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Infineon Technologies S29GL256P11FFI023
- Part No.:
- S29GL256P11FFI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256P11FFI023.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,154
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Product details
Overview
S29GL256P11FFI023 from Cypress Semiconductor is a 256 Mbit (32 MB), 3.0 V-only Page Flash memory IC fabricated on 90 nm MirrorBit process technology, featuring 256 uniform 64 Kword (128 Kbyte) sectors, 25 ns page access time, and 110 ns random access time under regulated VCC. It supports VersatileI/O™ with VIO range 1.65–VCC, includes 32-word write buffer and secured silicon sector with electronic serial number, and is used in industrial embedded systems requiring nonvolatile program storage and firmware updates.
For engineers reviewing the S29GL256P11FFI023 datasheet, S29GL256P11FFI023 pinout, S29GL256P11FFI023 application, or S29GL256P11FFI023 equivalent, key selection criteria include sector architecture uniformity, VIO voltage flexibility, WP#/ACC acceleration capability, CFI compliance, and industrial temperature operation (–40°C to +85°C) in Fortified BGA package.
Technical Context
This device implements a synchronous/asynchronous hybrid interface with dedicated CE#, OE#, and WE# controls, enabling standard NOR Flash command-set execution including autoselect, program suspend/resume, and advanced sector protection via persistent bits or password lock. Its internal state machine manages erase and program algorithms without external timing control.
The 64-ball Fortified BGA (LAA064) package supports byte/word configuration via BYTE# input, and integrates hardware reset (RESET#) and ready/busy status (RY/BY#) for system-level coordination. The secured silicon sector provides factory- or customer-programmable 128-word identification space with permanent lock capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB) organized as 256 × 64 Kword sectors |
| Page Access Time | 25 ns - enables fast burst reads of up to 8 words per access |
| Random Access Time | 110 ns at regulated VCC (3.0–3.6 V) - defines worst-case single-word read latency |
| Write Buffer Size | 32 words (64 bytes) - reduces effective programming time for multi-word writes |
| Erase Endurance | 100,000 cycles per sector - supports frequent field firmware updates |
| Data Retention | 20 years typical - ensures long-term reliability in unpowered storage |
| VIO Range | 1.65 V to VCC - allows I/O voltage scaling independent of core supply |
| Operating Temp | –40°C to +85°C - qualified for industrial ambient environments |
Pinout & Package
Package: 64-ball Fortified Ball Grid Array (LAA064), 11 mm × 13 mm, 1.0 mm pitch, Pb-free (F), industrial temperature grade (I).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A23–A0 | Address Inputs | 24-bit address bus supporting full 256 Mbit addressing (A23 = MSB) |
| DQ15–DQ0 | Data I/O (Word Mode) | 16-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode |
| CE# | Chip Enable | Active-low chip select; device enters standby when deasserted |
| OE# | Output Enable | Active-low control for data output gating; enables low-power read disable |
| WE# | Write Enable | Active-low strobe for write/program command latching and data capture |
| BYTE# | Bus Width Select | At VIL: enables 8-bit DQ0–DQ7 operation; at VIH: enables 16-bit DQ0–DQ15 |
| WP#/ACC | Write Protect / Acceleration | At VIL: protects top/bottom sector; at VHH: enables unlock bypass for faster programming |
| RY/BY# | Ready/Busy Output | Open-drain active-low signal indicating ongoing program/erase operation |
| RESET# | Hardware Reset | Active-low asynchronous reset that aborts operations and returns to read mode |
| VIO | Versatile I/O Supply | Independent I/O voltage reference (1.65–VCC); sets logic thresholds for all I/O pins |
Key Features
| Feature | Design Value |
|---|---|
| Uniform Sector Architecture | 256 identical 64 Kword sectors simplify firmware partitioning and OTA update management |
| Secured Silicon Sector | 128-word factory- or customer-lockable region stores immutable device identity and security keys |
| Advanced Sector Protection | Persistent lock bits and password-based methods prevent unauthorized firmware modification |
| Suspend/Resume Capability | Allows interrupting erase or program operations to service high-priority reads, then resume |
| CFI Compliance | Standardized JEDEC Common Flash Interface enables OS/driver auto-detection and generic support |
| Low Standby Current | 1 µA typical - minimizes power draw during idle periods in battery-backed systems |
Applications
| Industrial PLC Firmware Storage | Automotive Infotainment Boot Memory |
|---|---|
|
Use Scenario: Storing boot code and real-time control firmware in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Nonvolatile program memory providing deterministic read latency and sector-level update isolation. Use Value: 100,000 erase cycles and 20-year retention ensure firmware longevity across extended equipment lifecycles without replacement. |
Use Scenario: Hosting boot loader and OS kernel images in automotive head units with AEC-Q100-aligned thermal and ESD robustness. IC Role / Device Role / Timing Role: Primary NOR Flash for XIP-capable code execution and secure firmware authentication during cold start. Use Value: Secured silicon sector enables binding of cryptographic keys to hardware identity, preventing cloning or tampering. |
| Medical Diagnostic Equipment BIOS | Network Router Configuration Storage |
|
