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Infineon Technologies S29GL128S90TFI023

Part No.:
S29GL128S90TFI023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
56-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixS29GL128S90TFI023.pdf
Description:
IC FLASH 128MBIT PARALLEL 56TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,733

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Product details

Overview

S29GL128S90TFI023 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and MIRRORBIT™ Eclipse 65 nm technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring high reliability and fast XIP execution.

For engineers reviewing the S29GL128S90TFI023 datasheet, S29GL128S90TFI023 pinout, S29GL128S90TFI023 application, or S29GL128S90TFI023 equivalent, key selection criteria include 128-kbyte uniform sector erase, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), and AEC-Q100 Grade 3 qualification for automotive use cases.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability during active programming or erasing.

The internal architecture includes dedicated erase voltage and program voltage generators, on-die ECC logic for real-time single-bit correction, and a configurable sector protection scheme with volatile/non-volatile lock bits. The CFI parameter table enables host software to auto-configure timing and command sets at initialization.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density128 Mb (16 MB); supports full boot image storage for mid-complexity microcontrollers
Random access time90 ns at VCC = VIO; enables deterministic XIP execution latency in real-time systems
Page access time15 ns; allows rapid sequential reads within 32-byte aligned pages for firmware hot-path access
Write buffer size512 bytes; reduces effective programming time by batching up to 256 words per command
ECC capabilitySingle-bit error correction via hardware; eliminates need for external error-handling firmware overhead
Endurance & retention100,000 program/erase cycles; 20-year data retention at 85°C - validated for long-life industrial deployments
Operating temperature–40°C to +85°C (Industrial grade); qualified per AEC-Q100 Grade 3 for under-hood automotive ECUs

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AC footprint. Compatible with automated PCB assembly and legacy socket-based programming fixtures.

Pin/TerminalCircuit RoleDesign Meaning
A0–A22Address inputsWord-aligned address bus (23 pins); A22 is MSB for 128 Mb addressing (2²³ × 16 bits)
DQ0–DQ15Data I/O16-bit bidirectional data bus; supports Versatile I/O (VIO = 1.65–3.6 V independent of VCC)
CE#Chip enableActive-low chip select; controls device power state and command latching timing (tCE = 90 ns max)
OE#Output enableActive-low output gate; enables data bus drivers during read (tOE = 25 ns max)
WE#Write enableActive-low write strobe; initiates program/erase commands and data latching
RY/BY#Ready/Busy indicatorOpen-drain status output; low during embedded operations, used for hardware polling
WP#Write protectHardware sector lock override; disables program/erase when asserted low
VCCCore supply3.0 V ±10% supply (2.7–3.6 V); powers core logic, EAC, and voltage generators
VIOI/O supplyIndependent I/O rail (1.65–3.6 V); decouples interface voltage from core for mixed-voltage SoC interfacing

Key Features

FeatureDesign Value
Asynchronous page-mode read32-byte aligned page access with 15 ns cycle time - accelerates linear firmware fetch without burst clocking
512-byte write bufferEnables single-command programming of up to 256 words - cuts host CPU intervention vs. byte/word programming
Hardware ECC engineOn-the-fly single-bit correction with no software overhead - maintains data integrity across 100k+ erase cycles
Uniform 128-kbyte sectors128 identically sized, independently erasable sectors - simplifies wear leveling and field firmware updates
Advanced sector protectionVolatile (SRAM-based) and non-volatile (OTP-backed) lock bits per sector - supports secure boot partitioning

Applications

Industrial PLC Firmware StorageAutomotive Body Control Module (BCM)

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers with extended operating life requirements.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with <90 ns latency and 20-year data retention.

Use Value: Eliminates external RAM copy step during startup; supports field firmware updates via uniform 128-kbyte sector erase.

Use Scenario: Holding calibrated sensor parameters and safety-critical configuration data in AEC-Q100 Grade 3 qualified BCMs.

IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with –40°C to +85°C operation and hardware ECC for ASIL-B data integrity.

Use Value: Meets ISO 26262 functional safety requirements through on-die ECC and 100,000-cycle endurance for calibration rewrites.

Medical Diagnostic Imaging Boot ROMAvionics Data Logger Configuration

Use Scenario: Hosting immutable boot firmware and FPGA configuration bitstreams in Class II medical imaging devices.

