Infineon Technologies S29GL256P11TFIV13
- Part No.:
- S29GL256P11TFIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256P11TFIV13.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,702
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Product details
Overview
S29GL256P11TFIV13 from Cypress Semiconductor is a 256 Mbit (32 MB), 3.0 V-only Page Flash memory fabricated on 90 nm MirrorBit process technology, featuring 256 uniform 128 KB sectors, 25 ns page access time, and 110 ns random access time at regulated VCC. It supports VersatileI/O™ with VIO range 1.65–VCC, 32-word write buffer, and Secured Silicon Sector for factory- or customer-programmable 256-byte serial ID - deployed in industrial embedded controllers requiring nonvolatile firmware storage with sector-level protection.
For engineers reviewing the S29GL256P11TFIV13 datasheet, S29GL256P11TFIV13 pinout, S29GL256P11TFIV13 application, or S29GL256P11TFIV13 equivalent, key selection criteria include 110 ns random access timing under industrial temperature (–40°C to +85°C), TSOP-56 package compatibility, CFI-compliant interface, WP#/ACC dual-function pin behavior, and persistent/password-based Advanced Sector Protection implementation.
Technical Context
This device implements a synchronous command-set architecture with dedicated state control logic, erase voltage generator, and PGM voltage generator enabling embedded erase and program algorithms. It uses a hierarchical X/Y decoder structure with sector switches and data Y-gating to manage 256 independent 64 Kword sectors, each rated for 100,000 erase cycles and 20-year data retention.
VersatileI/O™ decouples I/O voltage (VIO) from core supply (VCC), allowing DQ, address, and control signal levels to scale from 1.65 V to VCC while maintaining full functionality across 2.7–3.6 V VCC range. The RY/BY# output provides real-time status of active Embedded Algorithms, and RESET# enables hardware-initiated return to read mode without power cycle.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB) organized as 256 × 64 Kword sectors = 256 × 128 KB |
| Access Time (tACC) | 110 ns typical at regulated VCC (3.0–3.6 V), defining maximum clock-to-data latency in random read |
| Page Access Time (tPACC) | 25 ns typical, enabling burst reads of up to 8 words per page with minimal latency overhead |
| Write Buffer Capacity | 32 words (64 bytes) per single program command, reducing effective programming time by >2× vs. single-word writes |
| Endurance & Retention | 100,000 erase/program cycles per sector; 20-year data retention at Tj ≤ +85°C |
| Supply Voltage Range | VCC = 2.7–3.6 V; VIO = 1.65–VCC - supports mixed-voltage system interfacing without level shifters |
| Operating Temperature | Industrial grade: –40°C to +85°C ambient, validated for continuous operation in embedded control environments |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), standard pinout (TSO56), body size 18.4 mm × 10.16 mm × 1.2 mm, lead pitch 0.5 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A23–A0 | Address Inputs | 24-bit address bus supporting full 32 MB addressing; A23 is MSB for 256 Mbit density |
| DQ15–DQ0 | Data I/O (Word Mode) | 16-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode when BYTE# = VIL |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard asynchronous SRAM-compatible control signals; all active-low, fully decoded internally |
| RY/BY# | Ready/Busy Output | Open-drain output indicating algorithm progress: low = active erase/program, high-Z = ready |
| WP#/ACC | Write Protect / Acceleration Input | VIL = protects top/bottom sector; VHH = enables unlock bypass mode and accelerates programming throughput |
| RESET# | Hardware Reset Input | Asynchronous active-low reset that terminates ongoing operations and restores read mode immediately |
| VIO | Versatile I/O Supply | Independent voltage reference for all I/O pins; sets logic thresholds without affecting core VCC domain |
Key Features
| Feature | Design Value |
|---|---|
| Uniform Sector Architecture | 256 identical 128 KB sectors enable deterministic firmware partitioning and field-upgrade safety |
| Secured Silicon Sector | 256-byte factory- or user-lockable region stores immutable electronic serial number for device authentication |
| Advanced Sector Protection | Persistent lock bits and password-based software unprotection allow selective, secure sector write inhibition |
| Suspend/Resume Capability | Interrupts active erase or program operations to service higher-priority reads, then resumes without data loss |
| CFI Compliance | Common Flash Interface support enables automatic detection and configuration by host boot ROM or flash utilities |
Applications
| Industrial PLC Firmware Storage | Automotive Body Control Module (BCM) |
|---|---|
|
Use Scenario: Storing firmware and calibration tables in programmable logic controllers operating in harsh factory environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Nonvolatile code storage with sector-level write protection to prevent accidental corruption during field updates. Use Value: 100,000-cycle endurance and –40°C to +85°C operation ensure reliable reprogramming over 10+ years of industrial deployment. |
Use Scenario: Holding boot code and configuration data in automotive BCMs where firmware integrity must survive battery brownouts and ESD events. IC Role / Device Role / Timing Role: Primary boot flash with hardware-accelerated programming (via WP#/ACC at VHH) for rapid manufacturing flash-in-system. Use Value: 25 ns page access enables fast instruction fetch during cold start; secured silicon sector binds firmware to unique vehicle VIN. |
| Medical Diagnostic Equipment Boot Memory | Network Router Configuration Storage |
|
Use Scenario: Storing certified diagnostic firmware and regulatory compliance data in Class II medical devices requiring traceable, tamper-resistant storage. IC Role / Device Role / Timing Role: Secure, long-retention flash with password-protected sector locking to meet IEC 62304 software lifecycle requirements. Use Value: 20-year data retention and factory-lockable serial number provide audit-ready device identity and firmware lineage tracking. |
Use Scenario: Holding startup configuration, routing tables, and failover images in enterprise-grade routers subject to frequent remote updates. IC Role / Device Role / Timing Role: High-reliability configuration store with suspend/resume capability to avoid interrupting packet forwarding during flash updates. Use Value: 32-word write buffer reduces update window by >70% vs. legacy parallel flash, minimizing service disruption during maintenance windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Page Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX29GL256EHTI-90G | 90 nm process, 110 ns tACC, but lacks VersatileI/O™ - fixed 3.3 V I/O only; no VIO pin | Requires external level shifting in mixed-voltage systems; no VIO flexibility for 1.8 V host interfaces | Select when cost sensitivity outweighs I/O voltage flexibility and VIO is unused in target design |
| S29GL256S11TFIV10 | Same die, but 100 ns tACC (slower), same TSOP-56 package and industrial temp rating | Lower performance margin for high-speed boot sequences; identical protection and security features | Select when 110 ns timing headroom is unnecessary and lower-cost binning is available |
Compared with MX29GL256EHTI-90G, S29GL256P11TFIV13 offers true mixed-signal I/O scaling via VIO, eliminating level shifters; versus S29GL256S11TFIV10, it delivers 10 ns faster random access for time-critical boot paths - both alternatives retain identical sector architecture and security model.
Availability
S29GL256P11TFIV13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive BCM boot memory, medical diagnostic equipment boot memory, and network router configuration storage requiring stable component supply across extended product lifecycles.
Supply support for S29GL256P11TFIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability nonvolatile memory and microcontroller solutions for industrial, automotive, and communications infrastructure markets.
The S29GL-P family targets embedded systems needing robust, pin-compatible flash upgrades with enhanced I/O flexibility and security - specifically engineered for firmware storage in mission-critical applications where data integrity and long-term availability are mandatory.
FAQ
What is the function of the VIO pin on S29GL256P11TFIV13?
The VIO pin sets the input/output voltage threshold for all address, control, and data pins (A0–A23, CE#, OE#, WE#, DQ0–DQ15). It operates independently from VCC and ranges from 1.65 V to VCC, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without external level shifters - a key differentiator from legacy parallel flash devices.
How does the Secured Silicon Sector work in practice?
The Secured Silicon Sector is a dedicated 256-byte region containing an 8-word (16-byte) Electronic Serial Number pre-programmed at the factory. Customers can permanently lock this region using a specific command sequence, preventing overwrite while retaining read access. Once locked, the serial number becomes immutable and serves as a hardware root-of-trust for device authentication and firmware binding.
Can S29GL256P11TFIV13 be used in place of older S29GL256N devices?
No - S29GL256P11TFIV13 is not pin- or command-compatible with the S29GL256N generation. The 'P' series introduces VersatileI/O™, updated CFI tables, revised command sequences (e.g., unlock bypass), and tighter AC timing. Migration requires PCB layout changes (VIO addition), firmware driver updates, and validation of all erase/program flow timing margins.
What happens when RESET# is asserted during an erase operation?
Asserting RESET# during an erase operation forces immediate termination of the embedded algorithm, clears internal state machines, and returns the device to reading array data mode. The sector being erased remains in an undefined state and must be verified and re-erased before programming - no automatic recovery or rollback occurs, making RESET# a last-resort abort mechanism.
S29GL256P11TFIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-P
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 110ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256P11TFIV13 FAQ
1.How can I place an order for S29GL256P11TFIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256P11TFIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256P11TFIV13 reliable?
The price and inventory of S29GL256P11TFIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P11TFIV13 is usually 5 days.
3.What payment methods are accepted for S29GL256P11TFIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256P11TFIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256P11TFIV13?
S29GL256P11TFIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256P11TFIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256P11TFIV13?
For technical support, including S29GL256P11TFIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P11TFIV13 requirements.
6.How does Aetrix verify that S29GL256P11TFIV13 is sourced from the original manufacturer or authorized distributors?
All S29GL256P11TFIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P11TFIV13 meets industry standards.
7.What is the process for return or replacement of S29GL256P11TFIV13?
All S29GL256P11TFIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P11TFIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256P11TFIV13 part is unused and in its original packaging.
Return procedure for S29GL256P11TFIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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