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Infineon Technologies S29GL256P11FFI010

Part No.:
S29GL256P11FFI010
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL256P11FFI010.pdf
Description:
IC FLASH 256MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:807

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Product details

Overview

S29GL256P11FFI010 from Cypress Semiconductor is a 256 Mbit (32 MB), 3.0 V-only Page Flash memory IC fabricated on 90 nm MirrorBit process technology, featuring 256 uniform 64 Kword sectors, 25 ns page access time, and 32-word write buffer for accelerated multi-word programming. It operates across –40°C to +85°C and supports VersatileI/O™ with VIO range 1.65–VCC, making it suitable for industrial embedded storage in networking routers and automotive control modules.

For engineers reviewing the S29GL256P11FFI010 datasheet, S29GL256P11FFI010 pinout, S29GL256P11FFI010 application, or S29GL256P11FFI010 equivalent, key selection criteria include sector erase endurance (100,000 cycles), data retention (20 years), CFI compliance, hardware reset (RESET#), and dual protection modes (Persistent/Password Advanced Sector Protection).

Technical Context

This device implements a synchronous/non-volatile flash architecture with independent X/Y decoders, on-chip voltage generators for erase/program, and state control logic managing command sequences via WE#/CE#/OE# timing. It supports byte/word configuration via BYTE#, uses DQ15/A-1 as dual-role pin, and integrates a secured silicon sector with factory- or customer-programmable 128-word serial number.

Operation relies on command register latching with unlock bypass mode for accelerated programming when WP#/ACC is driven to VHH. The Ready/Busy# (RY/BY#) output provides real-time status of embedded algorithms, while CFI support enables host system auto-configuration of timing and geometry parameters.

Key Specifications

ParameterValue and Actual Design Meaning
Density256 Mbit (32 MB) organized as 256 × 64 Kword sectors
Page Access Time25 ns - enables high-speed burst reads in boot code execution
Write Buffer Size32 words (64 bytes) - reduces effective programming time by >75% vs single-word writes
Erase Endurance100,000 cycles per sector - supports long-life firmware update partitions
Data Retention20 years at +85°C - ensures reliability in industrial temperature-cycled environments
VIO Range1.65 V to VCC - allows I/O voltage scaling independent of core VCC (2.7–3.6 V)
Operating Temp–40°C to +85°C - qualified for industrial-grade embedded systems

Pinout & Package

Package: 64-ball Fortified BGA (LAA064), 11 mm × 13 mm, 1.0 mm pitch, Pb-free (F), industrial temperature grade (I).

Pin/TerminalCircuit RoleDesign Meaning
A23–A0Address Inputs24-bit address bus supporting full 32 MB addressing (A23 = MSB)
DQ15–DQ0Data I/O (Word Mode)16-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode
CE#, OE#, WE#Chip/Output/Write EnableStandard asynchronous control signals with setup/hold timing critical for reliable read/write
RY/BY#Ready/Busy OutputActive-low open-drain signal indicating active program/erase; used for polling or interrupt-driven operation
RESET#Hardware Reset InputAsynchronous active-low reset that aborts ongoing operations and returns device to read mode
WP#/ACCWrite Protect / AccelerationAt VIL: protects top/bottom sector; at VHH: enables unlock bypass mode for faster programming
VIOVersatile I/O SupplyIndependent I/O voltage reference enabling mixed-voltage system interfacing (1.65–VCC)

Key Features

FeatureDesign Value
Uniform Sector Architecture256 identical 64 Kword sectors simplify firmware partitioning and wear leveling
Secured Silicon Sector128-word factory- or customer-lockable region for immutable device identification or secure keys
Suspend/Resume CommandsAllows interruption of erase/program to service high-priority reads without data corruption
Advanced Sector ProtectionPersistent bits + password method enable flexible, layered security against accidental or malicious reprogramming
CFI ComplianceEnables automatic detection of geometry, timing, and command set by host bootloader or OS flash driver

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing firmware and configuration data in programmable logic controllers deployed in factory automation environments with wide temperature swings and EMI exposure.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing deterministic 25 ns page read access during cold start and field firmware updates.

Use Value: 20-year data retention and 100,000 erase cycles ensure firmware integrity over 15+ year product lifecycles without refresh.

Use Scenario: Holding boot code and safety-critical calibration data for radar processing units in autonomous driving systems.

IC Role / Device Role / Timing Role: Secure, high-reliability flash storing ASIL-B compliant boot images with hardware-accelerated programming via WP#/ACC.

Use Value: Secured Silicon Sector enables tamper-proof serial number binding to vehicle VIN, satisfying UNECE R155 traceability requirements.

