My Inquiry
My Account
Infineon Technologies S29GL256P11FFIV22
- Part No.:
- S29GL256P11FFIV22
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256P11FFIV22.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,749
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL256P11FFIV22 from Cypress Semiconductor is a 256 Mbit (32 MB), 3.0 V-only page-mode NOR Flash memory fabricated on 90 nm MirrorBit process technology. It delivers 110 ns random access time and 25 ns page access time, features a 32-word/64-byte write buffer, uniform 64 Kword sectors (256 total), and supports CFI for host compatibility - deployed in industrial embedded systems requiring reliable nonvolatile storage with fast firmware updates.
For engineers reviewing the S29GL256P11FFIV22 datasheet, S29GL256P11FFIV22 pinout, S29GL256P11FFIV22 application, or S29GL256P11FFIV22 equivalent, key selection criteria include sector erase endurance (100,000 cycles), data retention (20 years), VersatileI/O™ voltage flexibility (VIO = 1.65–VCC), hardware reset (RESET#), and WP#/ACC dual-function pin behavior under VHH acceleration.
Technical Context
This device operates as a parallel-interface NOR Flash with byte/word configuration controlled by BYTE# input, supporting both standard and page read modes. Its architecture includes an integrated command register, state controller, and erase/program voltage generators enabling autonomous embedded algorithms.
It implements Advanced Sector Protection via persistent bits and password methods, plus a factory- or customer-programmable Secured Silicon Sector (128-word/256-byte) with electronic serial number. The RY/BY# output provides real-time status of active program/erase operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB) organized as 256 uniform 64 Kword sectors |
| Supply Voltage | Single 3.0 V operation (2.7–3.6 V); VIO independently configurable from 1.65 V to VCC |
| Access Time | 110 ns random access (Regulated VCC), 25 ns page access - enables fast instruction fetch in boot code execution |
| Write Buffer | 32-word (64-byte) buffer reduces multi-word programming time to 13.5 µs/word with VHH acceleration |
| Erase Endurance | 100,000 program/erase cycles per sector - suitable for field firmware update partitions |
| Data Retention | 20 years at +85°C - meets long-life requirements for industrial control and telecom infrastructure |
| Operating Temp | Industrial range: –40°C to +85°C - validated for extended thermal cycling in harsh environments |
Pinout & Package
Package: 64-ball Fortified BGA (LAA064), 11 × 13 mm, 1.0 mm pitch, Pb-free (F), industrial temperature grade (I).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A23–A0 | Address Inputs | 24-bit address bus (A23–A0) selects 16 MB word locations; A-1 multiplexed on DQ15 in byte mode |
| DQ15–DQ0 | Data I/O | 16-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode when BYTE# = VIL |
| CE#, OE#, WE# | Control Inputs | Standard parallel Flash control signals; CE# enables chip, OE# enables output drivers, WE# initiates write |
| WP#/ACC | Protection/Acceleration | At VIL: locks outermost sector; at VHH: enables unlock bypass mode and accelerates programming throughput |
| RY/BY# | Status Output | Active-low open-drain signal indicates ongoing program/erase (VIL) or completion (high-Z) |
| RESET# | Hardware Reset | Asynchronous active-low input that aborts operations and returns device to read array state |
| VIO | I/O Supply Reference | Defines logic thresholds for all inputs/outputs; decoupled from VCC to support mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| VersatileI/O™ Control | VIO pin sets input/output voltage thresholds independently from VCC (1.65–VCC), enabling seamless integration with 1.8 V or 3.3 V host buses |
| Write Buffer Programming | 32-word buffer cuts effective programming time by >60% vs. single-word writes - critical for rapid firmware patching |
| Secured Silicon Sector | 128-word factory- or customer-lockable region stores immutable electronic serial number and secure identifiers for anti-cloning |
| Advanced Sector Protection | Persistent lock bits and password-based protection prevent unauthorized firmware modification without physical access or valid credentials |
| Suspend/Resume Capability | Allows read access during erase or program operations - enables real-time diagnostics and interrupt-driven system responsiveness |
Applications
| Industrial PLC Firmware Storage | Telecom Base Station Boot Code |
|---|---|
|
Use Scenario: Nonvolatile storage of firmware images and configuration parameters in programmable logic controllers operating continuously in factory-floor environments. IC Role / Device Role / Timing Role: Primary boot memory mapped to processor address space; executes XIP (eXecute-In-Place) during cold start and supports in-field updates via background erase. Use Value: 20-year data retention and 100,000 erase cycles ensure firmware integrity across 15+ year product lifecycles without replacement. |
Use Scenario: Storing boot loader, FPGA configuration bitstreams, and radio protocol stacks in 4G/LTE base station remote radio units exposed to wide temperature swings. IC Role / Device Role / Timing Role: Parallel NOR Flash providing deterministic 110 ns read latency for fast boot initialization and secure sector locking for regulatory-compliant software partitioning. Use Value: WP#/ACC pin with VHH acceleration enables high-throughput field upgrades during maintenance windows without host CPU overhead. |
| Medical Imaging System Calibration Data | Automotive ADAS Camera Module |
|
