Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S29GL256P11FAIV22

Part No.:
S29GL256P11FAIV22
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL256P11FAIV22.pdf
Description:
IC FLASH 256MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,158

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S29GL256P11FAIV22 from Cypress Semiconductor is a 256 Mbit (32 MB), 3.0 V-only page-mode NOR Flash memory fabricated on 90 nm MirrorBit process technology, featuring 256 uniform 128 Kbyte sectors, 25 ns page access time, and 110 ns random access time under regulated VCC (3.0–3.6 V). It integrates a 32-word/64-byte write buffer, VersatileI/O™ control (VIO = 1.65–VCC), and secured silicon sector with factory-programmable 16-byte electronic serial number - deployed in industrial embedded systems for firmware storage and boot code execution.

For engineers reviewing the S29GL256P11FAIV22 datasheet, S29GL256P11FAIV22 pinout, S29GL256P11FAIV22 application, or S29GL256P11FAIV22 equivalent, key selection criteria include sector erase endurance (100,000 cycles), data retention (20 years), CFI compliance, hardware reset (RESET#), and WP#/ACC dual-function pin behavior for production acceleration and sector protection.

Technical Context

This device implements a synchronous/asynchronous hybrid interface with dedicated CE#, OE#, and WE# controls, supporting byte/word configuration via BYTE# input and VersatileI/O voltage scaling to decouple I/O logic levels from core VCC. Its internal state machine handles embedded program/erase algorithms, with RY/BY# output signaling operation completion and suspend/resume capability for real-time interrupt handling.

The 90 nm MirrorBit architecture enables single-transistor storage per bit with charge-trap technology, delivering higher density and lower power versus floating-gate NOR. Sector protection uses persistent lock bits and password-based Advanced Sector Protection, while the secured silicon sector provides tamper-resistant identity storage independent of main array operations.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256 Mbit (32 MB) organized as 256 × 128 Kbyte uniform sectors - enables modular firmware partitioning and field-upgradable image storage.
Access Time 25 ns page access / 110 ns random access at VCC = 3.0–3.6 V - supports high-speed boot code fetch in microcontroller-based systems.
Write Buffer 32-word (64-byte) buffer - reduces effective programming time by >70% vs. single-word writes during firmware patching.
Erase Endurance 100,000 cycles per sector - ensures long-term reliability in applications requiring frequent configuration updates.
Data Retention 20 years at +85°C - meets industrial temperature lifecycle requirements without refresh or backup power.
VersatileI/O Range VIO = 1.65–VCC - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V host logic without level shifters.
Supply Voltage Single 2.7–3.6 V supply for read/program/erase - simplifies power design and eliminates auxiliary high-voltage generators.

Pinout & Package

Package: 64-ball Fortified BGA (LAA064), 11 × 13 mm, 1.0 mm pitch, Pb-free (F), industrial temperature (–40°C to +85°C).

Pin/Terminal Circuit Role Design Meaning
A23–A0 Address Inputs 24-bit address bus (A23–A0) selects 16 Mbyte address space; A23 maps to highest sector boundary.
DQ15–DQ0 Data I/O (Word Mode) 16-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode when BYTE# = VIL.
CE#, OE#, WE# Chip/Output/Write Enable Standard asynchronous control trio; enables low-latency read/write with independent gating.
WP#/ACC Write Protect / Acceleration Pull-up default; VIL protects outermost sector; VHH enables unlock-bypass programming for production throughput.
RESET# Hardware Reset Active-low signal forces device into reading state and aborts ongoing program/erase operations.
RY/BY# Ready/Busy Output Open-drain active-low indicator - drives low during embedded algorithm execution, high-Z when idle.
VIO Versatile I/O Supply Defines logic threshold for all address, control, and data pins; decouples interface voltage from VCC.

Key Features

Feature Design Value
Secured Silicon Sector 128-word (256-byte) factory- or customer-lockable region storing immutable 16-byte electronic serial number - enables secure device authentication and anti-cloning.
Advanced Sector Protection Persistent lock bits + password method - prevents unauthorized firmware overwrite while allowing selective sector unprotection via authenticated command sequence.
Suspend/Resume Interruptible program/erase operations - permits high-priority read access during background flash updates without data corruption.
CFI Compliance Common Flash Interface v1.3 support - enables OS-agnostic driver compatibility and automated parameter detection in bootloader environments.
Automatic Sleep Mode Enters ultra-low-power standby (<1 µA) after 100 µs of bus inactivity - reduces system-level quiescent current in battery-backed applications.

Applications

Industrial PLC Firmware Storage Automotive Infotainment Boot Memory

Use Scenario: Storing and executing boot loader and real-time OS kernel in programmable logic controllers operating continuously in harsh factory environments.

IC Role / Device Role / Timing Role: Primary nonvolatile code storage with deterministic 110 ns random access for fast cold-start execution and 25 ns page reads during firmware update verification.

Use Value: 20-year data retention and 100,000 erase cycles ensure firmware integrity over 15+ year equipment lifecycles without maintenance.

Use Scenario: Holding boot code and safety-critical initialization routines in head unit ECUs where ASIL-B compliance requires verified memory reliability.

IC Role / Device Role / Timing Role: Secure boot source with Secured Silicon Sector providing cryptographically verifiable device identity and tamper-evident serial number binding.

Use Value: WP#/ACC pin behavior enables accelerated programming during manufacturing test while preserving sector protection in field units.

