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Infineon Technologies S29GL256S10DHA020
- Part No.:
- S29GL256S10DHA020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S10DHA020.pdf
- Description:
- IC FLASH 256MBIT CFI 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,802
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Product details
Overview
S29GL256S10DHA020 from Infineon is a 256 Mb (32 MB), 16-bit parallel MIRRORBIT™ Eclipse flash memory IC with 3.0 V core supply, 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across –40°C to +85°C (industrial grade) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.
For engineers reviewing the S29GL256S10DHA020 datasheet, S29GL256S10DHA020 pinout, S29GL256S10DHA020 application, or S29GL256S10DHA020 equivalent, key selection criteria include its 512-byte programming buffer, Versatile I/O (1.65 V to VCC), CFI compliance, OTP array with dual lockable regions, and support for suspend/resume during program/erase operations.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard random reads and 32-byte page-mode reads. Its embedded algorithm controller (EAC) handles all program/erase sequences autonomously, including automatic ECC generation and verification during write cycles.
The flash uses 65 nm MIRRORBIT™ Eclipse technology with split-gate cells, enabling 100,000 program/erase cycles and 20-year data retention. Sector protection includes volatile and non-volatile modes per 128-kbyte sector, plus a dedicated 1024-byte OTP array with two independently lockable regions for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full boot image storage for mid-range microcontrollers |
| Random Access Time | 90 ns at VCC = VIO; enables direct XIP execution without wait states in most Cortex-M7 systems |
| Page Access Time | 15 ns; allows rapid sequential reads within 32-byte aligned pages for firmware loop acceleration |
| Programming Buffer | 512 bytes; reduces effective programming time by batching up to 256 words per command |
| ECC Support | Internal hardware single-bit correction; eliminates need for external ECC logic in safety-critical boot loaders |
| Operating Voltage | VCC = 2.7–3.6 V, VIO = 1.65–VCC; simplifies power design with independent I/O rail flexibility |
| Endurance & Retention | 100,000 cycles / 20 years; validated for industrial lifecycle requirements in field-deployed gateways |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit word address bus; A23 is MSB for 256 Mb density (2^24 × 16 bits) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes via WE# and byte enable control |
| CE# | Chip enable | Active-low chip select; controls device power state and enables read/write access |
| OE# | Output enable | Active-low output control; gates DQ outputs during read without affecting internal state |
| WE# | Write enable | Active-low write strobe; latches address/data on rising edge for program/erase commands |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; low during embedded program/erase, high when ready |
| RESET# | Hardware reset | Active-low asynchronous reset; aborts ongoing operations and returns to read mode |
| WP# | Write protect | Active-low hardware sector protection override; disables program/erase when asserted |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns cycle time improves firmware fetch bandwidth over standard NOR |
| Embedded Algorithm Controller | On-die state machine executes full program/erase sequences without host CPU intervention |
| Advanced Sector Protection | Volatile and non-volatile locking per 128-kbyte sector prevents accidental firmware overwrite in production |
| Secure OTP Array | 1024-byte one-time-programmable region with two lockable zones for keys or calibration data |
| Common Flash Interface | CFI-compliant parameter table enables automatic driver detection and configuration in U-Boot/Linux |
Applications
| Industrial HMI Boot Storage | Automotive ECU Firmware |
|---|---|
Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers with field-upgrade capability. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency. Use Value: Eliminates external SRAM buffering and reduces BOM count by enabling direct execution from flash. | Use Scenario: Holding calibrated engine control parameters and fail-safe firmware images in AEC-Q100 grade 3 ECUs. IC Role / Device Role / Timing Role: Automotive-grade flash memory with 100,000-cycle endurance and –40°C to +85°C operation. Use Value: Meets ISO 26262 ASIL-B functional safety requirements via hardware ECC and sector lock granularity. |
| Network Router Configuration | Medical Imaging Device BIOS |
Use Scenario: Storing startup configuration, TLS certificates, and firmware update payloads in carrier-grade edge routers. IC Role / Device Role / Timing Role: Secure, field-upgradable storage with OTP-protected cryptographic keys and CFI-based driver portability. Use Value: Enables secure remote updates without exposing sensitive keys to software stack vulnerabilities. | Use Scenario: Hosting diagnostic BIOS and regulatory-compliant boot firmware in FDA-cleared imaging equipment. IC Role / Device Role / Timing Role: High-reliability flash with 20-year data retention and hardware write protection for audit-trail integrity. Use Value: Supports long product lifecycles and satisfies IEC 62304 traceability requirements for firmware versioning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFI010 | Same density and timing, but 64-ball LAE FBGA (9 mm × 9 mm); no TSOP option | Preferred for space-constrained PCBs where footprint reduction outweighs manual soldering complexity | Select when board area is critical and reflow capability supports fine-pitch BGA |
| MX29GL256FHT2I-90G | Macronix part; 90 ns access, but lacks hardware ECC and OTP array; requires external error handling | Suitable for cost-sensitive consumer devices where ECC is managed in software | Choose only if firmware stack already implements SW ECC and no secure key storage is needed |
Compared with S29GL256P10TFI010, this TSOP variant offers easier prototyping and repair; versus MX29GL256FHT2I-90G, it delivers higher system-level reliability through integrated ECC and secure OTP-critical for industrial and medical deployments.
Availability
S29GL256S10DHA020 is available at Aetrix Electronics and suitable for industrial HMI boot storage, automotive ECU firmware, and medical imaging device BIOS requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S10DHA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-S family targets high-reliability embedded systems needing fast XIP-capable flash with robust data integrity features-including hardware ECC, sector protection, and secure OTP-for boot code and firmware storage.
FAQ
What is the maximum operating temperature range for S29GL256S10DHA020?
This part is rated for industrial temperature range: –40°C to +85°C. It does not support the +105°C industrial-plus or AEC-Q100 grade 2 automotive variants. The suffix "DHA" explicitly denotes the industrial-grade TSOP package with this thermal specification.
Does S29GL256S10DHA020 support byte-level writes?
No. It is a 16-bit wide device that only accepts word-aligned (16-bit) writes. Byte writes require external logic or software masking; the device does not implement internal byte-write emulation. All program operations target full 16-bit words using A0–A23 address lines.
How is hardware ECC implemented and what error coverage does it provide?
ECC is handled entirely in hardware during each program operation: a 6-bit syndrome is generated and stored alongside each 16-bit word. On read, the syndrome is checked and single-bit errors are corrected transparently. It does not detect or correct multi-bit errors, nor does it report correction events externally.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP array is permanently programmable once. Each of its two lockable regions can be individually locked via dedicated commands; after locking, no further writes are possible to that region. Unlocking is not supported-locking is irreversible and hardware-enforced.
S29GL256S10DHA020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S10DHA020 FAQ
1.How can I place an order for S29GL256S10DHA020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10DHA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10DHA020 reliable?
The price and inventory of S29GL256S10DHA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHA020 is usually 5 days.
3.What payment methods are accepted for S29GL256S10DHA020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHA020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10DHA020?
S29GL256S10DHA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10DHA020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10DHA020?
For technical support, including S29GL256S10DHA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHA020 requirements.
6.How does Aetrix verify that S29GL256S10DHA020 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10DHA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHA020 meets industry standards.
7.What is the process for return or replacement of S29GL256S10DHA020?
All S29GL256S10DHA020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHA020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10DHA020 part is unused and in its original packaging.
Return procedure for S29GL256S10DHA020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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