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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256P11FFIV12

Name: S29GL256P11FFIV12
Brand: Infineon Technologies
SKU: S29GL256P11FFIV12
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256P11FFIV12

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256P11FFIV12.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Inventory:2,371

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Product details

Overview

S29GL256P11FFIV12 from Cypress Semiconductor is a 256 Mbit (32 MB), 3.0 V-only page-mode NOR Flash memory fabricated on 90 nm MirrorBit process technology, featuring 25 ns page access time, 110 ns random access time, uniform 64 Kword sectors (256 total), and 100,000 erase cycles per sector - deployed in industrial embedded systems for firmware storage and boot code execution.

For engineers reviewing the S29GL256P11FFIV12 datasheet, S29GL256P11FFIV12 pinout, S29GL256P11FFIV12 application, or S29GL256P11FFIV12 equivalent, key selection considerations include VIO-compatible I/O voltage flexibility (1.65–VCC), write buffer programming efficiency (64-byte burst), secured silicon sector with factory-programmable serial number, and industrial temperature range (–40°C to +85°C) support.

Technical Context

This device implements a synchronous/asynchronous hybrid interface with VersatileI/O™ control: all address, control, and data signal thresholds are dynamically set by the VIO supply (1.65–VCC), enabling interoperability with mixed-voltage host systems. It supports both word (DQ0–DQ15) and byte (DQ0–DQ7 + A-1) configurations via BYTE# input.

Embedded algorithms manage program/erase operations with suspend/resume capability, status reporting via RY/BY#, and dual-sector protection methods - persistent lock bits and password-based Advanced Sector Protection - ensuring robust firmware integrity in field-deployed equipment.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mbit (32 MB) organized as 256 × 64 Kword uniform sectors
Access Time	110 ns random access (VCC = 2.7–3.6 V, VIO = 1.65–VCC); 25 ns page access
Write Buffer	64-byte (32-word) buffer enabling burst programming with 13.5 µs/word at VHH
Erase Endurance	100,000 program/erase cycles per sector - validated for long-life firmware update cycles
Data Retention	20 years typical - sufficient for industrial product lifecycles without refresh
Operating Temp	–40°C to +85°C (Industrial grade) - qualified for harsh ambient environments
VIO Range	1.65 V to VCC - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic without level shifters

Pinout & Package

Package: 64-ball Fortified BGA (LAA064, 11 × 13 mm, 1.0 mm pitch), Pb-free, industrial temperature grade.

Pin/Terminal	Circuit Role	Design Meaning
A23–A0	Address Inputs	24-bit address bus supporting full 32 MB addressing (A23 = MSB)
DQ15–DQ0	Data I/O (Word Mode)	16-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode
CE#, OE#, WE#	Chip/Output/Write Enable	Standard asynchronous control signals compatible with legacy microcontroller interfaces
RY/BY#	Ready/Busy Output	Active-low open-drain status indicator for embedded algorithm completion
RESET#	Hardware Reset Input	Asynchronous reset that halts ongoing operations and restores read mode
WP#/ACC	Write Protect / Acceleration	At VIL: locks top/bottom sector; at VHH: enables unlock bypass for faster production programming
VIO	Versatile I/O Supply	Defines input threshold and output drive levels - decouples I/O voltage from core VCC
BYTE#	Bus Width Select	Configures device for 8-bit (VIL) or 16-bit (VIH) data interface

Key Features

Feature	Design Value
90 nm MirrorBit Process	Enables higher density and lower power vs. older floating-gate NOR, with proven reliability in automotive/industrial use
Secured Silicon Sector	256-byte factory- or customer-lockable region containing unique 16-byte electronic serial number for device authentication
Advanced Sector Protection	Combines persistent lock bits and password-based software protection - prevents unauthorized firmware modification
Write Buffer Programming	Reduces effective programming time by >60% vs. single-word writes when updating contiguous firmware blocks
CFI Compliance	Enables automatic detection and configuration by standard flash-aware bootloaders and OS drivers

Applications

Industrial PLC Firmware Storage

Automotive Instrument Cluster Boot Memory

Use Scenario: Nonvolatile storage of runtime firmware and configuration parameters in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Primary boot and application code storage with deterministic 110 ns read latency for real-time task initialization.

Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity across 15+ year equipment service life without replacement.

Use Scenario: Storing calibrated display graphics, gauge logic, and safety-critical boot code in automotive digital instrument clusters.

IC Role / Device Role / Timing Role: NOR Flash executing XIP (eXecute-In-Place) code directly from memory during cold start (<500 ms boot time).

Use Value: Industrial temperature rating (–40°C to +85°C) and VIO flexibility allow direct connection to 1.8 V display controller without level-shifting components.

