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Infineon Technologies S29GL256P10FAI022

Part No.:
S29GL256P10FAI022
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL256P10FAI022.pdf
Description:
IC FLASH 256MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,516

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Product details

Overview

S29GL256P10FAI022 from Cypress Semiconductor is a 256 Mbit (32 MB), 3.0 V-only page-mode NOR Flash memory fabricated on 90 nm MirrorBit process technology, featuring 256 uniform 64 Kword (128 Kbyte) sectors, 25 ns page access time, and 90 ns random access time under regulated VCC. It supports VersatileI/O™ with VIO range 1.65–VCC, 32-word write buffer for accelerated multi-word programming, and Secured Silicon Sector with factory- or customer-programmable 8-word electronic serial number - deployed in industrial embedded controllers requiring nonvolatile firmware storage with sector-level protection.

For engineers reviewing the S29GL256P10FAI022 datasheet, S29GL256P10FAI022 pinout, S29GL256P10FAI022 application, or S29GL256P10FAI022 equivalent, key selection criteria include sector architecture uniformity, VIO-configurable I/O voltage compatibility, WP#/ACC dual-function pin behavior, and CFI-compliant command interface for bootloader integration and field firmware updates.

Technical Context

This device implements a synchronous/asynchronous hybrid command-set architecture with dedicated state control logic, erase/program voltage generators, and internal timers enabling suspend/resume of erase and program operations. Its block diagram integrates X/Y decoders, sector switches, and data gating controlled by CE#, OE#, WE#, and BYTE# to support both word (DQ0–DQ15) and byte (DQ0–DQ7 + A−1) configurations.

The VersatileI/O™ architecture decouples I/O signaling levels from core VCC via the VIO supply, allowing interface compatibility with 1.8 V, 2.5 V, or 3.3 V host systems while maintaining 2.7–3.6 V VCC operation. Sector erase endurance is rated at 100,000 cycles with 20-year data retention, and hardware reset (RESET#) ensures deterministic initialization independent of power sequencing.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256 Mbit (32 MB) organized as 256 × 64 Kword sectors
Page Access Time25 ns - enables high-speed instruction fetch from sequential code pages
Random Access Time90 ns (Regulated VCC) - determines worst-case latency for random address reads
Write Buffer Size32 words (64 bytes) - reduces effective programming time for burst firmware updates
Endurance & Retention100,000 erase cycles per sector / 20-year data retention - meets industrial lifecycle requirements
VIO Range1.65 V to VCC - allows flexible I/O voltage scaling without level shifters
Supply Voltage2.7–3.6 V single VCC - simplifies power design vs. dual-rail Flash

Pinout & Package

Package: 64-ball Fortified BGA (LAA064), 11 × 13 mm, 1.0 mm pitch, Pb-free (F), industrial temperature (−40°C to +85°C).

Pin/TerminalCircuit RoleDesign Meaning
A23–A0Address Inputs24-bit address bus supporting full 256 Mbit addressing (A23 = MSB)
DQ15–DQ0Data I/O (Word Mode)16-bit bidirectional data path; DQ15/A−1 serves as LSB address in byte mode
CE#, OE#, WE#Chip/Output/Write EnableStandard asynchronous control signals; CE# gating reduces standby current
BYTE#Bus Width SelectVIL = byte mode (DQ0–DQ7 active); VIH = word mode (DQ0–DQ15 active)
WP#/ACCWrite Protect / AccelerationVIL = protects top/bottom sector; VHH = enables unlock bypass for faster production programming
RY/BY#Ready/Busy OutputActive-low open-drain signal indicating ongoing erase/program operation
RESET#Hardware ResetAsynchronous active-low reset that forces device into read array mode
VIOVersatile I/O SupplyIndependent voltage reference for all input thresholds and output drive levels

Key Features

FeatureDesign Value
Uniform Sector Architecture256 identical 64 Kword sectors simplify firmware partitioning and OTA update management
Secured Silicon Sector128-word (256-byte) factory- or user-lockable region for immutable device ID and security keys
Suspend/Resume CapabilityAllows interrupting erase/program operations to service high-priority read requests in real-time systems
CFI ComplianceEnables automatic detection of geometry, timing, and command set by host boot ROM or flash translation layer
Advanced Sector ProtectionPersistent lock bits and password-based methods prevent unauthorized firmware modification in deployed units

Applications

Industrial PLC Firmware StorageAutomotive Instrument Cluster Boot Memory

Use Scenario: Storing and executing boot code and configuration parameters in programmable logic controllers operating continuously in harsh environments.

IC Role / Device Role / Timing Role: Nonvolatile code storage with deterministic read latency and sector-level write protection during runtime.

Use Value: 20-year data retention and 100,000 erase cycles ensure firmware integrity over 15+ year product lifecycles without refresh.

Use Scenario: Holding calibrated display assets, gauge logic, and safety-critical boot firmware in automotive digital instrument clusters.

IC Role / Device Role / Timing Role: Primary boot memory accessed at power-on reset; supports fast page reads for UI rendering startup.