Use Scenario: Retaining calibrated sensor offsets, gamma tables, and DICOM metadata in MRI and CT scanner subsystems requiring FDA-grade traceability. IC Role / Device Role / Timing Role: Secure, tamper-resistant memory partition using Secured Silicon Sector to store cryptographic keys and calibration fingerprints with factory-programmed ESN. Use Value: Customer-lockable secured sector prevents post-deployment reprogramming of calibration data - satisfies IEC 62304 software lifecycle requirements. |
Use Scenario: Storing camera ISP firmware and lens correction profiles in automotive surround-view systems operating at –40°C to +105°C junction temperature. IC Role / Device Role / Timing Role: Industrial-grade NOR Flash with –40°C to +85°C ambient rating and RESET#-driven recovery from brown-out events during vehicle ignition transients. Use Value: Hardware reset input ensures deterministic recovery from power glitches, while uniform sector architecture simplifies OTA update partitioning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX29GL256EHTI-90G | 90 nm process, 110 ns access, but lacks VersatileI/O™ - fixed 3.3 V I/O threshold; no VIO pin | Requires level-shifting in mixed-voltage designs; no VIO-based voltage scaling for low-power standby | Select when legacy 3.3 V-only interface is guaranteed and VIO flexibility is unnecessary |
| S29GL256S11FFIV20 | Same die, but 64-ball BGA with different model suffix (V20 = VIO = VCC = 2.7–3.6 V, lowest sector protected) | Identical timing and endurance; differs only in default WP#/ACC protection scope and marking | Choose for systems where lowest-address sector protection aligns with bootloader placement strategy |
Compared with MX29GL256EHTI-90G, S29GL256P11FFIV22 offers superior voltage adaptability and lower system-level BOM cost by eliminating external level shifters; versus S29GL256S11FFIV20, it provides highest-address sector protection - better suited for top-boot configurations in safety-critical firmware.
Availability
S29GL256P11FFIV22 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom base station boot code, medical imaging calibration data, and automotive ADAS camera modules requiring stable component supply across extended product lifecycles.
Supply support for S29GL256P11FFIV22 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-reliability memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
The S29GL-P series was designed specifically for embedded systems needing robust, pin-compatible NOR Flash with enhanced security, endurance, and flexible I/O voltage operation - targeting applications where firmware integrity and long-term data retention are mission-critical.
FAQ
What is the function of the VIO pin on S29GL256P11FFIV22?
The VIO pin sets the voltage reference for all input thresholds and output drive levels, allowing independent configuration from VCC across 1.65 V to VCC. This enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without external level shifters, reducing board complexity and power consumption in mixed-voltage systems.
Does S29GL256P11FFIV22 support execute-in-place (XIP) operation?
Yes - its parallel NOR architecture and 110 ns random access time enable direct code execution from flash memory without copying to RAM. The device supports standard read commands and maintains deterministic timing across the full industrial temperature range, making it suitable for boot ROM and real-time firmware execution in resource-constrained embedded systems.
How does the Secured Silicon Sector differ from standard flash sectors?
The Secured Silicon Sector is a dedicated 128-word (256-byte) region physically isolated from main array logic. It can be permanently locked at factory or by customer to store immutable identifiers like electronic serial numbers. Unlike standard sectors, it cannot be erased or rewritten once locked, providing hardware-enforced security against cloning or firmware tampering.
Can S29GL256P11FFIV22 be used in place of older S29GL256N devices?
No - S29GL256P uses a 90 nm MirrorBit process with different command sets, timing parameters, and protection mechanisms compared to the 110 nm S29GL256N. Key differences include VIO support, enhanced sector protection, and updated CFI query structure. Migration requires full firmware validation and may need PCB layout changes due to BGA ballout variations.
S29GL256P11FFIV22 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-P
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 110ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL256P11FFIV22 FAQ
1.How can I place an order for S29GL256P11FFIV22 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256P11FFIV22 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256P11FFIV22 reliable?
The price and inventory of S29GL256P11FFIV22 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P11FFIV22 is usually 5 days.
3.What payment methods are accepted for S29GL256P11FFIV22?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256P11FFIV22 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256P11FFIV22?
S29GL256P11FFIV22 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256P11FFIV22 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256P11FFIV22?
For technical support, including S29GL256P11FFIV22 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P11FFIV22 requirements.
6.How does Aetrix verify that S29GL256P11FFIV22 is sourced from the original manufacturer or authorized distributors?
All S29GL256P11FFIV22 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P11FFIV22 meets industry standards.
7.What is the process for return or replacement of S29GL256P11FFIV22?
All S29GL256P11FFIV22 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P11FFIV22, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256P11FFIV22 part is unused and in its original packaging.
Return procedure for S29GL256P11FFIV22:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256P11FFIV22 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
