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Infineon Technologies S29GL256P11FAI022

Part No.:
S29GL256P11FAI022
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL256P11FAI022.pdf
Description:
IC FLASH 256MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,671

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Product details

Overview

S29GL256P11FAI022 from Cypress Semiconductor is a 256 Mbit (32 MB), 3.0 V-only page-mode NOR Flash memory fabricated on 90 nm MirrorBit process technology, featuring 256 uniform 64 Kword (128 Kbyte) sectors, 25 ns page access time, and 110 ns random access time under regulated VCC (3.0–3.6 V). It supports VersatileI/O™ with VIO range 1.65–VCC, 32-word write buffer, and secured silicon sector with factory- or customer-programmable 8-word electronic serial number - deployed in industrial embedded controllers requiring nonvolatile code storage and field firmware updates.

For engineers reviewing the S29GL256P11FAI022 datasheet, S29GL256P11FAI022 pinout, S29GL256P11FAI022 application, or S29GL256P11FAI022 equivalent, key selection criteria include sector erase endurance (100,000 cycles), data retention (20 years), CFI compliance, hardware reset (RESET#), and WP#/ACC dual-function pin for sector protection and VHH-accelerated programming during production.

Technical Context

This device implements a synchronous/asynchronous hybrid interface with byte/word configuration controlled by BYTE# input, and uses internal state machines to execute embedded program/erase algorithms. Its VersatileI/O architecture decouples I/O voltage (VIO) from core supply (VCC), enabling interoperability with 1.8 V, 2.5 V, or 3.3 V logic systems while maintaining full 3.0 V core operation.

The 64-ball Fortified BGA (LAA064) package integrates dedicated RY/BY# status output, hardware RESET#, and WP#/ACC pin supporting both sector lock and high-voltage acceleration - critical for deterministic boot-time initialization and high-throughput manufacturing programming.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256 Mbit (32 MB) organized as 256 × 64 Kword sectors - enables full firmware image storage for mid-tier microcontrollers without external memory expansion.
Access Time 25 ns page access / 110 ns random access at VCC = 3.0–3.6 V - meets real-time interrupt response requirements in industrial PLCs and motor drives.
Write Buffer 32-word (64-byte) buffer - reduces effective multi-word programming time by >70% vs. single-word writes, accelerating field firmware patching.
Erase Endurance 100,000 cycles per sector - supports >10 years of daily over-the-air update cycles in connected edge devices.
Data Retention 20 years at +85°C - ensures long-term reliability in uncooled industrial enclosures and automotive under-hood applications.
VersatileI/O Range VIO = 1.65 V to VCC - allows direct interfacing with 1.8 V FPGAs or 2.5 V ASICs without level shifters.
Supply Voltage Single 3.0 V supply (2.7–3.6 V) - simplifies power design versus dual-rail Flash and eliminates VPP pump circuitry.

Pinout & Package

Package: 64-ball Fortified BGA (LAA064), 11 mm × 13 mm, 1.0 mm pitch, RoHS-compliant Pb-free (F suffix).

Pin/Terminal Circuit Role Design Meaning
A23–A0 Address Inputs 24-bit address bus supporting full 32 MB addressing; A23 is MSB for this density.
DQ15–DQ0 Data I/O (Word Mode) 16-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode when BYTE# = VIL.
CE#, OE#, WE# Chip/Output/Write Enable Standard asynchronous control signals; CE# gating reduces standby current to 1 µA.
RY/BY# Ready/Busy Output Active-low open-drain status signal - asserts low during program/erase; enables polling or interrupt-driven firmware flow control.
RESET# Hardware Reset Input Asynchronous active-low reset - forces device into read array mode, clearing pending operations and restoring default state.
WP#/ACC Write Protect / Acceleration At VIL: locks top/bottom sector; at VHH (12 V): enables unlock-bypass mode for accelerated programming in production test.
VIO Versatile I/O Supply Independent I/O voltage reference - sets logic thresholds for all address, control, and data pins, enabling mixed-voltage system integration.

Key Features

Feature Design Value
Secured Silicon Sector 128-word (256-byte) factory- or customer-lockable region containing programmable 8-word electronic serial number - provides immutable device identity for secure boot and license enforcement.
Advanced Sector Protection Persistent lock bits + password method - prevents unauthorized firmware overwrite while allowing selective sector unlocking via authenticated command sequences.
Suspend/Resume Commands Halts ongoing erase or program operations to service high-priority reads - essential for real-time OS environments where flash latency must be bounded.
CFI Compliance Common Flash Interface v1.3 support - enables automatic detection and configuration by standard BIOS/bootloader drivers without vendor-specific code.
Automatic Sleep Mode Enters ultra-low-power state (<1 µA) after 200 ms of bus inactivity - extends battery life in portable diagnostic tools and wireless sensors.

Applications

Industrial PLC Firmware Storage Automotive ADAS Boot Memory

Use Scenario: Stores ladder logic programs and configuration data in programmable logic controllers operating continuously in factory environments (-40°C to +85°C).

IC Role / Device Role / Timing Role: Nonvolatile code execution memory with deterministic 110 ns read access and hardware reset recovery for fail-safe restart.

