Infineon Technologies S29GL256P11TAIV10
- Part No.:
- S29GL256P11TAIV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256P11TAIV10.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S29GL256P11TAIV10 from Cypress Semiconductor is a 256 Mbit (32 MB), 3.0 V-only page-mode NOR Flash memory fabricated on 90 nm MirrorBit process technology. It delivers 110 ns random access time and 25 ns page access time, features a 32-word/64-byte write buffer, uniform 64 Kword sectors (256 total), and supports CFI for standardized interface. It is used in industrial embedded systems requiring reliable nonvolatile storage with sector-level protection.
For engineers reviewing the S29GL256P11TAIV10 datasheet, S29GL256P11TAIV10 pinout, S29GL256P11TAIV10 application, or S29GL256P11TAIV10 equivalent, key selection criteria include VIO-compatible I/O voltage range (1.65–VCC), WP#/ACC acceleration support, Secured Silicon Sector with factory-programmable serial number, and industrial temperature rating (–40°C to +85°C).
Technical Context
This device operates in word (16-bit) or byte (8-bit) configuration via BYTE# input and uses VersatileI/O™ architecture where all signal levels are referenced to VIO (1.65–VCC), independent of VCC (2.7–3.6 V). It implements hardware reset (RESET#), ready/busy status (RY/BY#), and suspend/resume for program/erase operations.
It supports two advanced sector protection methods - persistent lock bits and password-based protection - and includes a dedicated Secured Silicon Sector (128-word/256-byte) with factory- or customer-lockable 8-word electronic serial number. Command execution follows JEDEC-standard sequences with unlock bypass mode for accelerated programming.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mbit (32 MB) organized as 256 uniform 64 Kword sectors |
| Access Time | 110 ns random access (Regulated VCC); 25 ns page access enables burst reads |
| Write Buffer | 32-word / 64-byte buffer reduces multi-word programming time to 15 µs/word (VCC) |
| Endurance | 100,000 erase cycles per sector ensures long-term field reliability |
| Data Retention | 20-year typical retention at +85°C supports industrial lifecycle requirements |
| Operating Temp | Industrial range: –40°C to +85°C confirmed by part suffix 'I' |
| VIO Range | 1.65 V to VCC enables mixed-voltage system interfacing without level shifters |
Pinout & Package
Package: 56-pin TSOP (Standard Thin Small Outline Package, TSO56), lead-free (Pb-free), industrial temperature grade.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A23–A0 | Address inputs | 24-bit address bus supporting full 32 MB addressing (A23 = MSB) |
| DQ15–DQ0 | Data I/O | 16-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard asynchronous NOR control signals for read/write/erase timing |
| BYTE# | Bus width select | VIL = byte mode (DQ0–DQ7 active); VIH = word mode (DQ0–DQ15 active) |
| WP#/ACC | Write protect / acceleration | VIL protects outermost sector; VHH enables unlock bypass for faster production programming |
| RY/BY# | Ready/Busy output | Active-low open-drain signal indicating ongoing program/erase operation |
| RESET# | Hardware reset | Asynchronous active-low reset returning device to read array state |
| VIO | Versatile I/O supply | Defines logic thresholds for all I/O pins independently of VCC |
Key Features
| Feature | Design Value |
|---|---|
| 90 nm MirrorBit Process | Enables higher density and lower power vs. older floating-gate technologies |
| Secured Silicon Sector | Factory- or customer-programmable 8-word serial number locked permanently for device authentication |
| Advanced Sector Protection | Persistent lock bits and password method prevent unauthorized firmware modification |
| Suspend/Resume | Allows read operations during background erase or program, improving system responsiveness |
| CFI Support | Enables automatic detection of device geometry and command set by host bootloader or OS |
Applications
| Industrial HMI Panels | Telecom Base Station Firmware |
|---|---|
Use Scenario: Nonvolatile storage for GUI assets, configuration profiles, and firmware updates in panel-mounted HMIs operating continuously in factory environments. IC Role / Device Role / Timing Role: Primary boot code and parameter storage with sector locking to prevent accidental overwrite of calibration data. Use Value: 100K erase cycles and 20-year retention ensure >10-year field life without refresh; WP#/ACC enables secure factory programming. | Use Scenario: Storing FPGA bitstreams, DSP firmware, and protocol stacks in LTE/5G remote radio units exposed to wide thermal swings. IC Role / Device Role / Timing Role: Dual-image flash storage supporting A/B firmware update schemes with atomic sector swap. Use Value: Suspend/resume capability allows real-time diagnostics during background firmware validation; VIO compatibility simplifies interface to 1.8 V FPGA I/O banks. |
| Railway Signaling Controllers | Medical Imaging Subsystems |
