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Infineon Technologies S29GL256P11TFIV23

Part No.:
S29GL256P11TFIV23
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
56-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixS29GL256P11TFIV23.pdf
Description:
IC FLASH 256MBIT PARALLEL 56TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,857

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Product details

Overview

S29GL256P11TFIV23 from Cypress Semiconductor is a 256 Mbit (32 MB) 3.0 V-only Page Mode Flash memory IC fabricated on 90 nm MirrorBit process technology, featuring 256 uniform 64 Kword (128 Kbyte) sectors, 25 ns page access time, and 32-word write buffer for accelerated multi-word programming. It operates across industrial temperature range (–40°C to +85°C), supports VersatileI/O™ with VIO = 1.65–VCC, and is packaged in 56-pin TSOP for embedded boot code and firmware storage applications.

For engineers reviewing the S29GL256P11TFIV23 datasheet, S29GL256P11TFIV23 pinout, S29GL256P11TFIV23 application, or S29GL256P11TFIV23 equivalent, key selection criteria include sector architecture uniformity, VIO voltage flexibility, WP#/ACC dual-function pin behavior, Ready/Busy# status signaling, and CFI-compliant interface compatibility in space-constrained industrial control systems.

Technical Context

This device implements a synchronous/asynchronous hybrid command-set architecture with dedicated state control logic, erase voltage generator, and PGM voltage generator enabling embedded erase and program algorithms. Its block diagram integrates X/Y decoders, sector switches, and data gating aligned to a 23-bit address bus (A22–A0), supporting both word (DQ0–DQ15) and byte (DQ0–DQ7 + DQ15/A-1) configurations via BYTE# input.

The VersatileI/O™ control scheme decouples I/O voltage (VIO) from core supply (VCC), allowing interface level translation between 1.65 V and VCC (2.7–3.6 V); RY/BY# provides open-drain status feedback during active erase/program cycles, while RESET# enables hardware-initiated return to read mode without power cycle.

Key Specifications

ParameterValue and Actual Design Meaning
Density256 Mbit (32 MB) organized as 256 × 64 Kword sectors
Page Access Time25 ns - enables fast sequential instruction fetch from boot ROM regions
Write Buffer Size32 words (64 bytes) - reduces effective programming time by >4× vs single-word writes
Erase Endurance100,000 cycles per sector - supports field firmware updates over product lifetime
Data Retention20 years typical - ensures long-term reliability in unpowered storage
VIO Range1.65 V to VCC - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers
Operating Temp–40°C to +85°C - qualified for industrial-grade embedded systems
Supply Voltage2.7–3.6 V single VCC - eliminates need for separate I/O rail in 3 V designs

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP), standard pinout (TSO56), body size 18.4 mm × 10.16 mm × 1.2 mm.

Pin/TerminalCircuit RoleDesign Meaning
A22–A0Address inputs23-bit address bus for full 256 Mbit addressing (A22 MSB)
DQ15–DQ0Data I/O (word mode)16-bit bidirectional data path; DQ15/A-1 serves as LSB address in byte mode
CE#, OE#, WE#Chip/Output/Write EnableStandard asynchronous control trio; CE# enables device, OE# gates output drivers
BYTE#Bus width selectVIL = byte mode (DQ0–DQ7 active); VIH = word mode (DQ0–DQ15 active)
WP#/ACCWrite protect / accelerationVIL = protects top/bottom sector; VHH = enables unlock bypass for faster production programming
RY/BY#Ready/Busy statusOpen-drain output low during erase/program; high-Z when operation complete
RESET#Hardware resetActive-low signal forcing immediate return to read array mode
VIOVersatile I/O supplyIndependent voltage reference for all address/control/data I/O levels

Key Features

FeatureDesign Value
Uniform Sector Architecture256 identical 64 Kword sectors simplify firmware partitioning and OTA update management
Secured Silicon Sector128-word factory-programmable serial number region with lock capability for device authentication
Advanced Sector ProtectionPersistent bits + password method enable flexible, non-volatile sector lockdown against accidental overwrite
Suspend/Resume CommandsAllows interrupting erase/program operations to service higher-priority reads - critical for real-time OS environments
CFI SupportCommon Flash Interface compliance enables automatic detection and configuration by bootloader software

Applications

Industrial PLC Firmware StorageAutomotive ECU Boot Memory

Use Scenario: Nonvolatile storage of ladder logic programs and configuration parameters in programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Primary boot ROM and firmware update repository accessed at power-on and during field reprogramming cycles.

Use Value: 20-year data retention and 100K erase cycles ensure reliable operation across 15+ year equipment lifecycles without refresh.

Use Scenario: Storing calibrated engine control maps and diagnostic firmware in automotive powertrain ECUs requiring AEC-Q100 alignment.

IC Role / Device Role / Timing Role: Standalone flash memory mapped into microcontroller address space for secure, deterministic boot sequence execution.

Use Value: Industrial temperature rating (–40°C to +85°C) and VIO flexibility support direct interface with 1.8 V CAN controller I/O domains.

