My Inquiry
My Account
Infineon Technologies S29GL256N11TFI020
- Part No.:
- S29GL256N11TFI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256N11TFI020.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,884
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL256N11TFI020 from Cypress Semiconductor is a 256 Mbit (33,554,432-byte), 3.0 V single-power-supply NOR flash memory using 110 nm MirrorBit technology, organized in 256 × 128 Kbyte sectors, with 90 ns access time, 25 ns page read time, and 1 µA standby current. It serves as nonvolatile program/data storage in embedded boot code, firmware update, and configuration memory applications.
For engineers reviewing the S29GL256N11TFI020 datasheet, S29GL256N11TFI020 pinout, S29GL256N11TFI020 application, or S29GL256N11TFI020 equivalent, key selection criteria include JEDEC-compliant command set, Secured Silicon Sector with 128-word ESN, Enhanced VersatileI/O™ (VIO = 1.65–3.6 V), and hardware reset (RESET#) support for system boot integrity.
Technical Context
This device implements a sector-erase architecture with 256 independent 128 Kbyte sectors, enabling selective erasure without disturbing adjacent data. It supports both 8-bit and 16-bit data bus operation via BYTE# control and uses hot-electron injection for programming and hot-hole assisted erase.
Command execution relies on standard microprocessor write timing with internal latching of addresses and data; status monitoring is achieved via DQ7 polling, DQ6 toggle bits, or RY/BY# output. CFI compliance enables automatic host identification of device geometry and command set.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (33,554,432 bytes), organized as 256 × 128 Kbyte sectors - defines maximum firmware image size and partitioning granularity. |
| Access Time | 90 ns at VCC = 3.0–3.6 V, VIO = 3.0–3.6 V - ensures compatibility with high-speed microcontroller bus timing budgets. |
| Page Read Time | 25 ns - reduces latency during sequential instruction fetch or table lookup operations. |
| Standby Current | 1 µA typical - enables low-power retention in battery-backed or energy-constrained systems. |
| Erase Endurance | 100,000 cycles per sector - supports field firmware updates over extended product lifetime. |
| Data Retention | 20 years typical - guarantees long-term reliability of stored boot code and calibration data. |
| VIO Range | 1.65 V to VCC - allows interoperability with 1.8 V or 3.3 V I/O domains without level shifters. |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus supporting full 256 Mbit addressing; A23 is MSB for this density. |
| DQ0–DQ15 | Data Inputs/Outputs | 16-bit bidirectional data bus; BYTE# selects 8-bit mode for legacy controller compatibility. |
| CE# | Chip Enable | Active-low chip select; must be asserted for all read/write/erase operations. |
| OE# | Output Enable | Controls output buffer; used to gate data reads without disabling chip. |
| WE# | Write Enable | Controls write latching; combined with CE# and OE# to define bus cycle type. |
| RESET# | Hardware Reset | Asynchronous active-low reset that terminates ongoing operations and restores command interface readiness. |
| RY/BY# | Ready/Busy Output | Open-drain status signal indicating active programming/erasing; simplifies interrupt-driven host polling. |
| WP#/ACC | Write Protect / Accelerated Program | Low on WP# protects first/last sector; high voltage on ACC reduces programming time during production. |
| VIO | I/O Voltage Reference | Sets input threshold and output drive levels for address/control/data pins - enables mixed-voltage system integration. |
Key Features
| Feature | Design Value |
|---|---|
| Secured Silicon Sector | 128-word (256-byte) factory- or customer-lockable region with 8-word electronic serial number - enables secure device identity binding and anti-cloning. |
| Program/Erase Suspend | Allows pausing active programming or erasing to service higher-priority reads elsewhere - improves real-time system responsiveness. |
| CFI Compliance | Standardized query structure lets host auto-detect device parameters and command set - eliminates hard-coded flash drivers. |
| Password Sector Protection | 64-bit user-defined password required to unlock protected sectors - prevents unauthorized firmware modification in deployed units. |
| Enhanced VersatileI/O™ | VIO pin configures all I/O thresholds and drive strengths to match host voltage domain - removes need for external level translators. |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
|
Use Scenario: Storing boot loader and runtime firmware in programmable logic controllers operating in harsh temperature environments (-40°C to +85°C). IC Role / Device Role / Timing Role: Nonvolatile boot code storage with deterministic 90 ns access and hardware reset recovery. Use Value: Ensures reliable cold-start execution and supports field firmware updates via sector-erase without disrupting operational memory regions. |
Use Scenario: Holding calibrated display graphics and safety-critical startup routines in automotive digital instrument clusters. IC Role / Device Role / Timing Role: Secure, high-reliability firmware repository with Secured Silicon Sector for unique vehicle ID binding. Use Value: Meets ASIL-B functional safety requirements through 20-year data retention and password-protected sector write protection. |
