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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256P90FFCR10

Name: S29GL256P90FFCR10
Brand: Infineon Technologies
SKU: S29GL256P90FFCR10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256P90FFCR10

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256P90FFCR10.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL256P90FFCR10 from Cypress Semiconductor is a 256 Mbit (32 MB), 3.0 V-only page-mode NOR Flash memory fabricated on 90 nm MirrorBit process technology, featuring 90 ns random access time, 25 ns page access time, uniform 64 Kword sectors (256 total), and 100,000 erase cycles per sector - deployed in industrial embedded systems for firmware storage and boot code execution.

For engineers reviewing the S29GL256P90FFCR10 datasheet, S29GL256P90FFCR10 pinout, S29GL256P90FFCR10 application, or S29GL256P90FFCR10 equivalent, key selection criteria include VIO-compatible I/O voltage scaling (1.65–VCC), write buffer programming efficiency (64-byte burst), secured silicon sector with factory-programmable ESN, and CFI-compliant interface for host BIOS/UEFI compatibility.

Technical Context

This device operates as a parallel-interface NOR Flash with byte/word configuration selectable via BYTE# input, supporting both standard and page read modes (8-word buffer), and embedded program/erase algorithms managed by internal state control logic and command register sequencing.

It implements VersatileI/O™ architecture where all address, control, and data signal thresholds are referenced to VIO (1.65–VCC), enabling interoperability with mixed-voltage microcontrollers; sector protection uses persistent bits and password methods, while WP#/ACC provides hardware acceleration (VHH) and outermost sector lock independent of software settings.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mbit (32 MB) organized as 256 × 64 Kword uniform sectors
Access Time	90 ns random access (Regulated VCC), 25 ns page access - enables fast instruction fetch in boot ROM applications
Write Buffer	64-byte (32-word) buffer - reduces effective programming time by >4× vs single-word writes
Erase Endurance	100,000 cycles per sector - supports field firmware updates over product lifetime
Data Retention	20 years typical - ensures long-term reliability in unpowered storage
VIO Range	1.65 V to VCC - allows direct interfacing with 1.8 V or 3.3 V host I/O without level shifters
Operating Temp	–40°C to +85°C (Industrial grade) - qualified for automotive and industrial control environments

Pinout & Package

Package: 64-ball Fortified BGA (LAA064), 11 mm × 13 mm, 1.0 mm pitch, Pb-free (RoHS compliant).

Pin/Terminal	Circuit Role	Design Meaning
A23–A0	Address inputs	24-bit address bus supporting full 32 MB addressing (A23 = MSB)
DQ15–DQ0	Data I/O	16-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode
CE#, OE#, WE#	Chip/Output/Write Enable	Standard parallel Flash control signals; enable hierarchical access timing
RY/BY#	Ready/Busy output	Active-low open-drain status indicator for embedded program/erase completion
RESET#	Hardware reset	Asynchronous reset that terminates ongoing operations and returns device to read mode
WP#/ACC	Write protect / acceleration	VIL locks top/bottom sector; VHH enables unlock-bypass programming for production throughput
VIO	Versatile I/O supply	Defines input threshold and output drive levels - decouples I/O voltage from VCC
BYTE#	Bus width select	VIL configures 8-bit DQ0–DQ7 operation; VIH enables full 16-bit word mode

Key Features

Feature	Design Value
Secured Silicon Sector	256-byte factory-lockable region with 16-byte electronic serial number - enables secure device identity binding
Suspend/Resume	Interrupts active program/erase to service high-priority reads - critical for real-time OS coexistence
CFI Support	Standardized JEDEC JESD68 interface - enables automatic detection and configuration by BIOS/bootloader
Advanced Sector Protection	Password + persistent bit methods - prevents accidental or malicious firmware corruption
Automatic Sleep Mode	Enters ultra-low-power standby (<1 µA) after bus inactivity - reduces system idle power

Applications

Industrial PLC Firmware Storage

Automotive Instrument Cluster Boot Memory

Use Scenario: Storing firmware and configuration data in programmable logic controllers operating in harsh factory environments with wide temperature swings and electrical noise.

IC Role / Device Role / Timing Role: Primary nonvolatile boot and application code storage with deterministic 90 ns read latency for real-time task scheduling.

Use Value: 20-year data retention and 100K erase cycles ensure firmware update viability across 15+ year product lifecycles without replacement.

Use Scenario: Hosting boot code and display graphics assets in digital instrument clusters requiring ASIL-B compatible nonvolatile storage.

IC Role / Device Role / Timing Role: CFI-compliant NOR Flash providing verified, executable-in-place (XIP) code execution directly from memory.

Use Value: Industrial temperature rating (–40°C to +85°C) and secured silicon sector support cryptographic key binding for secure boot validation.

