Infineon Technologies S29GL256P90TFIR13
- Part No.:
- S29GL256P90TFIR13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256P90TFIR13.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:960
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Product details
Overview
S29GL256P90TFIR13 from Cypress Semiconductor is a 256 Mbit (32 MB), 3.0 V-only Page Flash memory IC fabricated on 90 nm MirrorBit process technology, featuring 25 ns page access time, 90 ns random access time, and uniform 64 Kword (128 KB) sector architecture with 256 sectors. It supports VersatileI/O™ (VIO = 1.65–VCC), 32-word write buffer programming, and Secured Silicon Sector with 128-word electronic serial number for secure device identification in embedded boot code storage.
For engineers reviewing the S29GL256P90TFIR13 datasheet, S29GL256P90TFIR13 pinout, S29GL256P90TFIR13 application, or S29GL256P90TFIR13 equivalent, key selection considerations include industrial temperature range (–40°C to +85°C), TSOP-56 package compatibility, CFI compliance, hardware reset (RESET#), and WP#/ACC dual-function pin for sector protection and VHH-accelerated programming.
Technical Context
This device implements a synchronous/non-volatile memory architecture with dedicated X/Y decoders, erase/program voltage generators, and state control logic enabling concurrent suspend/resume of program and erase operations. Its VersatileI/O™ interface decouples I/O voltage (VIO) from core supply (VCC), supporting mixed-voltage system interfacing across 1.65–3.6 V ranges while maintaining full read/write functionality.
The 32-word write buffer enables burst programming of up to 64 bytes per command, reducing effective per-word programming time to 13.5 µs under VHH acceleration. Sector erase time is fixed at 0.5 s per 64 Kword sector, with 100,000 erase cycles endurance and 20-year data retention-validated under industrial operating conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB) organized as 256 × 64 Kword sectors |
| Access Time | 90 ns random access; 25 ns page access - enables fast instruction fetch in boot ROM applications |
| Supply Voltage | VCC = 2.7–3.6 V; VIO = 1.65–VCC - supports flexible I/O voltage scaling in mixed-signal SoC interfaces |
| Write Buffer Size | 32 words (64 bytes) - reduces firmware update latency by minimizing command overhead per programming operation |
| Erase Endurance | 100,000 cycles per sector - suitable for field-upgradable firmware with frequent patch deployments |
| Data Retention | 20 years at +85°C - ensures long-term reliability in unattended industrial controllers |
| Operating Temp | –40°C to +85°C (Industrial grade) - validated for use in automotive body control modules and factory automation PLCs |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-II, standard pinout, Pb-free). Dimensions: 18.4 mm × 10.16 mm × 1.2 mm (JEDEC MO-141AC).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A23–A0 | Address Inputs | 24-bit address bus (A23–A0); A23 selects highest sector; byte/word mode determined by BYTE# |
| DQ15–DQ0 | Data I/O | 16-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode when BYTE# = VIL |
| CE#, OE#, WE# | Control Inputs | Standard chip/output/write enable signals; support asynchronous read and buffered write timing |
| WP#/ACC | Multi-function Input | At VIL: protects first/last sector; at VHH: enables unlock bypass mode for accelerated programming |
| RESET# | Hardware Reset | Active-low signal that terminates ongoing program/erase and returns device to read mode |
| RY/BY# | Status Output | Open-drain ready/busy indicator - low during active algorithm execution, high-Z when complete |
| VIO | I/O Supply | Independent I/O voltage reference (1.65–VCC); sets input thresholds and output drive levels |
Key Features
| Feature | Design Value |
|---|---|
| Uniform Sector Architecture | 256 identical 64 Kword sectors simplify firmware partitioning and OTA update management |
| Secured Silicon Sector | 128-word factory- or customer-programmable region with lockable ESN for anti-cloning and device authentication |
| Suspend/Resume Support | Allows interruption of erase or program operations to service high-priority reads - critical for real-time OS boot loaders |
| CFI Compliance | Enables automatic detection and configuration by host BIOS/UEFI firmware without hard-coded timing parameters |
| Advanced Sector Protection | Persistent bits + password method allow granular, non-volatile locking of individual sectors against accidental overwrite |
Applications
| Automotive Body Control Module | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and calibration tables in vehicle door modules requiring ASIL-B compatible non-volatile memory. IC Role / Device Role / Timing Role: Primary boot ROM with deterministic 90 ns read access and hardware reset recovery for fail-safe startup. Use Value: 20-year data retention and –40°C to +85°C operation ensure functional safety compliance over full vehicle lifecycle. | Use Scenario: Holding firmware images and configuration data in programmable logic controllers deployed in factory-floor environments. IC Role / Device Role / Timing Role: Field-upgradable flash storage with 100,000 erase cycles and suspend/resume capability for zero-downtime updates. Use Value: Write buffer programming cuts firmware patch time by >60% vs. single-word writes, improving maintenance efficiency. |
| Medical Diagnostic Imaging Boot Memory | Network Router Bootloader Storage |
