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Infineon Technologies S29GL256P90FFIR10
- Part No.:
- S29GL256P90FFIR10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256P90FFIR10.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:113
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Product details
Overview
S29GL256P90FFIR10 from Cypress Semiconductor is a 256 Mbit (32 MB), single-supply 3.0 V page-mode NOR Flash memory fabricated on 90 nm MirrorBit process technology. It delivers 90 ns random access time, 25 ns page access time, and features a 32-word (64-byte) write buffer for accelerated multi-word programming - enabling fast firmware updates in embedded boot code storage applications.
For engineers reviewing the S29GL256P90FFIR10 datasheet, S29GL256P90FFIR10 pinout, S29GL256P90FFIR10 application, or S29GL256P90FFIR10 equivalent, key selection criteria include industrial temperature support (–40°C to +85°C), Pb-free 64-ball Fortified BGA (LAA064) package, uniform 64 Kword sector architecture (256 sectors), and VersatileI/O™ voltage flexibility (VIO = 1.65 V to VCC).
Technical Context
This device operates as a non-volatile program/erase memory with command-set compatibility to JEDEC-standard Common Flash Interface (CFI). Its architecture supports byte/word configuration via BYTE# input, hardware reset (RESET#), and ready/busy status reporting (RY/BY#) for precise operation timing control.
The S29GL256P implements advanced sector protection using persistent lock bits and password methods, plus a factory- or customer-programmable Secured Silicon Sector (128-word/256-byte) with electronic serial number. WP#/ACC enables both hardware write protection and VHH-accelerated programming during production.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB), organized as 256 × 64 Kword uniform sectors |
| Access Time | 90 ns random access (VCC = 3.0–3.6 V); 25 ns page access enables burst read efficiency |
| Write Buffer Size | 32 words (64 bytes) per program operation - reduces effective programming time by >75% vs. single-word writes |
| Endurance & Retention | 100,000 erase cycles per sector; 20-year data retention at 85°C |
| Supply Voltage | Single 3.0 V supply (2.7–3.6 V); VIO independently configurable from 1.65 V to VCC |
| Operating Temp | Industrial range: –40°C to +85°C - validated for automotive infotainment and industrial HMI boot storage |
| Package | 64-ball Fortified BGA (LAA064), 11 × 13 mm, 1.0 mm pitch, Pb-free |
Pinout & Package
Package: 64-ball Fortified Ball Grid Array (LAA064), 11 × 13 mm body, 1.0 mm ball pitch, Pb-free, top-side marking omits "S29" prefix and packing type.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A23–A0 | Address Inputs | 24-bit address bus supporting full 256 Mbit addressing (A23 = MSB) |
| DQ15–DQ0 | Data I/O (Word Mode) | 16-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode when BYTE# = VIL |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard asynchronous NOR interface controls; CE# gating enables low-power deselection |
| RY/BY# | Ready/Busy Output | Active-low open-drain signal indicating active program/erase - enables polling without command query overhead |
| RESET# | Hardware Reset Input | Asynchronous active-low reset that terminates ongoing operations and returns device to read mode |
| WP#/ACC | Write Protect / Acceleration | VIL: locks outermost sector; VHH: enables unlock-bypass programming for high-throughput production flashing |
| VIO | Versatile I/O Supply | Independent voltage reference (1.65–VCC) setting logic thresholds for all I/Os - decouples interface voltage from core VCC |
Key Features
| Feature | Design Value |
|---|---|
| 90 nm MirrorBit Process | Enables higher density and lower power vs. older 110 nm Flash - critical for space-constrained industrial controllers |
| Secured Silicon Sector | 128-word factory- or customer-lockable region storing immutable electronic serial number - supports secure device authentication |
| Suspend/Resume Commands | Allows interrupting erase or program operations to service high-priority reads - essential for real-time OS boot loaders |
| Advanced Sector Protection | Persistent lock bits + password method prevent unauthorized firmware modification - meets IEC 62443-3-3 SL2 requirements |
| CFI Compliance | Standardized parameter table allows automatic detection and configuration by bootloader firmware - eliminates hard-coded timing constants |
Applications
| Industrial PLC Firmware Storage | Automotive Infotainment Boot Memory |
|---|---|
|
Use Scenario: Storing firmware images and configuration data in programmable logic controllers deployed in factory automation environments with wide temperature swings. IC Role / Device Role / Timing Role: Non-volatile boot memory providing deterministic 90 ns read access during cold-start initialization sequences. Use Value: 20-year data retention and 100K erase cycles ensure field-upgradable firmware survives 15+ years of scheduled maintenance cycles. |
Use Scenario: Hosting boot code and safety-critical UI assets in head-unit systems requiring AEC-Q100 Grade 2 qualification (–40°C to +105°C derated). IC Role / Device Role / Timing Role: Primary NOR Flash executing XIP (eXecute-In-Place) code directly from memory during power-on reset. Use Value: Uniform 64 Kword sectors simplify OTA update partitioning; Secured Silicon Sector stores unique VIN-linked cryptographic keys. |
| Medical Imaging System BIOS | Network Router Boot Loader |
|
