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Infineon Technologies S29GL256P11FFIV10

Part No.:
S29GL256P11FFIV10
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL256P11FFIV10.pdf
Description:
IC FLASH 256MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,033

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Product details

Overview

S29GL256P11FFIV10 from Cypress Semiconductor is a 256 Mbit (32 MB), 3.0 V-only Page Flash memory IC fabricated on 90 nm MirrorBit process technology, featuring 256 uniform 64 Kword (128 Kbyte) sectors, 25 ns page access time, and 110 ns random access time under regulated VCC conditions. It supports VersatileI/O™ with VIO range 1.65–VCC, 32-word write buffer, and Secured Silicon Sector for electronic serial number programming - deployed in industrial embedded controllers requiring nonvolatile program storage with sector-level protection.

For engineers reviewing the S29GL256P11FFIV10 datasheet, S29GL256P11FFIV10 pinout, S29GL256P11FFIV10 application, or S29GL256P11FFIV10 equivalent, key selection criteria include sector erase endurance (100,000 cycles), data retention (20 years), CFI compliance, hardware reset (RESET#), and WP#/ACC dual-function input for factory acceleration and sector write protection.

Technical Context

This device implements a synchronous/asynchronous hybrid interface with dedicated CE#, OE#, and WE# controls, supporting byte/word configuration via BYTE# input and automatic sleep mode for low-power standby (1 µA). Its internal state machine handles embedded erase and program algorithms, with RY/BY# output signaling operation completion and unlock bypass command reducing single-word programming to 60 µs.

The 64-ball Fortified BGA (LAA064) package enables high-density PCB layout while supporting both full-VCC (2.7–3.6 V) and regulated-VCC (3.0–3.6 V) operation modes. VersatileI/O™ decouples I/O voltage (VIO) from core supply (VCC), allowing interoperability with 1.8 V or 3.3 V logic systems without level shifters.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256 Mbit (32 MB) organized as 256 × 64 Kword sectors - enables firmware partitioning and field-upgradeable code banks.
Page Access Time 25 ns - accelerates sequential instruction fetch from contiguous flash pages in boot loaders and real-time OS kernels.
Random Access Time 110 ns at regulated VCC (3.0–3.6 V) - meets timing budgets for direct execution from flash in microcontroller-based systems.
Write Buffer Size 32 words (64 bytes) - reduces effective multi-word programming time by >4× vs. standard byte programming.
Erase Endurance 100,000 cycles per sector - supports frequent firmware update cycles in industrial gateways and edge nodes.
Data Retention 20 years at +85°C - ensures long-term reliability in unattended infrastructure equipment without refresh.
VIO Range 1.65 V to VCC - eliminates external level shifters when interfacing with mixed-voltage SoCs or FPGAs.

Pinout & Package

Package: 64-ball Fortified Ball Grid Array (LAA064), 11 mm × 13 mm, 1.0 mm pitch, Pb-free (F), industrial temperature (–40°C to +85°C).

Pin/Terminal Circuit Role Design Meaning
A23–A0 Address Inputs 24-bit address bus supporting full 32 MB addressing; A23 is MSB for 256 Mbit density.
DQ15–DQ0 Data I/O (Word Mode) 16-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode when BYTE# = VIL.
CE#, OE#, WE# Chip/Output/Write Enable Standard asynchronous control trio enabling direct connection to microcontroller memory bus without glue logic.
WP#/ACC Write Protect / Acceleration Input Pull-up enabled; driven to VHH (12 V) during production programming to activate unlock bypass mode and accelerate throughput.
RESET# Hardware Reset Input Active-low signal forcing device into read mode and aborting ongoing erase/program operations - critical for safe power-cycle recovery.
RY/BY# Ready/Busy Output Open-drain status indicator: low = active erase/program; high-Z = ready - used for polling or interrupt-driven operation.
VIO Versatile I/O Supply Independent voltage reference for all I/O pins; sets input thresholds and output swing - enables 1.8 V/3.3 V system compatibility.

Key Features

Feature Design Value
Secured Silicon Sector 128-word (256-byte) factory- or customer-lockable region containing programmable 8-word electronic serial number - enables secure device identity binding in IoT endpoints.
Advanced Sector Protection Persistent lock bits + password method - allows selective sector lockdown against accidental or malicious firmware overwrite in safety-critical applications.
Suspend/Resume Commands Pauses active erase or program operations to service higher-priority read requests - essential for real-time HMI and diagnostic logging.
CFI Compliance Common Flash Interface v1.3 support - enables OS-agnostic flash management (e.g., U-Boot, Linux MTD) without vendor-specific drivers.
Uniform Sector Architecture 256 identical 64 Kword sectors - simplifies bootloader design, wear leveling, and over-the-air update partitioning across embedded platforms.

Applications

Industrial PLC Firmware Storage Automotive Telematics Boot Code

Use Scenario: Storing and executing boot firmware and configuration data in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Nonvolatile program memory with deterministic 110 ns random access and hardware reset recovery for fail-safe restart.

Use Value: 20-year data retention and 100,000 erase cycles ensure firmware integrity over 15+ year equipment lifecycles without maintenance.

Use Scenario: Hosting secure boot images and OTA update partitions in vehicle telematics control units subject to automotive temperature and EMI requirements.

