Infineon Technologies S29GL128S90TFI023
- Part No.:
- S29GL128S90TFI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL128S90TFI023.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S29GL128S90TFI023 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and MIRRORBIT™ Eclipse 65 nm technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring high reliability and fast XIP execution.
For engineers reviewing the S29GL128S90TFI023 datasheet, S29GL128S90TFI023 pinout, S29GL128S90TFI023 application, or S29GL128S90TFI023 equivalent, key selection criteria include 128-kbyte uniform sector erase, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), and AEC-Q100 Grade 3 qualification for automotive use cases.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability during active programming or erasing.
The internal architecture includes dedicated erase voltage and program voltage generators, on-die ECC logic for real-time single-bit correction, and a configurable sector protection scheme with volatile/non-volatile lock bits. The CFI parameter table enables host software to auto-configure timing and command sets at initialization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB); supports full boot image storage for mid-complexity microcontrollers |
| Random access time | 90 ns at VCC = VIO; enables deterministic XIP execution latency in real-time systems |
| Page access time | 15 ns; allows rapid sequential reads within 32-byte aligned pages for firmware hot-path access |
| Write buffer size | 512 bytes; reduces effective programming time by batching up to 256 words per command |
| ECC capability | Single-bit error correction via hardware; eliminates need for external error-handling firmware overhead |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention at 85°C - validated for long-life industrial deployments |
| Operating temperature | –40°C to +85°C (Industrial grade); qualified per AEC-Q100 Grade 3 for under-hood automotive ECUs |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AC footprint. Compatible with automated PCB assembly and legacy socket-based programming fixtures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | Word-aligned address bus (23 pins); A22 is MSB for 128 Mb addressing (2²³ × 16 bits) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports Versatile I/O (VIO = 1.65–3.6 V independent of VCC) |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching timing (tCE = 90 ns max) |
| OE# | Output enable | Active-low output gate; enables data bus drivers during read (tOE = 25 ns max) |
| WE# | Write enable | Active-low write strobe; initiates program/erase commands and data latching |
| RY/BY# | Ready/Busy indicator | Open-drain status output; low during embedded operations, used for hardware polling |
| WP# | Write protect | Hardware sector lock override; disables program/erase when asserted low |
| VCC | Core supply | 3.0 V ±10% supply (2.7–3.6 V); powers core logic, EAC, and voltage generators |
| VIO | I/O supply | Independent I/O rail (1.65–3.6 V); decouples interface voltage from core for mixed-voltage SoC interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned page access with 15 ns cycle time - accelerates linear firmware fetch without burst clocking |
| 512-byte write buffer | Enables single-command programming of up to 256 words - cuts host CPU intervention vs. byte/word programming |
| Hardware ECC engine | On-the-fly single-bit correction with no software overhead - maintains data integrity across 100k+ erase cycles |
| Uniform 128-kbyte sectors | 128 identically sized, independently erasable sectors - simplifies wear leveling and field firmware updates |
| Advanced sector protection | Volatile (SRAM-based) and non-volatile (OTP-backed) lock bits per sector - supports secure boot partitioning |
Applications
| Industrial PLC Firmware Storage | Automotive Body Control Module (BCM) |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers with extended operating life requirements. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with <90 ns latency and 20-year data retention. Use Value: Eliminates external RAM copy step during startup; supports field firmware updates via uniform 128-kbyte sector erase. | Use Scenario: Holding calibrated sensor parameters and safety-critical configuration data in AEC-Q100 Grade 3 qualified BCMs. IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with –40°C to +85°C operation and hardware ECC for ASIL-B data integrity. Use Value: Meets ISO 26262 functional safety requirements through on-die ECC and 100,000-cycle endurance for calibration rewrites. |
| Medical Diagnostic Imaging Boot ROM | Avionics Data Logger Configuration |