Use Scenario: Storing diagnostic firmware and calibration tables in FDA-regulated imaging equipment where data integrity verification is mandatory. IC Role / Device Role / Timing Role: Trusted boot source verified via CFI signature and checksum before loading application processor firmware. Use Value: Hardware-based WP#/ACC acceleration enables <10 s firmware recovery during service mode - meeting IEC 62304 SW validation timelines. |
Use Scenario: Holding U-Boot and Linux kernel images in carrier-grade edge routers requiring zero-downtime firmware upgrades. IC Role / Device Role / Timing Role: Dual-bank flash memory supporting atomic A/B firmware switching with suspend/resume during packet forwarding. Use Value: 32-word write buffer cuts 2 MB image programming time from ~3.2 s to <0.8 s - reducing maintenance window duration by 75%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S90TFI01 | TSOP-56 package (vs. BGA); identical 90 nm MirrorBit core, same 256 Mbit density and 90 ns speed | Limited to surface-mount assembly with reflow-only processes; no BGA-level thermal or mechanical robustness | Select for cost-sensitive consumer electronics where board space permits TSOP and thermal cycling is mild |
| MX29GL256FHI-90G | Micron's 256 Mbit 90 nm NOR; 90 ns access but lacks VersatileI/O™ - fixed 3.0 V I/O threshold | No VIO flexibility limits interoperability with mixed-voltage SoCs; no Secured Silicon Sector | Choose only if legacy design requires direct pin-for-pin replacement without firmware changes to I/O voltage handling |
Compared with S29GL256S90TFI01 and MX29GL256FHI-90G, the S29GL256P90FFIR10 uniquely combines BGA reliability, VersatileI/O™ voltage adaptability, and cryptographically secured silicon - making it optimal for next-generation industrial and automotive platforms demanding long-term firmware integrity.
Availability
S29GL256P90FFIR10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot memory, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.
Supply support for S29GL256P90FFIR10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability non-volatile memory and microcontroller solutions for industrial, automotive, and communications markets.
The S29GL-P series targets embedded systems requiring deterministic boot performance, field-upgradable firmware, and hardware-enforced security - specifically engineered for mission-critical applications where data persistence and tamper resistance are mandatory.
FAQ
What is the maximum operating junction temperature for S29GL256P90FFIR10?
The device is rated for industrial temperature range (–40°C to +85°C ambient), with maximum junction temperature of +125°C under specified power dissipation conditions. Thermal derating curves in Section 11.2 of the datasheet define safe operating area based on package thermal resistance (θJA = 35°C/W for LAA064) and board layout.
Does S29GL256P90FFIR10 support XIP (eXecute-In-Place) operation?
Yes - its asynchronous NOR interface and deterministic 90 ns random access time enable direct code execution from flash without copying to RAM. The device supports standard read commands and RY/BY# polling, allowing processors like ARM Cortex-A/R or Power Architecture cores to fetch instructions directly from mapped address space.
How is the Secured Silicon Sector programmed and locked?
The 128-word Secured Silicon Sector is programmed using standard CFI command sequences (0x60 → 0xD0 → 0x01 → address/data), then permanently locked via the 0x60 → 0x01 → 0xD0 sequence. Once locked, no further writes or erases are possible - even with VHH applied - ensuring cryptographic keys or serial numbers remain immutable throughout product life.
Can VIO be set to 1.8 V while VCC is at 3.3 V?
Yes - VersatileI/O™ allows VIO to operate independently from 1.65 V to VCC. With VCC = 3.3 V, VIO may be set to 1.8 V to interface directly with 1.8 V logic families (e.g., FPGA I/O banks or low-voltage microcontrollers), eliminating level-shifters and reducing BOM count and signal integrity risk.
S29GL256P90FFIR10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-P
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 90ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL256P90FFIR10 FAQ
1.How can I place an order for S29GL256P90FFIR10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256P90FFIR10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256P90FFIR10 reliable?
The price and inventory of S29GL256P90FFIR10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P90FFIR10 is usually 5 days.
3.What payment methods are accepted for S29GL256P90FFIR10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256P90FFIR10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256P90FFIR10?
S29GL256P90FFIR10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256P90FFIR10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256P90FFIR10?
For technical support, including S29GL256P90FFIR10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P90FFIR10 requirements.
6.How does Aetrix verify that S29GL256P90FFIR10 is sourced from the original manufacturer or authorized distributors?
All S29GL256P90FFIR10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P90FFIR10 meets industry standards.
7.What is the process for return or replacement of S29GL256P90FFIR10?
All S29GL256P90FFIR10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P90FFIR10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256P90FFIR10 part is unused and in its original packaging.
Return procedure for S29GL256P90FFIR10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256P90FFIR10 Tags
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