Medical Diagnostic Equipment BIOS

Network Router Boot Image Storage

Use Scenario: Holding UEFI-compliant BIOS and calibration tables in portable ultrasound and imaging devices subject to strict regulatory traceability requirements.

IC Role / Device Role / Timing Role: Trusted, tamper-resistant firmware repository with factory-programmed ESN for audit-ready device identification.

Use Value: Secured Silicon Sector allows permanent embedding of unique device ID and calibration signatures - meeting FDA 21 CFR Part 11 compliance needs.

Use Scenario: Storing primary and fallback boot images in enterprise-grade routers requiring rapid failover and field-upgradable firmware.

IC Role / Device Role / Timing Role: Dual-image storage medium with hardware-accelerated (VHH) programming for <5 s firmware update cycles.

Use Value: Write buffer programming (13.5 µs/word with VHH) cuts full-image reflash time by 70% versus legacy parallel Flash devices.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256S90TFI01	TSOP-56 package (vs BGA); identical 90 nm MirrorBit core, same timing and feature set	Preferred for through-hole prototyping or legacy PCB designs with TSOP footprints	Select when board layout lacks BGA rework capability or requires manual soldering accessibility
MX29GL256FHI-90G	Macronix equivalent; 90 nm process, 90 ns access, but no VersatileI/O (fixed 3.3 V I/O), no secured silicon sector	Lacks VIO flexibility and secure identity features - unsuitable for secure boot or mixed-voltage hosts	Choose only for cost-sensitive, non-secure applications where VIO and ESN are not required

Compared with S29GL256S90TFI01, the FFCR10 offers superior board-level density and thermal performance in BGA; versus MX29GL256FHI-90G, it delivers essential security and voltage-scaling capabilities missing in the Macronix part - making it the sole choice for certified industrial and automotive deployments.

Availability

S29GL256P90FFCR10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical diagnostic equipment BIOS requiring stable component supply across extended product lifecycles.

Supply support for S29GL256P90FFCR10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-reliability memory, microcontrollers, and connectivity solutions for industrial, automotive, and computing markets.

The S29GL-P series was designed specifically for embedded systems demanding robust, executable-in-place NOR Flash with advanced security, mixed-voltage interoperability, and long-term data integrity - targeting mission-critical boot and firmware storage.

FAQ

What is the function of the VIO pin on the S29GL256P90FFCR10?

VIO sets the voltage reference for all input thresholds and output drive levels, allowing the device to interface directly with host processors operating at 1.8 V, 2.5 V, or 3.3 V I/O voltages while VCC remains at 3.0–3.6 V. This eliminates external level shifters and simplifies mixed-voltage system design without compromising timing or signal integrity.

Does the S29GL256P90FFCR10 support execute-in-place (XIP) operation?

Yes - its parallel NOR architecture, deterministic 90 ns random access time, and CFI-compliant interface enable direct code execution from flash memory without copying to RAM. This is confirmed by Cypress application notes AN215155 and AN92197, which detail XIP implementation with ARM Cortex-M and PowerPC processors.

How is the secured silicon sector programmed and locked?

The 256-byte secured silicon sector is programmed using standard command sequences (e.g., unlock bypass + program commands) and permanently locked via the Lock Register (address 0x0000). Once locked, the sector becomes read-only and immune to erase or program commands - verified by Cypress's Secure Silicon Programming Flow documentation (AN215154).

Can the S29GL256P90FFCR10 be used in place of older S29GL256N devices?

No - the S29GL256P uses 90 nm MirrorBit process and enhanced VersatileI/O, while the S29GL256N is based on 110 nm technology with fixed 3.3 V I/O and no VIO pin. Pinouts differ (e.g., VIO replaces NC on P-series), and command sets are incompatible due to added features like suspend/resume and advanced protection modes.

S29GL256P90FFCR10 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-P

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 32M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 90ns

Access Time:: 90 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: 0°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL256P90FFCR10 FAQ

1.How can I place an order for S29GL256P90FFCR10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256P90FFCR10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256P90FFCR10 reliable?

The price and inventory of S29GL256P90FFCR10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P90FFCR10 is usually 5 days.

3.What payment methods are accepted for S29GL256P90FFCR10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256P90FFCR10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256P90FFCR10?

S29GL256P90FFCR10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256P90FFCR10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256P90FFCR10?

For technical support, including S29GL256P90FFCR10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P90FFCR10 requirements.

6.How does Aetrix verify that S29GL256P90FFCR10 is sourced from the original manufacturer or authorized distributors?

All S29GL256P90FFCR10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P90FFCR10 meets industry standards.

7.What is the process for return or replacement of S29GL256P90FFCR10?

All S29GL256P90FFCR10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P90FFCR10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256P90FFCR10 part is unused and in its original packaging.

Return procedure for S29GL256P90FFCR10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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