Use Value: 20-year data retention and 100,000 erase cycles ensure >15-year field deployment without firmware corruption or refresh.

Use Scenario: Holds boot code and safety-critical sensor calibration tables for radar/EPS ECUs subject to AEC-Q100 Grade 2 stress testing.

IC Role / Device Role / Timing Role: Secure boot ROM with Secured Silicon Sector storing cryptographic keys and anti-tamper serial ID.

Use Value: Factory-programmed electronic serial number enables unique device authentication during UDS diagnostic sessions.

Medical Imaging System Code Storage Telecom Base Station FPGA Configuration

Use Scenario: Stores FPGA bitstreams and application firmware for portable ultrasound units requiring FDA-certified data integrity.

IC Role / Device Role / Timing Role: High-reliability page-mode Flash with CFI support for standardized bootloader compatibility across product generations.

Use Value: Uniform 128 Kbyte sector architecture simplifies firmware partitioning and enables atomic OTA updates without partial-sector corruption.

Use Scenario: Configures Xilinx Zynq SoC FPGA fabric and loads Linux kernel in 5G remote radio units with strict thermal constraints.

IC Role / Device Role / Timing Role: Fast 25 ns page read mode accelerates FPGA configuration time, reducing system boot latency below 500 ms.

Use Value: VersatileI/O allows direct connection to 1.8 V FPGA configuration I/O banks, eliminating level-shifter components and PCB area.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX29GL256FHI-90G 90 nm process, 256 Mbit, but uses standard TSOP-56; lacks VersatileI/O and secured silicon sector. No VIO flexibility or hardware-secured identity - unsuitable for mixed-voltage or security-critical designs. Select only if cost-sensitive industrial designs require TSOP footprint and omit advanced protection features.
S29GL256S11TFI020 Same Cypress family, but 56-pin TSOP package (T suffix); identical electrical specs except CE# access time (90 ns vs. 110 ns). TSOP limits board density and thermal performance vs. BGA - not recommended for compact, high-temperature telecom modules. Choose for legacy PCBs with TSOP footprints or prototyping where BGA rework is impractical.

Compared with MX29GL256FHI-90G and S29GL256S11TFI020, the S29GL256P11FAI022 uniquely delivers VIO-configurable I/O, factory-lockable secured silicon, and BGA packaging - making it the only option among the three qualified for secure, space-constrained, and thermally demanding industrial deployments.

Availability

S29GL256P11FAI022 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system code storage requiring stable component supply across extended product lifecycles.

Supply support for S29GL256P11FAI022 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-reliability memory, PSoC, and USB solutions for industrial, automotive, and consumer markets.

The S29GL-P series was designed specifically for embedded systems requiring robust, high-density NOR Flash with enhanced security, mixed-voltage interoperability, and production-ready programming acceleration - targeting mission-critical firmware storage.

FAQ

What is the function of the WP#/ACC pin on S29GL256P11FAI022?

The WP#/ACC pin serves two distinct roles: at VIL (≤0.8 V), it protects the highest or lowest address sector from accidental program/erase; at VHH (11.5–12.5 V), it enables Unlock Bypass Program mode, accelerating single-word programming time to 13.5 µs and bypassing standard command sequences during high-volume manufacturing test.

Does S29GL256P11FAI022 support byte-level writes?

No - it does not support true byte-level programming. In byte mode (BYTE# = VIL), only DQ0–DQ7 are active and DQ15/A-1 becomes A-1 address input, but programming still occurs in minimum 16-byte (8-word) chunks via the write buffer or 1-word increments using standard algorithm; no sub-word granularity is available.

How is the Secured Silicon Sector programmed and locked?

The 128-word Secured Silicon Sector is programmed using standard CFI command sequences (e.g., Word Program command at address 0x00000000), then permanently locked via the Sector Protect command with specific unlock-bypass codes. Once locked, the sector becomes read-only and immune to erase commands - verified by reading status register bit PS[0] = 1.

Can S29GL256P11FAI022 operate with VIO = 1.8 V while VCC = 3.3 V?

Yes - the VersatileI/O specification explicitly permits VIO = 1.65–VCC, so VIO = 1.8 V and VCC = 3.3 V is a valid configuration. All input thresholds and output drive levels scale to VIO, enabling direct interface with 1.8 V FPGAs or microcontrollers without external level translation.

S29GL256P11FAI022 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-P
Package/Case:
64-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
110ns
Access Time:
110 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (13x11)

S29GL256P11FAI022 FAQ

1.How can I place an order for S29GL256P11FAI022 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256P11FAI022 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256P11FAI022 reliable?

The price and inventory of S29GL256P11FAI022 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P11FAI022 is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256P11FAI022?

For technical support, including S29GL256P11FAI022 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P11FAI022 requirements.

6.How does Aetrix verify that S29GL256P11FAI022 is sourced from the original manufacturer or authorized distributors?

All S29GL256P11FAI022 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P11FAI022 meets industry standards.

7.What is the process for return or replacement of S29GL256P11FAI022?

All S29GL256P11FAI022 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P11FAI022, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256P11FAI022 part is unused and in its original packaging.

Return procedure for S29GL256P11FAI022:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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