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Infineon Technologies S29GL256P11FAI012

Part No.:
S29GL256P11FAI012
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL256P11FAI012.pdf
Description:
IC FLASH 256MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,141

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Product details

Overview

S29GL256P11FAI012 from Cypress Semiconductor is a 256 Mbit (32 MB), 3.0 V-only page-mode NOR Flash memory fabricated on 90 nm MirrorBit process technology. It features uniform 64 Kword (128 KB) sectors (256 total), 25 ns page access time, 110 ns random access time under regulated VCC, and supports both word and byte configurations via BYTE# input. Used in industrial embedded systems for firmware storage and boot code execution.

For engineers reviewing the S29GL256P11FAI012 datasheet, S29GL256P11FAI012 pinout, S29GL256P11FAI012 application, or S29GL256P11FAI012 equivalent, key selection criteria include sector architecture compatibility, VersatileI/O™ voltage flexibility (VIO = 1.65–VCC), write buffer efficiency (32-word/64-byte), secured silicon sector programmability, and industrial temperature operation (–40°C to +85°C).

Technical Context

This device implements a synchronous/asynchronous hybrid interface with dedicated CE#, OE#, and WE# controls, enabling standard NOR Flash command-set operation including autoselect, program, erase, suspend/resume, and CFI-compliant identification. Its block diagram integrates X/Y decoders, erase/PGM voltage generators, state control logic, and a command register that interprets six-cycle unlock sequences.

The VersatileI/O™ architecture decouples I/O voltage (VIO) from core supply (VCC), allowing DQ and control signal levels to track VIO across 1.65–VCC while maintaining full functionality over VCC = 2.7–3.6 V. Sector protection employs both persistent lock bits and password-based methods, with WP#/ACC serving dual roles: hardware write protection and VHH-accelerated programming.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256 Mbit (32 MB), organized as 256 × 64 Kword uniform sectors
Access Time 110 ns random access (tACC) at regulated VCC = 3.0–3.6 V; 25 ns page access (tPACC)
Write Buffer Size 32 words (64 bytes) per buffer load, reducing effective programming time by >4× vs single-word writes
Endurance & Retention 100,000 erase cycles per sector; 20-year data retention at +85°C
Voltage Ranges VCC = 2.7–3.6 V; VIO = 1.65–VCC; supports mixed-voltage system interfacing
Operating Temp Industrial grade: –40°C to +85°C, validated for extended thermal cycling in embedded controllers
Protection Methods Persistent lock bits + password protection + hardware WP#/ACC sector lock; Secured Silicon Sector (128-word ESN)

Pinout & Package

Package: 64-ball Fortified BGA (LAA064), 11 mm × 13 mm, 1.0 mm pitch, Pb-free (F), industrial temperature (I).

Pin/Terminal Circuit Role Design Meaning
A23–A0 Address Inputs 24-bit address bus (A23–A0); A23 selects highest sector; supports full 32 MB addressing
DQ15–DQ0 Data I/O 16-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode when BYTE# = VIL
BYTE# Bus Width Control Configures interface as 16-bit word (VIH) or 8-bit byte (VIL); enables legacy 8-bit microcontroller compatibility
WP#/ACC Write Protect / Acceleration VIL: locks top/bottom sector; VHH: enables unlock bypass mode and reduces programming time by ~25%
VIO Versatile I/O Supply Sets logic threshold for all inputs/outputs independently of VCC; enables 1.8 V I/O interfacing with 3.3 V core
RY/BY# Ready/Busy Output Active-low open-drain status indicator; asserts low during program/erase; high-Z when operation complete

Key Features

Feature Design Value
90 nm MirrorBit Process Enables higher density and lower power vs prior generations; reduces leakage current in standby mode (1 µA typical)
32-Word Write Buffer Allows burst programming of up to 64 bytes without host intervention, cutting firmware update time in embedded boot loaders
Secured Silicon Sector Factory- or customer-programmable 128-word region with locked 16-byte electronic serial number for device authentication
Suspend/Resume Commands Pauses active erase or program operations to service high-priority read requests-critical for real-time OS environments
CFI Compliance Supports Common Flash Interface v1.3 for automatic parameter detection and vendor-agnostic driver integration

Applications

Industrial PLC Firmware Storage Automotive Infotainment Boot Memory

Use Scenario: Nonvolatile storage of firmware images and configuration parameters in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Primary boot memory mapped to processor's address space; executes XIP (execute-in-place) during cold start.

Use Value: 20-year data retention and 100K erase cycles ensure field reliability over 10+ years without replacement; industrial temp rating eliminates derating concerns.

Use Scenario: Storing bootloader, OS kernel, and UI assets in head-unit systems requiring fast startup and secure firmware validation.

IC Role / Device Role / Timing Role: NOR Flash configured in x16 mode with 25 ns page access to meet <100 ms boot latency targets.