Use Scenario: Hosting secure bootloader and cryptographic keys in FDA-cleared imaging equipment where tamper resistance is mandated. IC Role / Device Role / Timing Role: Secured Silicon Sector provides locked 256-byte identity region; CFI interface enables auto-negotiated initialization. Use Value: Factory-programmable ESN and persistent sector lock prevent unauthorized firmware replacement and cloning. | Use Scenario: Storing U-Boot and kernel images in carrier-grade edge routers requiring rapid, reliable reboots after remote updates. IC Role / Device Role / Timing Role: High-speed 25 ns page read accelerates boot sequence; RY/BY# signal synchronizes host CPU polling. Use Value: VersatileI/O™ allows direct connection to 1.8 V or 3.3 V SoC buses without level shifters, reducing BOM cost and board area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Page Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S90TFIR13 | Same density and speed, but uses 65 nm Eclipse process; lower standby current (100 nA vs. 1 µA) | Lacks Secured Silicon Sector; no factory-programmable ESN or customer-lockable identity region | Select when ultra-low power sleep mode is prioritized over secure device identity features |
| MX29GL256FHT2I-90G | Macronix equivalent; same TSOP-56 package, 90 ns speed, and 256 Mbit density; supports CFI v1.3 | Does not implement VersatileI/O™ - VIO tied to VCC; no WP#/ACC acceleration mode | Choose when design uses fixed 3.3 V I/O and does not require VIO scaling or VHH programming acceleration |
Compared with S29GL256S90TFIR13, the original offers secure identity and higher standby current tolerance; versus MX29GL256FHT2I-90G, it delivers flexible I/O voltage handling and faster production programming via ACC mode-critical for high-volume manufacturing test flows.
Availability
S29GL256P90TFIR13 is available at Aetrix Electronics and suitable for automotive body control modules, industrial PLC firmware storage, and medical diagnostic imaging boot memory requiring stable component supply across extended temperature and long-lifecycle programs.
Supply support for S29GL256P90TFIR13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability non-volatile memory and microcontroller solutions for automotive, industrial, and communications markets.
The S29GL-P series targets embedded systems requiring robust, field-upgradable flash memory with secure identity, industrial temperature resilience, and CFI-standardized firmware integration-optimized for boot code, configuration storage, and firmware patching.
FAQ
What is the function of the WP#/ACC pin on S29GL256P90TFIR13?
The WP#/ACC pin serves two distinct roles: at VIL, it protects the first or last sector from program/erase operations regardless of software protection settings; when driven to VHH (12 V), it enables unlock bypass mode, accelerating programming throughput by eliminating command overhead between write buffer loads. This dual functionality supports both security and high-volume manufacturing requirements.
Does S29GL256P90TFIR13 support byte-wide data access?
Yes, byte-wide access is supported via the BYTE# input: when pulled low, DQ0–DQ7 become active data lines and DQ15/A-1 functions as the LSB address input. The device retains full 16-bit word mode capability when BYTE# is high, allowing seamless integration into both 8-bit and 16-bit microcontroller buses without external glue logic.
How does the Secured Silicon Sector enhance system security?
The Secured Silicon Sector provides a dedicated 128-word (256-byte) region that can be factory- or customer-programmed with a unique electronic serial number (ESN). Once locked, this region becomes permanently read-only and immune to erase commands, enabling hardware-rooted device authentication, license enforcement, and anti-counterfeiting in regulated applications such as medical and industrial control systems.
Can S29GL256P90TFIR13 operate with VIO = 1.8 V while VCC = 3.3 V?
Yes, the VersatileI/O™ architecture explicitly supports VIO = 1.65–VCC. With VCC = 3.3 V, VIO may be set to 1.8 V, configuring all address, control, and data pins to recognize 1.8 V logic thresholds and drive 1.8 V-compatible outputs. This eliminates external level shifters when interfacing with low-voltage SoCs or FPGAs, simplifying PCB layout and reducing system power.
S29GL256P90TFIR13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-P
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 90ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256P90TFIR13 FAQ
1.How can I place an order for S29GL256P90TFIR13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256P90TFIR13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256P90TFIR13 reliable?
The price and inventory of S29GL256P90TFIR13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256P90TFIR13 is usually 5 days.
3.What payment methods are accepted for S29GL256P90TFIR13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256P90TFIR13 transactions.
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4.How is shipping managed for S29GL256P90TFIR13?
S29GL256P90TFIR13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256P90TFIR13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256P90TFIR13?
For technical support, including S29GL256P90TFIR13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256P90TFIR13 requirements.
6.How does Aetrix verify that S29GL256P90TFIR13 is sourced from the original manufacturer or authorized distributors?
All S29GL256P90TFIR13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256P90TFIR13 meets industry standards.
7.What is the process for return or replacement of S29GL256P90TFIR13?
All S29GL256P90TFIR13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256P90TFIR13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256P90TFIR13 part is unused and in its original packaging.
Return procedure for S29GL256P90TFIR13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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