Use Scenario: Holding calibrated sensor calibration tables and safety-critical startup routines in FDA-regulated diagnostic imaging systems. IC Role / Device Role / Timing Role: Trusted, write-protected configuration memory with traceable revision history and audit-ready sector locking. Use Value: WP#/ACC pin with VHH acceleration supports rapid factory programming during production test while preserving field write protection. |
Use Scenario: Storing routing tables, CLI scripts, and failover configurations in carrier-grade edge routers requiring zero-downtime updates. IC Role / Device Role / Timing Role: Dual-bank emulated flash via sector suspend/resume enables atomic configuration swaps without service interruption. Use Value: 25 ns page read time accelerates configuration loading during reboot, reducing mean time to recovery (MTTR). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Page Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S11FFI020 | Successor generation on 65 nm Eclipse process; 10% lower active current, same pinout and command set | Higher density variants available; requires updated timing parameters in controller firmware | Select for new designs prioritizing power efficiency and longer roadmap support |
| MX29GL256FHI-90G | Macronix equivalent; 90 ns random access (vs. 110 ns); no secured silicon sector; different CFI vendor ID | Lacks hardware-locked identity region; requires software-managed serial number storage | Select when cost sensitivity outweighs need for factory-programmable device identity |
Compared with S29GL256P11FFI023, the S29GL256S11FFI020 offers improved power efficiency and extended product lifecycle, while the MX29GL256FHI-90G trades secured silicon functionality for faster raw access and lower unit cost-making it suitable where cryptographic binding is handled externally.
Availability
S29GL256P11FFI023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot memory, and medical diagnostic equipment BIOS requiring stable component supply across extended product lifecycles.
Supply support for S29GL256P11FFI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer applications.
The S29GL-P family was designed specifically for embedded systems requiring reliable, high-density NOR Flash with flexible I/O voltage, robust sector protection, and long-term data integrity-targeting applications where code execution-in-place (XIP) and field-upgradable firmware are essential.
FAQ
What is the function of the WP#/ACC pin on S29GL256P11FFI023?
The WP#/ACC pin serves dual roles: at VIL, it protects the top or bottom sector from accidental program/erase; at VHH (12 V), it enables Unlock Bypass Program mode, accelerating programming throughput during manufacturing. Internal pull-up ensures safe default (VIH) state when unconnected, disabling protection and acceleration unless explicitly driven.
Does S29GL256P11FFI023 support byte-wide data access?
Yes, via the BYTE# input: when pulled low, the device operates in byte mode with DQ0–DQ7 active and DQ15/A-1 repurposed as address bit A-1. This enables 8-bit microcontroller interfacing without external data bus multiplexing, maintaining full 256 Mbit addressability with appropriate address decoding.
How does the secured silicon sector differ from standard flash sectors?
The secured silicon sector is a dedicated 128-word (256-byte) region physically isolated from main array sectors. It supports one-time or customer-lockable programming of an 8-word electronic serial number and remains inaccessible to standard erase commands-even when global protection is disabled-ensuring permanent, tamper-resistant device identification.
Can S29GL256P11FFI023 be used in systems with mixed 1.8 V and 3.3 V I/O domains?
Yes, through VersatileI/O™: VIO can be set independently from VCC within 1.65–VCC. With VCC = 3.3 V and VIO = 1.8 V, all inputs accept 1.8 V logic levels and outputs drive 1.8 V-compatible receivers-enabling direct interface to 1.8 V FPGAs or processors without level shifters, while maintaining 3.3 V core operation.
S29GL256P11FFI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-P
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 110ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL256P11FFI023 FAQ
1.How can I place an order for S29GL256P11FFI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256P11FFI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256P11FFI023 reliable?
The price and inventory of S29GL256P11FFI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P11FFI023 is usually 5 days.
3.What payment methods are accepted for S29GL256P11FFI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256P11FFI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256P11FFI023?
S29GL256P11FFI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256P11FFI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256P11FFI023?
For technical support, including S29GL256P11FFI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P11FFI023 requirements.
6.How does Aetrix verify that S29GL256P11FFI023 is sourced from the original manufacturer or authorized distributors?
All S29GL256P11FFI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P11FFI023 meets industry standards.
7.What is the process for return or replacement of S29GL256P11FFI023?
All S29GL256P11FFI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P11FFI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256P11FFI023 part is unused and in its original packaging.
Return procedure for S29GL256P11FFI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256P11FFI023 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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Microchip Technology
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Microchip Technology
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AT24C08C-STUM-T
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