Medical Diagnostic Equipment BIOS

Telecom Base Station Configuration Memory

Use Scenario: Secure storage of calibration tables, regulatory compliance flags, and diagnostic self-test routines in FDA-cleared imaging devices.

IC Role / Device Role / Timing Role: Protected boot memory with Secured Silicon Sector holding cryptographic keys and device identity.

Use Value: Password-locked Advanced Sector Protection prevents tampering with calibration data required for ISO 13485 traceability.

Use Scenario: Holding FPGA configuration bitstreams, radio parameter sets, and fail-safe recovery images in outdoor 4G/5G base station units.

IC Role / Device Role / Timing Role: High-reliability configuration store supporting remote reprogramming over backhaul links.

Use Value: Write buffer programming enables <1 s field updates of multi-kilobyte parameter sets, minimizing service downtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MX29GL256FHI-11G	Spansion (now Cypress) second-source variant; identical 256 Mbit density, same 110 ns access, but uses standard TSOP packaging (not BGA)	Lacks Fortified BGA mechanical robustness; no VIO flexibility - fixed 3.3 V I/O	Select when board layout requires through-hole or standard surface-mount footprint and mixed-voltage operation is unnecessary
S29GL256S11FFIV10	Same die, newer revision (S-series); adds 65 nm Eclipse architecture, improved 100 ns random access, and enhanced ECC support	Requires updated timing initialization in bootloader; not drop-in for legacy S29GL256P firmware	Select for new designs requiring longer lifecycle availability and tighter timing margins, with validation of reset/power-on sequencing

Compared with MX29GL256FHI-11G and S29GL256S11FFIV10, the S29GL256P11FFIV12 delivers optimal trade-off between proven field reliability, VIO-driven voltage adaptability, and industrial-grade BGA packaging - making it preferred for space-constrained, mixed-voltage embedded platforms where long-term supply continuity is critical.

Availability

S29GL256P11FFIV12 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical diagnostic equipment BIOS requiring stable component supply across extended product lifecycles.

Supply support for S29GL256P11FFIV12 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor, now part of Infineon Technologies, designs high-reliability nonvolatile memory and microcontroller solutions for industrial, automotive, and communications markets.

The S29GL-P series was engineered specifically for embedded systems demanding deterministic NOR Flash performance, secure firmware storage, and seamless integration into mixed-voltage host architectures - emphasizing longevity, data integrity, and qualification for harsh environments.

FAQ

What is the function of the VIO pin on the S29GL256P11FFIV12?

The VIO pin sets the voltage reference for all input thresholds and output drive levels, allowing the device to interface directly with 1.8 V, 2.5 V, or 3.3 V logic families while maintaining VCC at 3.0–3.6 V. This eliminates external level shifters and simplifies mixed-voltage system design without compromising timing or signal integrity.

Does the S29GL256P11FFIV12 support execute-in-place (XIP) operation?

Yes - its fast 25 ns page access and deterministic 110 ns random read timing enable direct code execution from flash memory by microcontrollers and application processors. The device supports standard asynchronous read protocols required for XIP boot loaders, with no internal wait states or prefetch buffers needed.

How is sector protection implemented on this device?

Sector protection uses two independent methods: persistent lock bits (hardware-set, non-volatile bits per sector) and password-based Advanced Sector Protection (software-configurable via CFI commands). WP#/ACC provides additional hardware-level protection for top/bottom sectors, and the Secured Silicon Sector can be permanently locked to prevent modification of critical identification data.

What is the purpose of the RY/BY# pin?

RY/BY# is an open-drain ready/busy status output that goes low during active program or erase operations and returns high-impedance when complete. It enables polling-based operation without CPU overhead and supports hardware interrupt-driven flow control in real-time systems where precise timing of flash operations is required.

S29GL256P11FFIV12 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-P

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 32M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 110ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL256P11FFIV12 FAQ

1.How can I place an order for S29GL256P11FFIV12 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256P11FFIV12 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256P11FFIV12 reliable?

The price and inventory of S29GL256P11FFIV12 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P11FFIV12 is usually 5 days.

3.What payment methods are accepted for S29GL256P11FFIV12?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256P11FFIV12 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256P11FFIV12?

S29GL256P11FFIV12 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256P11FFIV12 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256P11FFIV12?

For technical support, including S29GL256P11FFIV12 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P11FFIV12 requirements.

6.How does Aetrix verify that S29GL256P11FFIV12 is sourced from the original manufacturer or authorized distributors?

All S29GL256P11FFIV12 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P11FFIV12 meets industry standards.

7.What is the process for return or replacement of S29GL256P11FFIV12?

All S29GL256P11FFIV12 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P11FFIV12, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256P11FFIV12 part is unused and in its original packaging.

Return procedure for S29GL256P11FFIV12:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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