Medical Imaging System BIOSNetwork Router Boot Image

Use Scenario: Holding safety-critical initialization code and calibration constants for MRI and CT scanner subsystems subject to strict regulatory traceability.

IC Role / Device Role / Timing Role: Secure, tamper-resistant boot memory with Secured Silicon Sector used for unique device serialization and audit logging.

Use Value: Factory-lockable 256-byte serial number region meets FDA UDI requirements for permanent device identification.

Use Scenario: Hosting compressed Linux kernel and initramfs images in carrier-grade edge routers requiring rapid, fail-safe firmware recovery.

IC Role / Device Role / Timing Role: High-speed page-mode flash serving as primary boot device for MIPS/ARM SoCs with parallel NOR interface.

Use Value: 25 ns page access time enables sub-100 ms boot latency; write buffer accelerates remote firmware patch deployment.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Page Mode Flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL256S11TFIV20Same density and package, but uses 65 nm Eclipse process; slightly lower standby current (0.5 µA vs 1 µA)Lacks Secured Silicon Sector and CFI support; not suitable for secure boot or auto-configuration use casesSelect only if lowest power in sleep mode is critical and security features are unnecessary
MX29GL256FHI-90GMacronix equivalent; same 256 Mbit, 56-pin TSOP, 90 ns random access; no VersatileI/O™ or WP#/ACC accelerationRequires fixed 3.3 V I/O; lacks VIO flexibility and hardware programming acceleration for high-volume manufacturingPrefer when cost sensitivity outweighs VIO adaptability and production throughput requirements

Compared with S29GL256S11TFIV20 and MX29GL256FHI-90G, the S29GL256P11TFIV23 uniquely combines industrial temperature tolerance, VersatileI/O™ voltage scaling, and Secured Silicon Sector - making it the only choice for secure, field-upgradable embedded systems requiring mixed-voltage interoperability and long-term data integrity.

Availability

S29GL256P11TFIV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, and medical imaging system BIOS requiring stable component supply and long-lifecycle support.

Supply support for S29GL256P11TFIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer markets.

The S29GL-P series was designed specifically for embedded systems requiring robust, high-density parallel NOR flash with advanced protection, secure identity, and flexible I/O voltage operation - targeting boot code, firmware, and configuration storage in mission-critical applications.

FAQ

What is the function of the WP#/ACC pin on S29GL256P11TFIV23?

The WP#/ACC pin serves two distinct roles: at VIL, it protects the highest or lowest address sector from accidental program/erase; at VHH (12 V), it enables Unlock Bypass Program mode, accelerating production programming throughput by eliminating command overhead per word. Internal pull-up ensures safe default VIH state when unconnected.

Does S29GL256P11TFIV23 support byte-wide data access?

Yes - the BYTE# input selects bus width: at VIL, the device operates in byte mode with DQ0–DQ7 active and DQ15/A-1 repurposed as LSB address; at VIH, it operates in word mode with full 16-bit DQ0–DQ15 data path. This enables compatibility with both 8-bit and 16-bit host processors without external glue logic.

How does the Secured Silicon Sector work in practice?

The Secured Silicon Sector is a dedicated 128-word (256-byte) region that can be factory-programmed with a unique Electronic Serial Number (ESN) and permanently locked. Once locked, its contents cannot be altered or read back, providing immutable device identity for anti-counterfeiting, license enforcement, or regulatory traceability in medical and industrial systems.

Can S29GL256P11TFIV23 be used in a 1.8 V I/O system?

Yes - with VIO supplied at 1.8 V and VCC at 2.7–3.6 V, all address, control, and data signals operate at 1.8 V logic levels per VersatileI/O™ specification. This allows direct connection to 1.8 V microcontrollers without level shifters, while maintaining full 256 Mbit density and 25 ns page access performance.

S29GL256P11TFIV23 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-P
Package/Case:
56-TFSOP (0.724", 18.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
110ns
Access Time:
110 ns
Voltage - Supply:
1.65V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSOP

S29GL256P11TFIV23 FAQ

1.How can I place an order for S29GL256P11TFIV23 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256P11TFIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256P11TFIV23 reliable?

The price and inventory of S29GL256P11TFIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P11TFIV23 is usually 5 days.

3.What payment methods are accepted for S29GL256P11TFIV23?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256P11TFIV23 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256P11TFIV23?

S29GL256P11TFIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256P11TFIV23 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256P11TFIV23?

For technical support, including S29GL256P11TFIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P11TFIV23 requirements.

6.How does Aetrix verify that S29GL256P11TFIV23 is sourced from the original manufacturer or authorized distributors?

All S29GL256P11TFIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P11TFIV23 meets industry standards.

7.What is the process for return or replacement of S29GL256P11TFIV23?

All S29GL256P11TFIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P11TFIV23, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256P11TFIV23 part is unused and in its original packaging.

Return procedure for S29GL256P11TFIV23:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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