IC Role / Device Role / Timing Role: High-reliability parallel flash with CFI-compliant interface for BIOS-style initialization and secure OTP region locking.

Use Value: Separate 1024-byte OTP array with dual lockable regions ensures tamper-proof calibration constants and regulatory compliance keys.

Use Scenario: Storing flight-critical configuration tables and event-triggered logging metadata in DO-178C-certified avionics recorders.

IC Role / Device Role / Timing Role: Radiation-tolerant (tested per MIL-STD-883H) parallel flash with suspend/resume during power transients.

Use Value: Program/erase suspend capability prevents corruption during aircraft power-up/down sequences with unstable 28 V DC bus.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL128P90TFI020Same density and timing, but uses older 90 nm process; lacks Versatile I/O (VIO fixed to VCC)No independent I/O rail - incompatible with mixed-voltage SoCs requiring 1.8 V I/O at 3.3 V coreSelect only if legacy board compatibility or cost sensitivity outweighs I/O flexibility needs
MX29GL128FPTI-90GMacronix part with identical 128 Mb density, 90 ns tACC, and 512-byte buffer; no integrated ECCRequires external ECC handling in host firmware or companion controllerChoose when system already implements software ECC or when BOM consolidation favors single-supplier sourcing

Compared with S29GL128P90TFI020 and MX29GL128FPTI-90G, the S29GL128S90TFI023 uniquely combines Versatile I/O, on-die ECC, and AEC-Q100 Grade 3 qualification - making it optimal for new designs demanding mixed-voltage interoperability and functional safety compliance without firmware overhead.

Availability

S29GL128S90TFI023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive body control modules, medical diagnostic imaging boot ROM, and avionics data logger configuration requiring stable component supply across extended product lifecycles.

Supply support for S29GL128S90TFI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The GL-S family targets embedded systems needing fast, dense, and robust non-volatile storage - specifically engineered for XIP-capable boot code, firmware updates, and safety-critical parameter storage in harsh environments.

FAQ

Does S29GL128S90TFI023 support both 3.3 V and 1.8 V I/O interfaces?

Yes. Its Versatile I/O feature allows VIO to operate independently from VCC across 1.65 V to 3.6 V. When interfaced with a 1.8 V SoC, VIO is set to 1.8 V while VCC remains at 3.0 V - enabling direct connection without level shifters. This is confirmed in Section 8.3 of the datasheet and validated in Infineon's application note AN229227.

What is the function of the STB pin on S29GL128S90TFI023?

The STB (Strobe) pin is not present on the S29GL128S90TFI023. It appears only on earlier GL-P series devices. This part uses standard CE#/OE#/WE# control signals and has no STB pin - verified in the "Signal Descriptions" section (page 72) and pinout diagrams (pages 104–109) of the official datasheet 001-98285 Rev. *U.

Can the OTP array be programmed after initial device power-up?

Yes. The 1024-byte OTP (One-Time Programmable) array is accessible via standard CFI commands and can be programmed in-system using the same command set as main array programming. Each of its two lockable regions may be permanently locked after programming - detailed in Section 3.3 and Table 3-1 of the datasheet.

Is the 15 ns page access time guaranteed across the full industrial temperature range?

Yes. The 15 ns page access time (tPACC) is specified over the full –40°C to +85°C industrial temperature range and 2.7–3.6 V VCC, as stated in the "Performance Summary" table (page 2) and confirmed in AC characteristics Table 11-3 (page 93) of datasheet 001-98285 Rev. *U.

S29GL128S90TFI023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
56-TFSOP (0.724", 18.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
8M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
90 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSOP

S29GL128S90TFI023 FAQ

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Please submit a Request for Quotation (RFQ) for S29GL128S90TFI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of S29GL128S90TFI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S90TFI023 is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S90TFI023?

For technical support, including S29GL128S90TFI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S90TFI023 requirements.

6.How does Aetrix verify that S29GL128S90TFI023 is sourced from the original manufacturer or authorized distributors?

All S29GL128S90TFI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S90TFI023 meets industry standards.

7.What is the process for return or replacement of S29GL128S90TFI023?

All S29GL128S90TFI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S90TFI023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S90TFI023 part is unused and in its original packaging.

Return procedure for S29GL128S90TFI023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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