Medical Imaging System Configuration Telecom Base Station FPGA Bitstream

Use Scenario: Storing calibrated sensor profiles and regulatory-compliant operational parameters in portable ultrasound devices requiring FDA audit trails.

IC Role / Device Role / Timing Role: Parameter storage with Advanced Sector Protection preventing accidental overwrite of calibration data during software upgrades.

Use Value: Password-based unprotection allows authorized service technicians to update calibration tables without full array erasure.

Use Scenario: Hosting reconfigurable FPGA configuration bitstreams in 5G remote radio units exposed to wide temperature swings and EMI.

IC Role / Device Role / Timing Role: High-reliability configuration memory with suspend/resume capability enabling hot-swap bitstream reload without disrupting RF transmission.

Use Value: 90 nm MirrorBit process delivers stable timing across –40°C to +85°C, eliminating setup/hold violations during thermal transients.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX29GL256FHI-90G 90 nm process, same 256 Mbit density and 25 ns page access, but lacks VersatileI/O and secured silicon sector. No VIO scaling or electronic serial number - unsuitable for mixed-voltage systems or secure identity use cases. Select when cost sensitivity outweighs I/O flexibility and security requirements.
S29GL256S11TFI010 Same Cypress family, 64-pin TSOP package (not BGA), identical electrical specs except 100 ns random access at full VCC range. Requires PCB redesign for TSOP footprint; no BGA thermal/mechanical advantages for high-vibration telecom modules. Choose only if legacy board layout mandates TSOP or manual assembly constraints prohibit BGA reflow.

Compared with MX29GL256FHI-90G and S29GL256S11TFI010, the S29GL256P11FAIV22 uniquely combines BGA packaging, VersatileI/O voltage adaptability, and secured silicon identity - making it optimal for new industrial and automotive designs demanding integration density, interface robustness, and traceability.

Availability

S29GL256P11FAIV22 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot memory, and medical imaging system configuration requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL256P11FAIV22 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer markets.

The S29GL-P series was designed specifically for embedded systems requiring reliable, high-density NOR Flash with advanced security, flexible I/O, and industrial-grade endurance - targeting boot code, firmware, and configuration storage where data integrity is mission-critical.

FAQ

What is the function of the WP#/ACC pin on S29GL256P11FAIV22?

The WP#/ACC pin serves dual roles: at VIL, it protects the highest or lowest address sector from program/erase operations; at VHH (12 V), it accelerates programming by enabling unlock-bypass mode, reducing single-word programming time from 60 µs to 13.5 µs. Internal pull-up ensures safe default VIH state when unconnected.

Does S29GL256P11FAIV22 support byte-wide data access?

Yes - the BYTE# input selects bus width: when pulled low, DQ0–DQ7 are active and DQ15/A-1 becomes the LSB address input for 8-bit operation; when high, DQ0–DQ15 operate as a 16-bit word bus. This enables compatibility with both 8-bit and 16-bit microcontroller interfaces without external glue logic.

How does the Secured Silicon Sector differ from standard flash sectors?

The Secured Silicon Sector is a physically isolated 256-byte region with separate lock mechanism - once programmed and locked (factory or customer), its contents cannot be erased or rewritten even with global erase commands. It stores a permanent 16-byte electronic serial number used for device authentication and anti-counterfeiting in certified systems.

Can S29GL256P11FAIV22 operate with VIO = 1.8 V while VCC = 3.3 V?

Yes - VersatileI/O specification explicitly supports VIO = 1.65–VCC, so 1.8 V VIO with 3.3 V VCC is fully compliant. All address, control, and data pins reference VIO for logic thresholds, enabling direct connection to 1.8 V FPGAs or ASICs without level translators while maintaining full 3.3 V core performance.

S29GL256P11FAIV22 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-P
Package/Case:
64-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
110ns
Access Time:
110 ns
Voltage - Supply:
1.65V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (13x11)

S29GL256P11FAIV22 FAQ

1.How can I place an order for S29GL256P11FAIV22 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256P11FAIV22 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256P11FAIV22 reliable?

The price and inventory of S29GL256P11FAIV22 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P11FAIV22 is usually 5 days.

3.What payment methods are accepted for S29GL256P11FAIV22?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256P11FAIV22 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256P11FAIV22?

S29GL256P11FAIV22 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256P11FAIV22 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256P11FAIV22?

For technical support, including S29GL256P11FAIV22 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P11FAIV22 requirements.

6.How does Aetrix verify that S29GL256P11FAIV22 is sourced from the original manufacturer or authorized distributors?

All S29GL256P11FAIV22 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P11FAIV22 meets industry standards.

7.What is the process for return or replacement of S29GL256P11FAIV22?

All S29GL256P11FAIV22 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P11FAIV22, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256P11FAIV22 part is unused and in its original packaging.

Return procedure for S29GL256P11FAIV22:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S29GL256P11FAIV22 Tags

  • S29GL256P11FAIV22
  • S29GL256P11FAIV22 PDF
  • S29GL256P11FAIV22 Datasheet
  • S29GL256P11FAIV22 Specifications
  • S29GL256P11FAIV22 Images
  • Infineon Technologies
  • Infineon Technologies S29GL256P11FAIV22
  • Buy S29GL256P11FAIV22
  • S29GL256P11FAIV22 Price
  • S29GL256P11FAIV22 Distributor
  • S29GL256P11FAIV22 Supplier
  • S29GL256P11FAIV22 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER