Infineon Technologies S29GL256P11TFI023
- Part No.:
- S29GL256P11TFI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256P11TFI023.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,520
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Product details
Overview
S29GL256P11TFI023 from Cypress Semiconductor is a 256 Mbit (32 MB), 3.0 V-only Page Flash memory fabricated on 90 nm MirrorBit process technology, featuring 256 uniform 128 KB sectors, 25 ns page access time, and 110 ns random access time under regulated VCC (3.0–3.6 V). It supports VersatileI/O™ with VIO range 1.65–VCC, 32-word write buffer, and Secured Silicon Sector with factory- or customer-programmable 256-byte serial ID - deployed in industrial-grade embedded controllers for firmware storage and boot code execution.
For engineers reviewing the S29GL256P11TFI023 datasheet, S29GL256P11TFI023 pinout, S29GL256P11TFI023 application, or S29GL256P11TFI023 equivalent, key selection criteria include sector erase endurance (100,000 cycles), 20-year data retention, CFI compliance, hardware reset (RESET#), and WP#/ACC dual-function pin behavior under VHH acceleration.
Technical Context
This device implements a synchronous/non-volatile page-mode architecture with dedicated X/Y decoders, on-chip voltage generators for erase/program, and state control logic managing command sequences including Autoselect, Suspend/Resume, and Unlock Bypass. Its VersatileI/O™ interface decouples I/O voltage (VIO) from core supply (VCC), enabling interoperability with 1.8 V, 2.5 V, or 3.3 V host buses while maintaining full 3.0 V internal operation.
The 56-pin TSOP package supports byte/word configuration via BYTE# input, with DQ15/A-1 serving as either data bit or LSB address. Sector protection uses persistent lock bits and password methods; RY/BY# provides real-time status of embedded algorithms, and WP#/ACC enables both hardware write protection and VHH-accelerated programming during production.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB) organized as 256 × 128 Kbyte uniform sectors |
| Page Access Time | 25 ns - enables high-speed sequential instruction fetch from flash pages |
| Random Access Time | 110 ns at regulated VCC (3.0–3.6 V) - determines worst-case single-word read latency |
| Write Buffer Capacity | 64 bytes (32 words) - reduces effective programming time for multi-word updates |
| Erase Endurance | 100,000 cycles per sector - supports field firmware updates over product lifetime |
| Data Retention | 20 years typical - ensures long-term reliability without refresh in power-off state |
| Operating Voltage | Single 3.0 V supply (2.7–3.6 V), with independent VIO (1.65–VCC) for I/O level flexibility |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), standard pinout (TSO56), industrial temperature range (–40°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A23–A0 | Address Inputs | 24-bit address bus supporting full 32 MB addressing space |
| DQ15–DQ0 | Data I/O (Word Mode) | 16-bit bidirectional data path; DQ15/A-1 functions as A-1 in byte mode |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard asynchronous control signals for memory access timing |
| BYTE# | Bus Width Select | VIL = byte mode (DQ0–DQ7 active); VIH = word mode (DQ0–DQ15 active) |
| WP#/ACC | Write Protect / Acceleration | VIL = protects outermost sector; VHH = enables unlock bypass and faster programming |
| RESET# | Hardware Reset | Active-low signal forcing device into read mode and aborting ongoing operations |
| RY/BY# | Ready/Busy Output | Open-drain output indicating algorithm progress (low = busy, high-Z = ready) |
| VIO | Versatile I/O Supply | Independent I/O voltage reference (1.65–VCC) enabling mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| 90 nm MirrorBit Process | Enables higher density and lower power vs. older floating-gate technologies |
| Secured Silicon Sector | 256-byte factory- or user-lockable region for permanent device identification |
| Suspend/Resume Commands | Allows interrupting erase/program operations to service higher-priority reads |
| CFI Compliance | Standardized software interrogation for automatic driver configuration and compatibility |
| Advanced Sector Protection | Combines persistent lock bits and password-based methods for flexible, secure firmware partitioning |
Applications
| Industrial PLC Firmware Storage | Automotive Infotainment Boot Memory |
|---|---|
|
Use Scenario: Storing firmware images and configuration data in programmable logic controllers operating continuously in harsh environments. IC Role / Device Role / Timing Role: Non-volatile boot and application code storage with guaranteed 20-year retention and 100K erase cycles. Use Value: Eliminates need for external EEPROM or battery-backed SRAM; supports field-upgradable firmware without hardware redesign. |
Use Scenario: Hosting boot loader and OS kernel for head-unit microcontrollers requiring fast, reliable startup after ignition. IC Role / Device Role / Timing Role: Primary boot memory with 25 ns page access enabling rapid instruction fetch during cold boot sequence. Use Value: Reduces boot time by >30% vs. standard NOR flash due to page-mode burst capability and CFI auto-configuration. |
| Medical Diagnostic Equipment BIOS | Network Router Configuration Storage |
|
