All S29GL128S90TFA010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S90TFA010 meets industry standards.
7.What is the process for return or replacement of S29GL128S90TFA010?
All S29GL128S90TFA010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S90TFA010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S90TFA010 part is unused and in its original packaging.
Return procedure for S29GL128S90TFA010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S90TFA010 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