Networking Router ConfigurationMedical Imaging System BIOS

Use Scenario: Persistent storage of routing tables, VLAN configurations, and failover scripts in enterprise-grade Layer 3 switches.

IC Role / Device Role / Timing Role: CFI-compliant flash allowing dynamic runtime detection and initialization by Linux-based network OS without hard-coded drivers.

Use Value: Write buffer programming cuts firmware update time from seconds to sub-100 ms, minimizing network downtime during maintenance windows.

Use Scenario: Storing diagnostic BIOS and regulatory-certified boot firmware in FDA-cleared MRI and CT scanner control boards.

IC Role / Device Role / Timing Role: Industrial-temperature-rated non-volatile memory ensuring boot validity after thermal cycling and radiation-hardened operation.

Use Value: Hardware RESET# and RY/BY# signaling provide deterministic recovery from power brownouts during imaging procedures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Page Flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL256S11FFI010Same density and package, but 65 nm Eclipse process; 10% lower active current (45 mA vs 50 mA), 15% faster sector erase (425 ms vs 500 ms)Targeted at battery-powered edge gateways requiring extended standby lifeSelect if lower power consumption and faster erase are prioritized over legacy qualification status
MX29GL256FHI-90GMacronix equivalent; same 256 Mbit, TSOP-56 only; no VersatileI/O support; lacks secured silicon sectorSuitable for cost-sensitive consumer electronics where I/O flexibility and security are non-criticalChoose only when BGA footprint is not required and advanced protection features are unnecessary

Compared with S29GL256S11FFI010 and MX29GL256FHI-90G, the S29GL256P11FFI010 uniquely balances industrial temperature robustness, VersatileI/O voltage independence, and hardware-enforced security - making it optimal for safety- or uptime-critical embedded systems where both performance and trust are design requirements.

Availability

S29GL256P11FFI010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and networking router configuration requiring stable component supply across extended product lifecycles.

Supply support for S29GL256P11FFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, low-power non-volatile memory and microcontroller solutions for industrial, automotive, and communications markets.

The S29GL-P series was engineered specifically for embedded systems needing reliable, high-density flash with fast page access, flexible I/O voltage support, and hardware-level security - targeting applications where firmware integrity and long-term field reliability are non-negotiable.

FAQ

What is the function of the WP#/ACC pin on S29GL256P11FFI010?

The WP#/ACC pin serves dual functions: at VIL, it protects the highest or lowest address sector from accidental program/erase; at VHH (12 V), it accelerates programming by enabling unlock bypass mode, reducing single-word programming time from 60 µs to 13.5 µs. Internally pulled up, it defaults to VIH when unconnected, permitting normal operation.

Does S29GL256P11FFI010 support byte-mode operation?

Yes. When BYTE# is driven low, the device enters byte mode: DQ0–DQ7 become active data lines, and DQ15/A-1 functions as the LSB address input (A-1). This enables 8-bit microcontroller interfacing without external data bus multiplexing, preserving pin count and simplifying PCB layout for legacy 8-bit systems.

How does the Secured Silicon Sector differ from standard flash sectors?

The Secured Silicon Sector is a dedicated 128-word (256-byte) region physically isolated from main array logic. It can be permanently locked at factory or by user to store immutable identifiers like electronic serial numbers. Unlike standard sectors, it cannot be erased or rewritten once locked, and its contents remain intact even after full chip erase commands.

Can S29GL256P11FFI010 be used with a 1.8 V I/O interface?

Yes, provided VCC is within 2.7–3.6 V and VIO is set to 1.8 V. The VersatileI/O™ architecture allows VIO to operate independently from VCC across 1.65–VCC, enabling direct connection to 1.8 V logic families without level shifters. All input thresholds and output drive strengths are referenced to VIO, ensuring signal integrity in mixed-voltage systems.

S29GL256P11FFI010 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-P
Package/Case:
64-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
110ns
Access Time:
110 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (13x11)

S29GL256P11FFI010 FAQ

1.How can I place an order for S29GL256P11FFI010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256P11FFI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256P11FFI010 reliable?

The price and inventory of S29GL256P11FFI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P11FFI010 is usually 5 days.

3.What payment methods are accepted for S29GL256P11FFI010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256P11FFI010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256P11FFI010?

S29GL256P11FFI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256P11FFI010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256P11FFI010?

For technical support, including S29GL256P11FFI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P11FFI010 requirements.

6.How does Aetrix verify that S29GL256P11FFI010 is sourced from the original manufacturer or authorized distributors?

All S29GL256P11FFI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P11FFI010 meets industry standards.

7.What is the process for return or replacement of S29GL256P11FFI010?

All S29GL256P11FFI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P11FFI010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256P11FFI010 part is unused and in its original packaging.

Return procedure for S29GL256P11FFI010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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