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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256P11FFIV13

Name: S29GL256P11FFIV13
Brand: Infineon Technologies
SKU: S29GL256P11FFIV13
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256P11FFIV13

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256P11FFIV13.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL256P11FFIV13 from Cypress Semiconductor is a 256 Mbit (32 MB), 3.0 V-only Page Flash memory IC fabricated on 90 nm MirrorBit process technology, featuring 25 ns page access time, 110 ns random access time, uniform 64 Kword sectors (256 total), and VersatileI/O™ support with VIO range 1.65–VCC. It serves as nonvolatile program/data storage in industrial embedded controllers requiring fast boot code retrieval and field firmware updates.

For engineers reviewing the S29GL256P11FFIV13 datasheet, S29GL256P11FFIV13 pinout, S29GL256P11FFIV13 application, or S29GL256P11FFIV13 equivalent, key selection criteria include sector erase endurance (100,000 cycles), data retention (20 years), write buffer programming efficiency (13.5 µs/word with VHH), and dual-package availability (64-ball Fortified BGA, TSOP).

Technical Context

This device implements a synchronous command-set architecture compliant with Common Flash Interface (CFI), supporting both word and byte configurations via BYTE# control. Its internal state machine executes embedded erase and program algorithms with suspend/resume capability, while RY/BY# provides real-time status feedback for system-level timing coordination.

The VersatileI/O™ interface decouples I/O voltage (VIO) from core supply (VCC), enabling interoperability with 1.8 V, 2.5 V, or 3.3 V logic domains without level-shifting. Sector protection employs both persistent lock bits and password-based methods, with WP#/ACC serving dual roles: hardware write protection and VHH-accelerated programming during production.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	256 Mbit (32 MB) organized as 256 × 64 Kword uniform sectors
Access Time	110 ns random access (VCC = 2.7–3.6 V, VIO = 1.65–VCC); 25 ns page access
Write Buffer	32-word (64-byte) buffer enabling burst programming with 13.5 µs/word at VHH
Erase Endurance	100,000 program/erase cycles per sector - supports frequent firmware field updates
Data Retention	20 years at +85°C - ensures long-term reliability in industrial temperature environments
Supply Voltage	Single 3.0 V supply (2.7–3.6 V); VIO independently configurable from 1.65 V to VCC
Operating Temp	Industrial range: –40°C to +85°C - qualified for harsh embedded environments

Pinout & Package

Package: 64-ball Fortified Ball Grid Array (LAA064), 11 mm × 13 mm, 1.0 mm pitch, Pb-free (F), industrial temperature grade (I).

Pin/Terminal	Circuit Role	Design Meaning
A23–A0	Address Inputs	24-bit address bus supporting full 32 MB addressing (A23 = MSB)
DQ15–DQ0	Data I/O	16-bit bidirectional data bus; DQ15/A-1 multiplexed for byte-mode LSB address
CE#, OE#, WE#	Control Inputs	Standard chip/output/write enable signals for asynchronous parallel interface timing
RY/BY#	Status Output	Active-low open-drain ready/busy indicator synchronized to internal algorithm completion
WP#/ACC	Protection/Accel	Hardware sector lock when pulled low; enables VHH-accelerated programming when driven high
VIO	I/O Reference	Independent I/O voltage reference enabling mixed-voltage system interfacing
RESET#	Hardware Reset	Asynchronous active-low reset that terminates ongoing operations and returns to read mode

Key Features

Feature	Design Value
Secured Silicon Sector	128-word (256-byte) factory- or customer-programmable serial number region with permanent lock capability
Advanced Sector Protection	Dual-method protection: persistent lock bits + 16-byte password entry for secure firmware partitioning
Unlock Bypass Mode	Reduces single-word programming time by eliminating repeated unlock sequences during sequential writes
Automatic Sleep Mode	Enters ultra-low-power standby (<1 µA) after 100 µs of bus inactivity - reduces idle power in battery-backed systems
CFI Compliance	Provides standardized JEDEC JESD68 query table for automatic driver configuration in bootloader and OS environments

Applications

Industrial PLC Firmware Storage

Automotive Infotainment Boot Memory

Use Scenario: Storing firmware images and configuration parameters in programmable logic controllers deployed in factory automation lines.

IC Role / Device Role / Timing Role: Nonvolatile boot memory mapped to processor's address space; accessed during cold start and runtime firmware patching.

Use Value: 100,000 erase cycles and 20-year retention ensure reliable operation over 15+ year equipment lifecycles without field replacement.

Use Scenario: Hosting boot code and critical safety-critical firmware modules in head-unit ECUs with ASIL-B functional safety requirements.

IC Role / Device Role / Timing Role: Primary boot device providing deterministic <110 ns read latency to ARM Cortex-A cores during power-on initialization.

Use Value: Secured Silicon Sector enables unique ECU identification and cryptographic key binding; password protection prevents unauthorized firmware modification.