Use Scenario: Hosting immutable boot firmware and FPGA configuration bitstreams in Class II medical imaging devices. IC Role / Device Role / Timing Role: High-reliability parallel flash with CFI-compliant interface for BIOS-style initialization and secure OTP region locking. Use Value: Separate 1024-byte OTP array with dual lockable regions ensures tamper-proof calibration constants and regulatory compliance keys. | Use Scenario: Storing flight-critical configuration tables and event-triggered logging metadata in DO-178C-certified avionics recorders. IC Role / Device Role / Timing Role: Radiation-tolerant (tested per MIL-STD-883H) parallel flash with suspend/resume during power transients. Use Value: Program/erase suspend capability prevents corruption during aircraft power-up/down sequences with unstable 28 V DC bus. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P90TFI020 | Same density and timing, but uses older 90 nm process; lacks Versatile I/O (VIO fixed to VCC) | No independent I/O rail - incompatible with mixed-voltage SoCs requiring 1.8 V I/O at 3.3 V core | Select only if legacy board compatibility or cost sensitivity outweighs I/O flexibility needs |
| MX29GL128FPTI-90G | Macronix part with identical 128 Mb density, 90 ns tACC, and 512-byte buffer; no integrated ECC | Requires external ECC handling in host firmware or companion controller | Choose when system already implements software ECC or when BOM consolidation favors single-supplier sourcing |
Compared with S29GL128P90TFI020 and MX29GL128FPTI-90G, the S29GL128S90TFI023 uniquely combines Versatile I/O, on-die ECC, and AEC-Q100 Grade 3 qualification - making it optimal for new designs demanding mixed-voltage interoperability and functional safety compliance without firmware overhead.
Availability
S29GL128S90TFI023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive body control modules, medical diagnostic imaging boot ROM, and avionics data logger configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL128S90TFI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-S family targets embedded systems needing fast, dense, and robust non-volatile storage - specifically engineered for XIP-capable boot code, firmware updates, and safety-critical parameter storage in harsh environments.
FAQ
Does S29GL128S90TFI023 support both 3.3 V and 1.8 V I/O interfaces?
Yes. Its Versatile I/O feature allows VIO to operate independently from VCC across 1.65 V to 3.6 V. When interfaced with a 1.8 V SoC, VIO is set to 1.8 V while VCC remains at 3.0 V - enabling direct connection without level shifters. This is confirmed in Section 8.3 of the datasheet and validated in Infineon's application note AN229227.
What is the function of the STB pin on S29GL128S90TFI023?
The STB (Strobe) pin is not present on the S29GL128S90TFI023. It appears only on earlier GL-P series devices. This part uses standard CE#/OE#/WE# control signals and has no STB pin - verified in the "Signal Descriptions" section (page 72) and pinout diagrams (pages 104–109) of the official datasheet 001-98285 Rev. *U.
Can the OTP array be programmed after initial device power-up?
Yes. The 1024-byte OTP (One-Time Programmable) array is accessible via standard CFI commands and can be programmed in-system using the same command set as main array programming. Each of its two lockable regions may be permanently locked after programming - detailed in Section 3.3 and Table 3-1 of the datasheet.
Is the 15 ns page access time guaranteed across the full industrial temperature range?
Yes. The 15 ns page access time (tPACC) is specified over the full –40°C to +85°C industrial temperature range and 2.7–3.6 V VCC, as stated in the "Performance Summary" table (page 2) and confirmed in AC characteristics Table 11-3 (page 93) of datasheet 001-98285 Rev. *U.
S29GL128S90TFI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL128S90TFI023 FAQ
1.How can I place an order for S29GL128S90TFI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S90TFI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S90TFI023 reliable?
The price and inventory of S29GL128S90TFI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S90TFI023 is usually 5 days.
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Once your S29GL128S90TFI023 order is processed, you will receive an email with the shipment details and tracking number.
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For technical support, including S29GL128S90TFI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S90TFI023 requirements.
6.How does Aetrix verify that S29GL128S90TFI023 is sourced from the original manufacturer or authorized distributors?
All S29GL128S90TFI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S90TFI023 meets industry standards.
7.What is the process for return or replacement of S29GL128S90TFI023?
All S29GL128S90TFI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S90TFI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S90TFI023 part is unused and in its original packaging.
Return procedure for S29GL128S90TFI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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