Use Value: Secured Silicon Sector enables cryptographic binding of ESN to signed firmware; prevents unauthorized image flashing.

Medical Diagnostic Equipment BIOS Network Router Configuration Storage

Use Scenario: Holding certified BIOS and calibration tables in FDA-regulated imaging devices where data integrity is auditable and immutable.

IC Role / Device Role / Timing Role: Read-mostly memory with infrequent field updates; protected via persistent lock bits and password protection.

Use Value: Dual protection scheme (hardware WP# + software password) satisfies IEC 62304 traceability requirements for medical SW updates.

Use Scenario: Persistent storage of routing tables, VLAN configs, and failover scripts in carrier-grade edge routers with hot-swap capability.

IC Role / Device Role / Timing Role: Config memory accessed via memory-mapped I/O; uses suspend/resume to avoid packet loss during config writes.

Use Value: 1 µA standby current minimizes power draw in always-on network infrastructure; VIO flexibility simplifies interface to 1.8 V management SoCs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL256S11TFI010 Same density and 90 nm process, but TSOP-56 package (T), no VIO support (fixed 3.0 V I/O), slower 120 ns tACC Lacks VersatileI/O™; unsuitable for mixed-voltage designs; limited board space savings vs BGA Select only if legacy PCB layout requires TSOP footprint and VIO flexibility is unnecessary
MX29GL256FHI-90G Micron 256 Mbit NOR Flash; 100,000 cycles; 90 ns tACC; supports CFI but no secured silicon sector or suspend/resume No hardware-accelerated programming or ESN capability; lacks advanced sector protection granularity Choose for cost-sensitive applications where security and real-time interruptibility are not required

Compared with S29GL256S11TFI010 and MX29GL256FHI-90G, the S29GL256P11FAI012 uniquely delivers VIO-driven voltage scalability, suspend/resume for deterministic latency, and cryptographically verifiable identity via secured silicon-making it optimal for safety-critical and mixed-voltage embedded platforms.

Availability

S29GL256P11FAI012 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot memory, and medical diagnostic equipment BIOS requiring stable component supply across long product lifecycles.

Supply support for S29GL256P11FAI012 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability nonvolatile memory and microcontrollers for industrial, automotive, and communications markets, with emphasis on long-lifecycle support and qualification rigor.

The S29GL-P series was engineered specifically for embedded systems demanding deterministic NOR Flash performance, robust data retention, and flexible I/O voltage operation-addressing limitations of earlier 130 nm and 110 nm Flash generations in mission-critical applications.

FAQ

What is the function of the VIO pin on the S29GL256P11FAI012?

VIO sets the input/output voltage reference for all address, control, and data signals independent of VCC. With VIO ranging from 1.65 V to VCC (2.7–3.6 V), it enables direct interfacing to 1.8 V or 2.5 V processors without level shifters-reducing BOM count and signal integrity risk in mixed-voltage designs.

Does the S29GL256P11FAI012 support execute-in-place (XIP) operation?

Yes. The device supports true XIP operation due to its fast random access time (110 ns) and asynchronous command set. When mapped into processor memory space, instruction fetches occur directly from Flash without copying to RAM-reducing boot latency and SRAM usage in resource-constrained microcontrollers.

How does the Secured Silicon Sector differ from standard flash sectors?

The Secured Silicon Sector is a dedicated 128-word (256-byte) region physically isolated from main array. It contains factory- or user-programmable data-including a unique 16-byte Electronic Serial Number-and can be permanently locked. Unlike standard sectors, it cannot be erased after locking, providing tamper-resistant identity storage for firmware authentication.

Can the S29GL256P11FAI012 be used in place of older S29GL256N devices?

No. While pin-compatible in BGA package, the S29GL256P introduces VersatileI/O™, enhanced write buffer behavior, and updated CFI parameter tables. Migration requires validation of VIO timing, command sequence timing margins, and software driver updates-especially for suspend/resume and secured silicon access routines.

S29GL256P11FAI012 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-P
Package/Case:
64-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
110ns
Access Time:
110 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (13x11)

S29GL256P11FAI012 FAQ

1.How can I place an order for S29GL256P11FAI012 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256P11FAI012 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256P11FAI012 reliable?

The price and inventory of S29GL256P11FAI012 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P11FAI012 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256P11FAI012 transactions.

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S29GL256P11FAI012 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256P11FAI012 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256P11FAI012?

For technical support, including S29GL256P11FAI012 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P11FAI012 requirements.

6.How does Aetrix verify that S29GL256P11FAI012 is sourced from the original manufacturer or authorized distributors?

All S29GL256P11FAI012 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P11FAI012 meets industry standards.

7.What is the process for return or replacement of S29GL256P11FAI012?

All S29GL256P11FAI012 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P11FAI012, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256P11FAI012 part is unused and in its original packaging.

Return procedure for S29GL256P11FAI012:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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