Use Scenario: Holding safety-critical BIOS and calibration tables in portable ultrasound and ECG devices certified to IEC 62304. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with Secured Silicon Sector for unique device serialization and regulatory traceability. Use Value: Meets FDA design control requirements via locked 256-byte serial ID and hardware write protection on critical sectors. |
Use Scenario: Storing routing tables, ACLs, and firmware patches in enterprise-grade Layer 3 switches with zero-downtime update capability. IC Role / Device Role / Timing Role: Dual-bank configurable memory supporting background erase of inactive sector while executing from active bank. Use Value: Enables atomic firmware updates with no service interruption using suspend/resume and sector protection granularity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Page Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX29GL256FHI-90G | 90 nm process, same density and TSOP package, but lacks VersatileI/O™ and Secured Silicon Sector | No VIO flexibility or factory-programmable serial ID; requires external level-shifting for mixed-voltage systems | Select when cost sensitivity outweighs I/O voltage flexibility and secure ID requirements |
| S29GL256S11TFI020 | Same Cypress family, 65 nm Eclipse process, 110 ns access, but only 64-ball BGA packaging (no TSOP) | Requires PCB redesign for BGA footprint; offers lower power and improved thermal performance | Select when board space constraints favor BGA and thermal management is prioritized over legacy TSOP compatibility |
Compared with MX29GL256FHI-90G and S29GL256S11TFI020, the S29GL256P11TFI023 uniquely balances TSOP compatibility, VersatileI/O™ adaptability, and Secured Silicon security - making it optimal for industrial designs requiring drop-in upgrade paths and regulatory traceability without package change.
Availability
S29GL256P11TFI023 is available at Aetrix Electronics and suitable for industrial automation, automotive infotainment, and medical diagnostics requiring stable component supply, long-term lifecycle support, and guaranteed obsolescence management.
Supply support for S29GL256P11TFI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer markets.
The S29GL-P series was designed specifically for embedded systems demanding robust, high-density NOR flash with advanced security, flexible I/O, and production-ready features like WP#/ACC acceleration and CFI interoperability.
FAQ
What is the function of the WP#/ACC pin in normal operation?
The WP#/ACC pin serves dual roles: at VIH (3.0 V), it enables standard write protection for the highest or lowest sector depending on model number; at VHH (12 V), it activates unlock bypass mode and accelerates programming throughput by ~25%. Internal pull-up ensures default VIH state when unconnected, preventing accidental writes during power-up.
Does S29GL256P11TFI023 support byte-level writes?
No - this device only supports word (16-bit) or byte (8-bit) data width selection via BYTE#, but all programming occurs in minimum 64-byte write buffer increments. Single-word programming is possible but not optimized; effective programming speed is maximized using the full 32-word buffer with proper command sequencing.
How does the Secured Silicon Sector differ from standard flash sectors?
The Secured Silicon Sector is a dedicated 256-byte region physically isolated from main array, accessible only through specific command sequences. Once locked (factory or user), its contents become permanently read-only and immune to bulk erase commands - providing cryptographically verifiable device identity essential for anti-counterfeiting and regulatory compliance.
Can RY/BY# be used for interrupt-driven firmware updates?
Yes - RY/BY# is an open-drain output that pulls low during active program/erase operations and floats high-Z when complete. It can directly drive a microcontroller's external interrupt pin, enabling non-polling, deterministic timing for background firmware patching without CPU overhead or timer dependencies.
S29GL256P11TFI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-P
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 110ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256P11TFI023 FAQ
1.How can I place an order for S29GL256P11TFI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256P11TFI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256P11TFI023 reliable?
The price and inventory of S29GL256P11TFI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P11TFI023 is usually 5 days.
3.What payment methods are accepted for S29GL256P11TFI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256P11TFI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256P11TFI023?
S29GL256P11TFI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256P11TFI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256P11TFI023?
For technical support, including S29GL256P11TFI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P11TFI023 requirements.
6.How does Aetrix verify that S29GL256P11TFI023 is sourced from the original manufacturer or authorized distributors?
All S29GL256P11TFI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P11TFI023 meets industry standards.
7.What is the process for return or replacement of S29GL256P11TFI023?
All S29GL256P11TFI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P11TFI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256P11TFI023 part is unused and in its original packaging.
Return procedure for S29GL256P11TFI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256P11TFI023 Tags

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