Use Scenario: Storing safety-critical bootloader and diagnostic logs in EN 5012x-certified signaling modules deployed outdoors across Europe. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage for certified firmware images and event history with write-protection on critical sectors. Use Value: Secured Silicon Sector provides traceable device identity; industrial temp rating ensures operation at –40°C ambient without derating. | Use Scenario: Holding DICOM metadata templates, calibration coefficients, and low-level sensor driver code in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: High-reliability code storage with fast page read (25 ns) enabling rapid image initialization sequences. Use Value: 110 ns random access meets tight boot timing budgets; uniform sector architecture simplifies deterministic firmware partitioning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S11TFIV10 | Same density and speed, but 64-ball Fortified BGA (LAA064) package instead of TSOP | Targeted at space-constrained PCBs with high I/O count; no mechanical compatibility with TSOP sockets | Select when board layout requires BGA footprint and thermal/mechanical stability outweighs rework complexity |
| MX29GL256FHI-11G | Micron equivalent; identical 256 Mbit density, 110 ns access, industrial temp, but lacks Secured Silicon Sector and VersatileI/O | Requires external level shifting for mixed-voltage designs; no factory-programmable serial number support | Choose for cost-sensitive applications where security and flexible I/O voltage are not required |
Compared with S29GL256S11TFIV10, this TSOP variant offers easier prototyping and rework; versus MX29GL256FHI-11G, it adds VIO flexibility and hardware-enforced device identity-critical for secure boot and regulatory traceability.
Availability
S29GL256P11TAIV10 is available at Aetrix Electronics and suitable for industrial HMI panels, telecom base station firmware storage, and railway signaling controllers requiring stable component supply across extended product lifecycles.
Supply support for S29GL256P11TAIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor, now part of Infineon Technologies, designs high-reliability nonvolatile memory and microcontroller solutions for industrial, automotive, and communications markets.
The S29GL-P series targets embedded systems needing robust, pin-compatible NOR Flash with enhanced security, mixed-voltage I/O, and long-term data integrity-especially where firmware authenticity and field upgrade safety are mandated.
FAQ
What is the function of the VIO pin on the S29GL256P11TAIV10?
VIO sets the reference voltage for all input thresholds and output drive levels, allowing the device to interface directly with 1.8 V, 2.5 V, or 3.3 V logic without external level shifters. It operates from 1.65 V to VCC (2.7–3.6 V), decoupling I/O signaling from core VCC supply variations.
Does the S29GL256P11TAIV10 support both word and byte addressing modes?
Yes. The BYTE# pin selects bus width: at VIH, the device operates in 16-bit word mode with DQ0–DQ15 active; at VIL, it switches to 8-bit byte mode where DQ0–DQ7 are active and DQ15/A-1 becomes the LSB address input (A-1), enabling flexible memory mapping.
How does the Secured Silicon Sector work, and can it be programmed in-system?
The Secured Silicon Sector is a dedicated 128-word region containing an 8-word electronic serial number. It can be programmed and permanently locked either at the factory or by the customer using standard command sequences. Once locked, contents are read-only and immune to erase commands.
What is the purpose of the WP#/ACC pin beyond write protection?
When driven to VHH (~11.5 V), WP#/ACC activates Acceleration mode, automatically placing the device in Unlock Bypass mode and reducing single-word programming time from 60 µs to 13.5 µs. This is used exclusively during high-throughput manufacturing programming, not in normal system operation.
S29GL256P11TAIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-P
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 110ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256P11TAIV10 FAQ
1.How can I place an order for S29GL256P11TAIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256P11TAIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256P11TAIV10 reliable?
The price and inventory of S29GL256P11TAIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P11TAIV10 is usually 5 days.
3.What payment methods are accepted for S29GL256P11TAIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256P11TAIV10 transactions.
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4.How is shipping managed for S29GL256P11TAIV10?
S29GL256P11TAIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256P11TAIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256P11TAIV10?
For technical support, including S29GL256P11TAIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P11TAIV10 requirements.
6.How does Aetrix verify that S29GL256P11TAIV10 is sourced from the original manufacturer or authorized distributors?
All S29GL256P11TAIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P11TAIV10 meets industry standards.
7.What is the process for return or replacement of S29GL256P11TAIV10?
All S29GL256P11TAIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P11TAIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256P11TAIV10 part is unused and in its original packaging.
Return procedure for S29GL256P11TAIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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