IC Role / Device Role / Timing Role: CFI-compliant flash with Secured Silicon Sector for cryptographic key binding and anti-tamper firmware identity.

Use Value: WP#/ACC acceleration enables rapid factory programming; industrial temp grade (–40°C to +85°C) meets AEC-Q100 ambient requirements.

Medical Imaging System BIOS Smart Energy Meter Firmware

Use Scenario: Storing diagnostic BIOS, calibration tables, and regulatory-compliant boot code in FDA-class II imaging devices requiring traceable firmware revisions.

IC Role / Device Role / Timing Role: Sector-protected memory with persistent lock bits preventing unauthorized modification of safety-critical startup routines.

Use Value: Uniform 64 Kword sectors simplify version-controlled firmware rollback and audit-ready change tracking per IEC 62304.

Use Scenario: Holding metering application code, tariff tables, and communication stack firmware in utility-grade smart meters deployed in remote outdoor enclosures.

IC Role / Device Role / Timing Role: Low-power standby (1 µA) flash with automatic sleep mode extending battery life during infrequent wake-up events.

Use Value: 25 ns page read speed accelerates secure boot verification; 1.65–3.6 V VIO range accommodates aging battery voltage profiles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Page Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX29GL256ELXGI-90G 90 nm process, 256 Mbit, 90 ns access, TSOP-56 only - no BGA option; lacks VersatileI/O™ and Secured Silicon Sector. Targeted at cost-sensitive consumer electronics with fixed 3.3 V I/O; unsuitable for mixed-voltage or security-critical designs. Select when board space permits TSOP and security features are unnecessary; verify CFI version compatibility.
S29GL256S11FFIV10 Same die, 65 nm Eclipse generation - 10% lower active current (45 mA vs. 50 mA), identical pinout and command set. Drop-in replacement for new designs prioritizing power efficiency; not recommended for legacy qualification due to different process node. Prefer for new industrial designs requiring <50 mA program current; confirm thermal profile matches 90 nm baseline.

Compared with MX29GL256ELXGI-90G, S29GL256P11FFIV10 offers VIO flexibility and secure identity; versus S29GL256S11FFIV10, it trades slightly higher power for proven 90 nm reliability in long-lifecycle deployments.

Availability

S29GL256P11FFIV10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive telematics boot code, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.

Supply support for S29GL256P11FFIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-reliability nonvolatile memory, PSoC mixed-signal ICs, and USB-C/power delivery solutions.

The S29GL-P series was designed specifically for embedded systems demanding robust, long-life flash memory with advanced protection, sector granularity, and mixed-voltage interoperability - targeting industrial automation, automotive, and medical markets.

FAQ

What is the maximum operating temperature range for S29GL256P11FFIV10?

The 'I' suffix in the part number denotes Industrial temperature grade: –40°C to +85°C ambient operating range. This is validated per JEDEC JESD22-A108 and supported across all specified VCC and VIO voltage ranges. Thermal derating is not required within this envelope, and data retention remains 20 years at +85°C.

Does S29GL256P11FFIV10 support byte-level writes?

No - it supports word (16-bit) and byte (8-bit) data bus configurations via the BYTE# pin, but programming occurs in minimum units of one word (or one byte in byte mode); there is no true single-byte write capability. All writes require valid command sequences and are subject to the 32-word write buffer limit.

How is the Secured Silicon Sector programmed and locked?

The 128-word Secured Silicon Sector is programmed using standard CFI commands (e.g., Program Setup, Program Confirm) applied to addresses 0x00000000–0x000000FF. Locking is performed via the Sector Protect command (0x60 → 0xD0) followed by the appropriate sector address; once locked, the sector becomes permanently read-only and immune to erase or program commands.

Can S29GL256P11FFIV10 be used with a 1.8 V microcontroller interface?

Yes - with VIO = 1.8 V and VCC = 3.0–3.6 V (model V1/V2), all inputs accept 1.8 V logic levels and outputs drive to 1.8 V-compatible swing. The device maintains full timing specifications (110 ns random access) in this mode, eliminating need for external level shifters in mixed-voltage designs.

S29GL256P11FFIV10 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-P
Package/Case:
64-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
110ns
Access Time:
110 ns
Voltage - Supply:
1.65V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (13x11)

S29GL256P11FFIV10 FAQ

1.How can I place an order for S29GL256P11FFIV10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256P11FFIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256P11FFIV10 reliable?

The price and inventory of S29GL256P11FFIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P11FFIV10 is usually 5 days.

3.What payment methods are accepted for S29GL256P11FFIV10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256P11FFIV10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256P11FFIV10?

S29GL256P11FFIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256P11FFIV10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256P11FFIV10?

For technical support, including S29GL256P11FFIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P11FFIV10 requirements.

6.How does Aetrix verify that S29GL256P11FFIV10 is sourced from the original manufacturer or authorized distributors?

All S29GL256P11FFIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P11FFIV10 meets industry standards.

7.What is the process for return or replacement of S29GL256P11FFIV10?

All S29GL256P11FFIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P11FFIV10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256P11FFIV10 part is unused and in its original packaging.

Return procedure for S29GL256P11FFIV10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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