Use Value: 25 ns page access time accelerates GUI asset loading, reducing boot-to-display time by ~18% vs. 90 ns-only devices.

Medical Diagnostic Equipment BIOSNetwork Router Bootloader Storage

Use Scenario: Hosting BIOS and calibration tables in FDA-regulated imaging systems requiring traceable, tamper-resistant firmware.

IC Role / Device Role / Timing Role: Secure, locked boot memory with Secured Silicon Sector storing cryptographic keys and serial numbers.

Use Value: Factory-programmable 8-word electronic serial number enables unique device identification and regulatory audit trails.

Use Scenario: Storing U-Boot or OpenWrt bootloader images in enterprise-grade routers requiring field-upgradable firmware.

IC Role / Device Role / Timing Role: CFI-compliant flash enabling automatic bootloader detection and recovery partitioning.

Use Value: Write buffer programming cuts firmware update time by 65% compared to single-word writes, minimizing network downtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar page-mode NOR Flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MX29GL256FPTI-90G90 nm process, 256 Mbit, 90 ns access, no VIO support - fixed 3.0 V I/OLacks VersatileI/O™; requires external level shifting for mixed-voltage systemsSelect when cost sensitivity outweighs I/O flexibility and VIO is unnecessary
S29GL256S10TFI020Same die, TSOP-56 package (vs. BGA), 100 ns random access, identical feature setLower assembly cost but larger footprint; less suitable for space-constrained PCBsSelect for legacy board designs using TSOP or where BGA rework capability is limited

Compared with MX29GL256FPTI-90G and S29GL256S10TFI020, the S29GL256P10FAI022 offers superior system integration via VIO scalability and smaller BGA footprint, making it optimal for next-gen industrial and automotive modules where board area and voltage interoperability are critical.

Availability

S29GL256P10FAI022 is available at Aetrix Electronics and suitable for industrial PLCs, automotive instrument clusters, medical diagnostic equipment, and network infrastructure requiring stable component supply across extended product lifecycles.

Supply support for S29GL256P10FAI022 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor, now part of Infineon Technologies, designs high-reliability nonvolatile memory and microcontroller solutions for industrial, automotive, and communications markets.

The S29GL-P family targets embedded systems needing robust, high-density NOR Flash with advanced protection, fast page access, and flexible I/O voltage operation - optimized for firmware storage in mission-critical edge devices.

FAQ

What is the function of the WP#/ACC pin in S29GL256P10FAI022?

The WP#/ACC pin serves dual roles: at VIL, it protects the highest or lowest sector from accidental program/erase; at VHH (12 V), it enables Unlock Bypass mode, accelerating programming throughput during manufacturing. Internal pull-up ensures safe default (VIH) when unconnected, preventing unintended protection activation.

Does S29GL256P10FAI022 support byte-wide data access?

Yes - asserting BYTE# = VIL configures the device for byte mode, activating only DQ0–DQ7 and repurposing DQ15/A−1 as the LSB address input (A−1). This enables 8-bit microcontroller interfacing without external data bus multiplexing, preserving pin count and simplifying layout.

How does the Secured Silicon Sector differ from standard flash sectors?

The Secured Silicon Sector is a dedicated 128-word (256-byte) region with permanent lock capability: once locked (via factory or customer command), its contents - including an 8-word electronic serial number - become read-only and immune to erase commands. Unlike standard sectors, it cannot be unlocked after locking, ensuring irreversible identity binding.

Can S29GL256P10FAI022 operate with VIO = 1.8 V while VCC = 3.3 V?

Yes - the VersatileI/O™ specification explicitly permits VIO = 1.65–VCC, so 1.8 V VIO with 3.3 V VCC is fully supported. Input thresholds and output drive levels scale with VIO, enabling direct connection to 1.8 V FPGAs or ASICs without level translators, while maintaining full 3.3 V core functionality and timing performance.

S29GL256P10FAI022 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-P
Package/Case:
64-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
100ns
Access Time:
100 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (13x11)

S29GL256P10FAI022 FAQ

1.How can I place an order for S29GL256P10FAI022 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256P10FAI022 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256P10FAI022 reliable?

The price and inventory of S29GL256P10FAI022 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P10FAI022 is usually 5 days.

3.What payment methods are accepted for S29GL256P10FAI022?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256P10FAI022 transactions.

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4.How is shipping managed for S29GL256P10FAI022?

S29GL256P10FAI022 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256P10FAI022 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256P10FAI022?

For technical support, including S29GL256P10FAI022 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P10FAI022 requirements.

6.How does Aetrix verify that S29GL256P10FAI022 is sourced from the original manufacturer or authorized distributors?

All S29GL256P10FAI022 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P10FAI022 meets industry standards.

7.What is the process for return or replacement of S29GL256P10FAI022?

All S29GL256P10FAI022 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P10FAI022, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256P10FAI022 part is unused and in its original packaging.

Return procedure for S29GL256P10FAI022:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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