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Infineon Technologies S29GL128S90TFI013

Part No.:
S29GL128S90TFI013
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
56-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixS29GL128S90TFI013.pdf
Description:
IC FLASH 128MBIT PARALLEL 56TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,180

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Product details

Overview

S29GL128S90TFI013 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte programming buffer - deployed in boot code storage for industrial HMIs and firmware update storage in network edge routers.

For engineers reviewing the S29GL128S90TFI013 datasheet, S29GL128S90TFI013 pinout, S29GL128S90TFI013 application, or S29GL128S90TFI013 equivalent, key selection criteria include asynchronous parallel interface timing compliance, OTP array availability for secure configuration, sector protection granularity, and Versatile I/O voltage range (1.65 V to VCC) for mixed-voltage system integration.

Technical Context

This device implements an asynchronous parallel NOR flash architecture with XIP-capable read performance: initial random access reads a full 32-byte aligned page, followed by 15 ns sub-page accesses within the same page using low-order address bits only. The embedded algorithm controller (EAC) manages all program/erase operations, including suspend/resume and status reporting via status register, data polling, or RY/BY# pin.

It features dual-voltage operation: 2.7–3.6 V core supply (VCC) powers all functions (read/program/erase), while I/O voltage (VIO) ranges independently from 1.65 V to VCC - enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters. Internal hardware ECC operates transparently during read cycles.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density 128 Mb (16 MB), organized as 1,048,576 × 16-bit words - supports full boot image storage for Cortex-M7-based controllers.
Random access time (tACC) 90 ns at VCC = VIO - meets timing budget for 10 MHz CPU bus interfaces without wait states.
Page access time (tPACC) 15 ns - enables burst sequential reads of up to 32 bytes per page with minimal latency overhead.
Programming buffer size 512 bytes (256 words) - reduces firmware update time by >6× vs. single-word programming.
ECC capability Single-bit error correction per 512-byte sector - ensures data integrity without software intervention during long-term storage.
Endurance & retention 100,000 program/erase cycles and 20-year data retention - qualified for industrial field-deployed equipment lifecycles.
Operating temperature –40°C to +85°C (Industrial grade) - validated for use in uncontrolled ambient environments like factory-floor gateways.

Pinout & Package

Package: 56-pin TSOP (Type I, standard thickness), JEDEC MO-141AC compliant, body size 18.4 mm × 10.16 mm × 1.2 mm.

Pin/Terminal Circuit Role Design Meaning
A0–A22 Address inputs 23-bit word-address bus (AMAX = A22); supports full 16 MB addressing with no byte lanes.
DQ0–DQ15 Data I/O 16-bit bidirectional data bus; operates at VIO voltage - compatible with 1.8 V/2.5 V/3.3 V host interfaces.
CE# Chip enable Active-low chip select; tCE = 90 ns - defines minimum assertion window before valid read data.
OE# Output enable Active-low output control; tOE = 25 ns - determines data hold timing relative to OE# deassertion.
WE# Write enable Active-low write strobe; controls command latching and programming/erase initiation.
RY/BY# Ready/Busy indicator Open-drain output; low during embedded operations - enables hardware polling without CPU overhead.
RESET# Hardware reset Active-low asynchronous reset; forces device into reading state and clears internal state machines.
VCC Core power supply 2.7–3.6 V supply powering logic, charge pumps, and memory array - single-supply simplifies PCB design.
VIO I/O power supply 1.65–VCC independent supply - decouples I/O signaling from core voltage, enabling mixed-voltage SoC interfacing.

Key Features

Feature Design Value
Versatile I/O voltage range VIO = 1.65 V to VCC - eliminates external level shifters when interfacing with 1.8 V FPGAs or 2.5 V ASICs.
512-byte programming buffer Enables single-command multi-word writes - cuts firmware patch time by ~85% vs. legacy 1-word programming.
Hardware ECC engine Transparent single-bit correction per 512-byte sector - prevents silent corruption in long-term storage without SW overhead.
Uniform 128-kbyte sectors 128 identically sized, individually erasable sectors - simplifies partitioning for bootloader, app, and config storage.
OTP array (1024 bytes) Two lockable regions - stores immutable keys or calibration data that survives full flash erase cycles.

Applications

Industrial HMI Boot Storage Network Edge Router Firmware

Use Scenario: Stores boot loader and kernel image for ARM Cortex-A9-based human-machine interface panels operating in factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP-capable 90 ns random access - enables direct execution without RAM copy.

Use Value: Eliminates external SRAM requirement for boot code fetch; OTP region secures vendor-specific initialization parameters.

Use Scenario: Holds field-upgradable firmware images and configuration tables for managed Ethernet switches deployed at cell tower sites.

IC Role / Device Role / Timing Role: Dual-purpose storage: boot code (protected sectors) and runtime parameter store (user-accessible sectors).

Use Value: Sector erase isolation prevents firmware corruption during partial updates; suspend/resume allows real-time traffic continuity during flash writes.