Medical Imaging System Configuration

Telecom Base Station Field Upgrade Storage

Use Scenario: Holding calibration tables, sensor profiles, and regulatory-compliant diagnostic routines in portable ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: Configurable nonvolatile storage accessed via parallel bus during device self-test and calibration sequence.

Use Value: VersatileI/O™ allows direct interface with 1.8 V FPGA configuration logic without external level shifters, reducing BOM count and board area.

Use Scenario: Storing field-upgradable protocol stacks and radio parameter sets in 4G/5G remote radio units operating in outdoor cabinets.

IC Role / Device Role / Timing Role: High-reliability update storage supporting over-the-air (OTA) firmware delivery with rollback capability.

Use Value: Write buffer programming (13.5 µs/word with VHH) cuts full-image update time by >4× versus standard byte programming - minimizing service downtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Page Flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256S11FFIV10	Same density and package, but uses 65 nm Eclipse process; 100K erase cycles, 20-year retention, 100 ns random access	Lacks Secured Silicon Sector and CFI compliance; no password protection	Select when lower cost and legacy design compatibility outweigh security and configurability needs
MX29GL256FHI-11G	256 Mbit, 110 ns access, 64-ball BGA, but requires separate VCC/VIO supplies and lacks VersatileI/O™ voltage flexibility	No secured silicon sector; only persistent sector lock (no password method)	Choose for designs already committed to Macronix ecosystem and where VIO independence is not required

Compared with S29GL256S11FFIV10 and MX29GL256FHI-11G, the S29GL256P11FFIV13 uniquely combines CFI compliance, dual-sector protection methods, and VersatileI/O™-enabling secure, mixed-voltage, auto-configurable flash deployment in next-generation industrial and automotive platforms.

Availability

S29GL256P11FFIV13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot memory, and medical imaging system configuration requiring stable component supply across extended product lifecycles.

Supply support for S29GL256P11FFIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer markets.

The S29GL-P series was designed specifically for embedded systems requiring robust, high-density parallel NOR Flash with advanced security, mixed-voltage interoperability, and field-upgrade resilience - targeting applications where boot integrity and long-term data retention are mission-critical.

FAQ

What is the function of the WP#/ACC pin on S29GL256P11FFIV13?

The WP#/ACC pin serves two distinct functions: when held low (VIL), it hardware-protects the highest or lowest sector from accidental program/erase; when driven to VHH (~11.5 V), it activates Accelerated Programming mode and automatically enters Unlock Bypass, reducing sequential word programming time by eliminating repeated unlock commands. Internal pull-up ensures safe default behavior when unconnected.

Does S29GL256P11FFIV13 support byte-wide data access?

Yes. The BYTE# input selects bus width: when pulled low, the device operates in byte mode with DQ0–DQ7 active and DQ15/A-1 repurposed as the LSB address line (A-1); when high, it operates in 16-bit word mode with DQ0–DQ15 active. This enables flexible integration with 8-bit microcontrollers or 16-bit processors without external glue logic.

How does the Secured Silicon Sector differ from standard flash sectors?

The Secured Silicon Sector is a dedicated 128-word (256-byte) region physically isolated from main array sectors. It contains an 8-word Electronic Serial Number (ESN) that can be factory- or customer-programmed and permanently locked. Unlike standard sectors, it cannot be erased or reprogrammed after locking, providing immutable device identity for anti-counterfeiting and secure key binding in certified systems.

Can S29GL256P11FFIV13 operate with VIO = 1.8 V while VCC = 3.3 V?

Yes. The VersatileI/O™ architecture explicitly supports VIO from 1.65 V to VCC, so VIO = 1.8 V and VCC = 3.3 V is a valid configuration. All address, control, and data I/O levels track VIO, allowing direct connection to 1.8 V FPGAs or ASICs while maintaining full 3.3 V core performance - verified in the datasheet's VersatileIO VIO operating range specifications.

S29GL256P11FFIV13 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-P

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 32M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 110ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL256P11FFIV13 FAQ

1.How can I place an order for S29GL256P11FFIV13 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256P11FFIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256P11FFIV13 reliable?

The price and inventory of S29GL256P11FFIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P11FFIV13 is usually 5 days.

3.What payment methods are accepted for S29GL256P11FFIV13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256P11FFIV13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256P11FFIV13?

S29GL256P11FFIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256P11FFIV13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256P11FFIV13?

For technical support, including S29GL256P11FFIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P11FFIV13 requirements.

6.How does Aetrix verify that S29GL256P11FFIV13 is sourced from the original manufacturer or authorized distributors?

All S29GL256P11FFIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P11FFIV13 meets industry standards.

7.What is the process for return or replacement of S29GL256P11FFIV13?

All S29GL256P11FFIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P11FFIV13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256P11FFIV13 part is unused and in its original packaging.

Return procedure for S29GL256P11FFIV13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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