Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S29GL256N10FAI012

Part No.:
S29GL256N10FAI012
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL256N10FAI012.pdf
Description:
IC FLASH 256MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,805

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S29GL256N10FAI012 from Cypress Semiconductor is a 256 Mbit (33,554,432-byte), 16-bit wide, single-supply 3.0 V Page Flash memory manufactured on 110 nm MirrorBit process technology. It features 256 × 128 Kbyte sectors, 90 ns access time at regulated 3.0–3.6 V VCC/VIO, 1 µA standby current, and JEDEC-compliant command set for embedded boot code storage in industrial control systems.

For engineers reviewing the S29GL256N10FAI012 datasheet, S29GL256N10FAI012 pinout, S29GL256N10FAI012 application, or S29GL256N10FAI012 equivalent, key selection criteria include sector erase flexibility, Secured Silicon Sector with 128-word ESN, Enhanced VersatileI/O™ voltage adaptability (1.65–3.6 V), and hardware reset (RESET#) support for reliable system boot recovery.

Technical Context

This device implements a parallel NOR flash architecture with separate CE#, OE#, and WE# controls, enabling true random-access read and page-based program/sector-erase operations. Its command-set compatibility with JEDEC JESD21-C ensures interoperability with legacy host controllers without firmware modification.

The 110 nm MirrorBit cell structure enables hot-hole erase and hot-electron programming, delivering 100,000 erase cycles per sector and 20-year data retention. The VIO pin dynamically sets input/output voltage thresholds, allowing seamless integration into both 1.8 V and 3.0 V I/O domains while maintaining full 3.0 V core operation.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256 Mbit (16,777,216 words × 16 bits), organized as 256 × 128 Kbyte sectors - supports modular firmware partitioning and field-upgradable code regions.
Access Time 90 ns (VCC/VIO = 3.0–3.6 V, regulated) - enables direct execution of boot code from flash on microcontrollers with ≤11 MHz bus timing.
Page Read Buffer 8-word / 16-byte - reduces sequential read latency by prefetching adjacent data during burst accesses.
Write Buffer Size 16-word / 32-byte - cuts multi-word programming time by batching writes and minimizing command overhead.
Standby Current 1 µA typical - meets ultra-low-power requirements for battery-backed industrial monitoring nodes during sleep mode.
Erase Endurance 100,000 cycles per sector - supports frequent configuration updates in programmable logic controllers without wear leveling.
Data Retention 20 years typical - ensures long-term reliability for firmware stored in unattended infrastructure equipment.

Pinout & Package

Package: 56-pin TSOP (Standard Thin Small Outline Package), RoHS-compliant, lead-free, surface-mount.

Pin/Terminal Circuit Role Design Meaning
A0–A23 Address Inputs 24-bit address bus supporting full 256 Mbit addressing; A23 is valid (unlike S29GL128N).
DQ0–DQ15 Data I/O 16-bit bidirectional data bus; BYTE# pin enables 8-bit mode for legacy 8-bit microcontroller interfaces.
CE# Chip Enable Active-low chip select; enables device decoding in multi-chip memory maps with independent chip selection.
OE# Output Enable Active-low output gate; allows shared data bus operation with other peripherals without tristate conflicts.
WE# Write Enable Active-low write strobe; latches addresses and data for command execution and programming cycles.
WP#/ACC Write Protect / Accelerated Program Low = hardware sector protection (first/last sector); high = accelerated programming via elevated internal current.
RY/BY# Ready/Busy Output Open-drain active-low status signal indicating ongoing program/erase; eliminates need for polling DQ lines.
RESET# Hardware Reset Active-low asynchronous reset; terminates any operation and restores device to known state for safe boot recovery.
VIO I/O Voltage Reference Defines logic threshold for all address/control/data pins (1.65–3.6 V); decouples I/O domain from core VCC.

Key Features

Feature Design Value
Secured Silicon Sector 128-word (256-byte) factory- or customer-lockable region with 8-word electronic serial number - enables secure device identification and immutable bootloader storage.
Program/Erase Suspend Pause active program/erase in one sector to read/program another - supports real-time interrupt handling during firmware updates without data corruption.
Password Sector Protection 64-bit user-defined password required to unlock protected sectors - prevents unauthorized firmware modification in deployed field devices.
CFI Compliance Common Flash Interface compliant - allows automatic detection and configuration by BIOS/bootloader without hard-coded timing or geometry tables.
Enhanced VersatileI/O™ VIO pin configures all I/O thresholds dynamically - eliminates level-shifters when interfacing with mixed-voltage SoCs (e.g., 1.8 V CPU + 3.0 V flash).

Applications

Industrial PLC Firmware Storage Medical Device Boot Code

Use Scenario: Storing firmware and configuration data in programmable logic controllers operating in harsh factory environments with wide temperature swings and electrical noise.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing deterministic startup sequence and field-upgradable application logic.

Use Value: 100,000 erase cycles and 20-year retention ensure firmware integrity over 15+ year product lifecycles without replacement.

Use Scenario: Holding certified boot firmware and calibration parameters in Class II medical imaging equipment requiring traceable, tamper-resistant storage.