| Medical Diagnostic Equipment Configuration | Telecom Base Station Field Upgrade Storage |
|
Use Scenario: Retaining calibration constants, sensor profiles, and regulatory compliance settings across power cycles in portable ultrasound devices. IC Role / Device Role / Timing Role: Persistent configuration memory with 1 µA standby current and sector-level write lock. Use Value: Extends battery life while preventing accidental corruption of FDA-mandated calibration data via persistent sector protection. |
Use Scenario: Hosting upgradable protocol stacks and radio firmware images in outdoor telecom base stations requiring remote maintenance. IC Role / Device Role / Timing Role: High-endurance (100K cycles) field-upgrade storage with CFI auto-identification for multi-vendor flash management. Use Value: Enables zero-downtime firmware rollouts by allowing background erase of inactive sectors while active code continues execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S11TFI020 | Successor device using 90 nm process; 85 ns access time; supports deeper sleep mode (0.5 µA). | Designed for new designs requiring extended lifecycle support and lower active power. | Select when migrating from legacy platforms and long-term supply continuity is critical. |
| S29GL256T11TFI020 | Latest-generation replacement with 65 nm MirrorBit Eclipse; 70 ns access; integrated ECC support. | Targets high-reliability telecom and industrial applications requiring error correction. | Choose for new designs needing enhanced bit-error resilience and reduced footprint (64-ball FBGA only). |
Compared with S29GL256N11TFI020, the S29GL256S offers improved power efficiency and longer manufacturer support, while the S29GL256T adds ECC and faster timing but requires package and board redesign - making S29GL256S the preferred drop-in migration path for existing TSOP-based systems.
Availability
S29GL256N11TFI020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical diagnostic equipment configuration requiring stable component supply despite end-of-life status.
Supply support for S29GL256N11TFI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in embedded systems solutions, including microcontrollers, connectivity, and nonvolatile memory.
The S29GL-N family was designed for high-reliability, code-execution-capable NOR flash applications in automotive, industrial, and networking equipment where deterministic timing and secure firmware storage are essential.
FAQ
Is S29GL256N11TFI020 still recommended for new designs?
No. Cypress explicitly states this part is "Not Recommended for New Design" and identifies S29GL256S11TFI020 and S29GL256T11TFI020 as factory-recommended migration paths. It remains available for legacy production and repair, but lacks long-term roadmap support.
What is the function of the WP#/ACC pin?
WP#/ACC is a dual-function pin: when pulled low, it enables hardware write protection for the first or last sector; when driven to 5.5 V (via external circuitry), it activates accelerated programming mode, reducing write time during high-volume manufacturing.
Does S29GL256N11TFI020 support 8-bit data bus operation?
Yes. The BYTE# input controls bus width: when asserted low, the device operates in 8-bit mode using DQ0–DQ7 only, with A0–A22 providing addressing. This maintains compatibility with 8-bit microcontrollers and legacy system designs.
How is the Secured Silicon Sector accessed and locked?
Access requires a specific 6-cycle command sequence to enter the Secured Silicon Sector; once programmed, a lock bit permanently disables further writes to the 128-word region. The 8-word Electronic Serial Number is readable post-lock and cannot be altered.
S29GL256N11TFI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-N
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8, 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 110ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256N11TFI020 FAQ
1.How can I place an order for S29GL256N11TFI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256N11TFI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256N11TFI020 reliable?
The price and inventory of S29GL256N11TFI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256N11TFI020 is usually 5 days.
3.What payment methods are accepted for S29GL256N11TFI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256N11TFI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256N11TFI020?
S29GL256N11TFI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256N11TFI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256N11TFI020?
For technical support, including S29GL256N11TFI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256N11TFI020 requirements.
6.How does Aetrix verify that S29GL256N11TFI020 is sourced from the original manufacturer or authorized distributors?
All S29GL256N11TFI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256N11TFI020 meets industry standards.
7.What is the process for return or replacement of S29GL256N11TFI020?
All S29GL256N11TFI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256N11TFI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256N11TFI020 part is unused and in its original packaging.
Return procedure for S29GL256N11TFI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256N11TFI020 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