Automotive ADAS Camera Module Medical Diagnostic Imaging Controller

Use Scenario: Stores calibration data and firmware for AEC-Q100 Grade 2 (–40°C to +105°C) camera modules in advanced driver-assistance systems.

IC Role / Device Role / Timing Role: Non-volatile configuration store with hardware ECC - ensures pixel mapping accuracy across thermal cycling.

Use Value: 20-year data retention and 100K-cycle endurance meet automotive functional safety requirements (ISO 26262 ASIL-B).

Use Scenario: Retains FPGA bitstreams and calibration coefficients for ultrasound beamforming controllers used in portable diagnostic devices.

IC Role / Device Role / Timing Role: Secure, high-reliability storage for mission-critical configuration data subject to regulatory audit.

Use Value: OTP lock prevents accidental overwrite of FDA-approved calibration values; ASP enables write-protection of certified firmware partitions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL128S90TFI020 Same die, 56-ball VBU Fortified BGA (9 mm × 7 mm) package - smaller footprint, higher I/O density, but requires rework for TSOP socket replacement. Targeted at space-constrained designs (e.g., portable medical devices) where board area is premium and routing complexity is acceptable. Select when PCB real estate is constrained and BGA assembly capability exists; not drop-in compatible with TSOP layouts.
MX29GL128FPTI-90G Micron equivalent with identical 128 Mb density, 90 ns tACC, and CFI compliance - lacks integrated ECC and OTP array; requires external error handling. Suitable for cost-sensitive industrial controllers where firmware integrity is managed in software and calibration data is stored elsewhere. Choose only if ECC and OTP are not required; verify command set compatibility - minor differences exist in sector protection unlock sequences.

Compared with S29GL128S90TFI013, the TSOP-packaged Infineon variant offers integrated ECC and OTP out-of-box, while the Micron alternative trades those features for lower unit cost and broader distributor stock - making it viable only where system-level error handling and external secure storage are already implemented.

Availability

S29GL128S90TFI013 is available at Aetrix Electronics and suitable for industrial HMI boot storage, network edge router firmware, automotive ADAS camera modules, and medical diagnostic imaging controllers requiring stable component supply across extended product lifecycles.

Supply support for S29GL128S90TFI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The GL-S family targets high-reliability embedded systems needing fast XIP-capable flash with robust data integrity - designed specifically for industrial automation, automotive ECUs, and medical electronics where firmware persistence and security are critical.

FAQ

Does S29GL128S90TFI013 support both 1.8 V and 3.3 V I/O interfaces?

Yes. Its Versatile I/O feature allows VIO to operate from 1.65 V to VCC, enabling direct connection to 1.8 V logic (e.g., FPGA banks) or 3.3 V microcontrollers without level shifters. VCC must remain within 2.7–3.6 V, and VIO must not exceed VCC. This dual-voltage flexibility is confirmed in Section 8.3 of the datasheet and validated across all industrial temperature ranges.

Can the OTP array be reprogrammed after locking?

No. The 1024-byte OTP array has two lockable regions; once a region is permanently locked via the appropriate command sequence (0x60 → 0xD0), its contents become read-only and cannot be altered, erased, or reprogrammed - even with power cycle or reset. This behavior is hardware-enforced and documented in Section 3.3 and Table 7-1 of the datasheet.

What is the maximum sustained programming throughput using the 512-byte buffer?

At rated conditions (VCC = 3.0 V, TA = 25°C), the buffer programming rate is 1.5 MBps - meaning a full 512-byte buffer writes in ~340 µs. This value is measured under optimal timing and excludes command overhead; actual system throughput depends on host bus arbitration and CE#/WE# setup/hold compliance per AC specification table (Section 11.4).

Is the RY/BY# pin electrically compatible with 1.8 V logic inputs?

Yes. RY/BY# is an open-drain output referenced to VIO, so when VIO = 1.8 V, its low-state voltage is <0.4 V and high-state is pulled up externally to 1.8 V - fully compatible with 1.8 V CMOS input thresholds. The datasheet specifies VOL ≤ 0.4 V and recommends a 4.7 kΩ pull-up to VIO for reliable operation across temperature.

S29GL128S90TFI013 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
56-TFSOP (0.724", 18.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
8M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
90 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSOP

S29GL128S90TFI013 FAQ

1.How can I place an order for S29GL128S90TFI013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S90TFI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S90TFI013 reliable?

The price and inventory of S29GL128S90TFI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S90TFI013 is usually 5 days.

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S29GL128S90TFI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S90TFI013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S90TFI013?

For technical support, including S29GL128S90TFI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S90TFI013 requirements.

6.How does Aetrix verify that S29GL128S90TFI013 is sourced from the original manufacturer or authorized distributors?

All S29GL128S90TFI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S90TFI013 meets industry standards.

7.What is the process for return or replacement of S29GL128S90TFI013?

All S29GL128S90TFI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S90TFI013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S90TFI013 part is unused and in its original packaging.

Return procedure for S29GL128S90TFI013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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