IC Role / Device Role / Timing Role: Secure, CFI-compliant flash memory used during power-on self-test and runtime parameter validation.

Use Value: Secured Silicon Sector with ESN enables device-level authentication and audit trail generation for regulatory compliance (IEC 62304).

Telecom Base Station Configuration Automotive Body Control Module

Use Scenario: Storing radio configuration profiles and fault logs in outdoor telecom base stations exposed to extended thermal cycling (-40°C to +85°C).

IC Role / Device Role / Timing Role: High-reliability parallel NOR flash supporting fast read access and sector-level reprogramming during remote software upgrades.

Use Value: 90 ns access time and 1 µA standby current reduce boot latency and extend backup battery life during grid outages.

Use Scenario: Hosting boot code and vehicle-specific calibration maps in body control modules where ECU reflash must survive automotive vibration and voltage transients.

IC Role / Device Role / Timing Role: JEDEC-compatible flash with hardware RESET# and VCC detector ensuring fail-safe restart after brownout events.

Use Value: WP#/ACC pin enables factory-programmed sector lock and accelerated production-line flashing without external HV sources.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL256S10TFI010 Successor device in same family; 65 nm MirrorBit process, 90 ns access, 56-pin TSOP, but adds dual-plane architecture and faster erase times (typ. 0.5 s/sector vs. 0.8 s). Designed for new designs requiring longer product lifecycle support and improved endurance (1M erase cycles). Select for new designs needing extended availability, higher endurance, and lower power (0.5 µA standby).
MX29GL256FHI-90G Macronix pin-compatible 256 Mbit NOR flash; 90 ns access, 56-pin TSOP, but lacks Secured Silicon Sector and Password Protection. Cost-sensitive industrial applications where security features are not mandated and CFI support is sufficient. Choose when budget constraints outweigh need for ESN, password lock, or erase suspend functionality.

Compared with S29GL256N10FAI012, the S29GL256S10TFI010 offers superior longevity and lower power but requires minor timing adjustments; the MX29GL256FHI-90G provides drop-in cost savings at the expense of security and advanced suspend capabilities.

Availability

S29GL256N10FAI012 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot code, telecom base station configuration, and automotive body control module applications requiring stable component supply despite end-of-life status.

Supply support for S29GL256N10FAI012 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer markets.

The S29GL-N family was designed for high-reliability embedded boot memory applications demanding robust sector protection, long data retention, and mixed-voltage I/O compatibility in space-constrained industrial systems.

FAQ

Is S29GL256N10FAI012 still in production?

No - Cypress officially retired the S29GL-N family and does not recommend it for new designs. However, Aetrix Electronics maintains limited legacy inventory with full traceability and supports existing production programs through lifecycle coordination and last-time-buy planning.

What package type does S29GL256N10FAI012 use?

S29GL256N10FAI012 uses a 56-pin Standard Thin Small Outline Package (TSOP), with dimensions compliant to TS056 mechanical specifications. It is RoHS-compliant, lead-free, and rated for industrial temperature range (–40°C to +85°C).

Does this device support 1.8 V I/O interfacing?

Yes - the Enhanced VersatileI/O™ (VIO) feature allows full 1.8 V I/O operation when VIO = 1.65–1.95 V, while maintaining 3.0 V core functionality. All address, control, and data pins conform to 1.8 V logic thresholds under this condition.

Can the Secured Silicon Sector be erased or rewritten after locking?

No - once the Secured Silicon Sector is locked (via command sequence), it becomes permanently read-only. The 8-word electronic serial number remains accessible, but no further programming or erasure is possible, even with power cycle or RESET# assertion.

S29GL256N10FAI012 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-N
Package/Case:
64-LBGA
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8, 16M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
100ns
Access Time:
100 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (13x11)

S29GL256N10FAI012 FAQ

1.How can I place an order for S29GL256N10FAI012 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256N10FAI012 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256N10FAI012 reliable?

The price and inventory of S29GL256N10FAI012 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256N10FAI012 is usually 5 days.

3.What payment methods are accepted for S29GL256N10FAI012?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256N10FAI012 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256N10FAI012?

S29GL256N10FAI012 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256N10FAI012 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256N10FAI012?

For technical support, including S29GL256N10FAI012 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256N10FAI012 requirements.

6.How does Aetrix verify that S29GL256N10FAI012 is sourced from the original manufacturer or authorized distributors?

All S29GL256N10FAI012 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256N10FAI012 meets industry standards.

7.What is the process for return or replacement of S29GL256N10FAI012?

All S29GL256N10FAI012 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256N10FAI012, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256N10FAI012 part is unused and in its original packaging.

Return procedure for S29GL256N10FAI012:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S29GL256N10FAI012 Tags

  • S29GL256N10FAI012
  • S29GL256N10FAI012 PDF
  • S29GL256N10FAI012 Datasheet
  • S29GL256N10FAI012 Specifications
  • S29GL256N10FAI012 Images
  • Infineon Technologies
  • Infineon Technologies S29GL256N10FAI012
  • Buy S29GL256N10FAI012
  • S29GL256N10FAI012 Price
  • S29GL256N10FAI012 Distributor
  • S29GL256N10FAI012 Supplier
  • S29GL256N10FAI012 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER